H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/1997
04/01/1997	US5616959 Planarized multi-level interconnect scheme with embedded low-dielectric constant insulators
04/01/1997	US5616958 Electronic package
04/01/1997	US5616957 Plastic package type semiconductor device
04/01/1997	US5616955 Power transistor module wiring structure
04/01/1997	US5616954 Flat package for semiconductor IC
04/01/1997	US5616953 Semiconductor package
04/01/1997	US5616952 Semiconductor device with structure to decrease wiring capacitance
04/01/1997	US5616950 Thermally uniform transistor
04/01/1997	US5616949 Solid-state image sensing device
04/01/1997	US5616943 Electrostatic discharge protection system for mixed voltage application specific integrated circuit design
04/01/1997	US5616936 Active matrix assembly with signal line crossing to equalize stray capacitance
04/01/1997	US5616933 Nitride encapsulated thin film transistor fabrication technique
04/01/1997	US5616931 Semiconductor device
04/01/1997	US5616886 Wirebondless module package
04/01/1997	US5616863 Transducer assembly
04/01/1997	US5616524 Repair method for low noise metal lines in thin film imager devices
04/01/1997	US5616522 Method of making a mark on a wafer such as a semiconductor wafer incorporating a buried structure
04/01/1997	US5616520 Semiconductor integrated circuit device and fabrication method thereof
04/01/1997	US5616517 Flip chip high power monolithic integrated circuit thermal bumps and fabrication method
04/01/1997	US5616423 Ceramic substrate having a multilayered metallic thin film
04/01/1997	US5616422 Metallized substrate
04/01/1997	US5616421 Metal matrix composites containing electrical insulators
04/01/1997	US5615998 Electronic component cooling apparatus
04/01/1997	US5615824 Method of making an electrical connection
04/01/1997	US5615735 Heat sink spring clamp
04/01/1997	US5615571 Device for cambering conductive fingers on an integrated circuit
04/01/1997	US5615477 Method for interconnecting a flip chip to a printed circuit substrate
04/01/1997	US5615476 Method for producing identity cards having electronic modules
04/01/1997	US5615475 Method of manufacturing an integrated package having a pair of die on a common lead frame
03/1997
03/27/1997	WO1997011591A1 Flexible circuits with bumped interconnection capability
03/27/1997	WO1997011589A1 Coating for the structured production of conductors on the surface of electrically insulating substrates
03/27/1997	WO1997011588A1 Microelectronic lead structures with dielectric layers
03/27/1997	WO1997