| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/20/1997 | DE19637458A1 Verfahren zur Herstellung eines Zwischenschichtisolationsfilms einer Halbleitervorrichtung A process for preparing an interlayer insulation film of a semiconductor device |
| 03/20/1997 | DE19601203A1 Data carrier card incorporating semiconductor chip |
| 03/19/1997 | EP0763894A2 Semiconductor device controllable by field effect with several temperature sensors |
| 03/19/1997 | EP0763853A1 Improvements in or relating to integrated circuits |
| 03/19/1997 | EP0763852A2 Housing for a power semiconductor module |
| 03/19/1997 | EP0487640B1 Capacitor laminate for printed circuit board |
| 03/19/1997 | CN1145693A Silicon nitride circuit substrate |
| 03/18/1997 | US5613189 Boron carbide additive; high strength, hardness, lightweight; bicycle frames |
| 03/18/1997 | US5613181 Co-sintered surface metallization for pin-join, wire-bond and chip attach |
| 03/18/1997 | US5613033 Laminated module for stacking integrated circuits |
| 03/18/1997 | US5612853 Package for a power semiconductor device |
| 03/18/1997 | US5612677 System to monitor the temperature of an integrated circuit and to dissipate heat generated thereby |
| 03/18/1997 | US5612657 Electrical device |
| 03/18/1997 | US5612576 Self-opening vent hole in an overmolded semiconductor device |
| 03/18/1997 | US5612575 Method of connecting the output pads on an integrated circuit chip, and multichip module thus obtained |
| 03/18/1997 | US5612574 Semiconductor structures using high-dielectric-constant materials and an adhesion layer |
| 03/18/1997 | US5612573 Electronic package with multilevel connections |
| 03/18/1997 | US5612572 Semiconductor device with an insulation groove |
| 03/18/1997 | US5612569 Semiconductor device |
| 03/18/1997 | US5612557 Semiconductor device having an inter-layer insulating film disposed between two wiring layers |
| 03/18/1997 | US5612556 Monolithic integration of microwave silicon devices and low loss transmission lines |
| 03/18/1997 | US5612514 For providing electronic/support connections for integrated circuits |
| 03/18/1997 | US5612513 Article and method of manufacturing an enclosed electrical circuit using an encapsulant |
| 03/18/1997 | US5612511 Double-sided electrical interconnect flexible circuit for ink-jet hard copy systems |
| 03/18/1997 | US5612403 Low temperature flexible die attach adhesive and articles using same |
| 03/18/1997 | US5612260 Oxidation of silicon carbide to form silicon dioxide |
| 03/18/1997 | US5612259 Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame |
| 03/18/1997 | US5612257 Method of making flip-chip microwave integrated circuit |
| 03/18/1997 | US5612254 Methods of forming an interconnect on a semiconductor substrate |
| 03/18/1997 | US5612253 Method for forming ordered titanium nitride and titanium silicide upon a semiconductor wafer using a three-step anneal process |
| 03/18/1997 | US5612252 Integrated circuits with low current density, metal contacts and apertures for electromagnetic migration |
| 03/18/1997 | US5612236 Method of forming a silicon semiconductor device using doping during deposition of polysilicon |
| 03/18/1997 | US5612121 Copper conductive particles with silver particles |
| 03/18/1997 | US5611876 Method of making a multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
| 03/18/1997 | US5611855 Method for manufacturing a calibration wafer having a microdefect-free layer of a precisely predetermined depth |
| 03/18/1997 | US5611698 Surface mounting IC socket |
| 03/18/1997 | US5611481 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
| 03/18/1997 | US5611393 Clamping heat sink |
| 03/18/1997 | US5611214 Microcomponent sheet architecture |
| 03/18/1997 | US5611140 Method of forming electrically conductive polymer interconnects on electrical substrates |
| 03/13/1997 | WO1997009739A1 Solder deposit support |
| 03/13/1997 | DE19636735A1 Prodn. of multilayered circuit substrate |
| 03/13/1997 | DE19629090A1 High power bipolar transistor, e.g. HBT, for handling HF signal |
| 03/13/1997 | DE19533298A1 Electronic module with power components |
| 03/13/1997 | DE19533169A1 Lotdepotträger Solder deposit |
| 03/13/1997 | DE19532992A1 Single sided electronic component mounting conductor plate device, e.g. surface mounted device |
| 03/12/1997 | EP0762817A1 Shielding for flat assemblies |
| 03/12/1997 | EP0762811A1 Encapsulated electronic circuit having micro components and process for dismounting such a circuit |
| 03/12/1997 | EP0762800A2 Lead frame for electroacoustic transducer and electroacoustic transducer |
| 03/12/1997 | EP0762678A2 Laser communication system with temperature controlled transmitter |
| 03/12/1997 | EP0762498A2 Fuse window with controlled fuse oxide thickness |
| 03/12/1997 | EP0762497A1 Tape carrier package structure with reinforced outer leads |
| 03/12/1997 | EP0762496A2 Semiconductor power module |
| 03/12/1997 | EP0762495A2 Thermal interface for a heat sink of a plurality of integrated circuits mounted on a substrate |
| 03/12/1997 | EP0762494A1 Silicon semiconductor diode, its circuit module and structure with an insulation body and preparation method thereof |
| 03/12/1997 | EP0762492A1 Semiconductor device manufacturing method |
| 03/12/1997 | EP0761831A1 Thin gold alloy wire for bonding |
| 03/12/1997 | EP0761723A2 Liquid organopolysiloxane resins, process for their preparation and low viscous polydiorganosiloxane compositions and their use |
| 03/12/1997 | EP0761017A1 Semiconductor device of the type sealed in glass having a silver-copper bonding layer between slugs and connection conductors |
| 03/12/1997 | EP0761015A1 Semiconductor device of the type sealed in glass comprising a semiconductor body connected to slugs by means of a silver-aluminium bonding layer |
| 03/12/1997 | EP0585578B1 Semiconductor device with reduced floating inductance and method of fabricating same |
| 03/12/1997 | EP0564467B1 Circuit for protecting a semiconductor device from voltage produced by discharges of static electricity |
| 03/12/1997 | EP0524930B1 Fluorinated poly(arylene ethers) |
| 03/12/1997 | EP0511218B1 Fabricating eletronic circuitry unit containing stacked ic layers having lead rerouting |
| 03/12/1997 | CN2249452Y Electric refrigerating power amplifier |
| 03/12/1997 | CN1145017A Electronic part |
| 03/11/1997 | US5610833 Computer-aided design methods and apparatus for multilevel interconnect technologies |
| 03/11/1997 | US5610800 Substrate mounting of circuit components with a low profile |
| 03/11/1997 | US5610799 Power module device |
| 03/11/1997 | US5610563 Slot line to CPW circuit structure |
| 03/11/1997 | US5610531 Testing method for semiconductor circuit levels |
| 03/11/1997 | US5610443 Method for encapsulating a semiconductor utilizing an epoxy resin and an onium salt compound |
| 03/11/1997 | US5610442 Semiconductor device package fabrication method and apparatus |
| 03/11/1997 | US5610440 Semiconductor devide having improved junction construction between heat radiation plate and ceramic substrate |
| 03/11/1997 | US5610439 Press-contact type semiconductor devices |
| 03/11/1997 | US5610437 Lead frame for integrated circuits |
| 03/11/1997 | US5610436 Surface mount device with compensation for thermal expansion effects |
| 03/11/1997 | US5610426 Semiconductor integrated circuit device having excellent dual polarity overvoltage protection characteristics |
| 03/11/1997 | US5610417 Integrated circuit with variable pad pitch |
| 03/11/1997 | US5610414 Semiconductor device |
| 03/11/1997 | US5610371 Electrical connecting device and method for making same |
| 03/11/1997 | US5610104 Method of providing a mark for identification on a silicon surface |
| 03/11/1997 | US5610101 Method of manufacturing a semiconductor device having improved coverage with increased wiring layers |
| 03/11/1997 | US5610084 Method of manufacturing an antifuse utilizing nitrogen implantation |
| 03/11/1997 | US5610080 Method for producing semiconductor device having a body with a carrier ring connected thereto |
| 03/11/1997 | US5609956 (piperazinylethylamino)carbonyl-containing acrylonitrile-butadiene copolymer, maleimide compound |
| 03/11/1997 | US5609497 IC socket |
| 03/11/1997 | US5609495 Zero insertion force connector and contact therein |
| 03/11/1997 | US5609489 Socket for contacting an electronic circuit during testing |
| 03/11/1997 | US5609202 For use in a heat removal apparatus |
| 03/11/1997 | US5609201 Enhanced flow distributor for integrated circuit spot coolers |
| 03/06/1997 | WO1997008750A1 Cooling element for electronic components |
| 03/06/1997 | WO1997008749A1 Deformable substrate assembly for adhesively bonded electronic device |
| 03/06/1997 | WO1997008748A1 Chip-size package, method of manufacturing same, and second level packaging |
| 03/06/1997 | WO1997008737A2 Circuit arrangement including a hybrid circuit |
| 03/06/1997 | WO1997008483A2 Heat pipe |
| 03/06/1997 | DE19618978A1 Power semiconductor module with armoured casing |
| 03/06/1997 | DE19609449A1 HF circuitry with silicon substrate with specific resistance of more than 100 ohms per cm |
| 03/06/1997 | DE19600782C1 Forming adjacent channels or holes in semiconductor substrate, for application of masking layer |
| 03/06/1997 | DE19532183A1 IC housing with terminal pins |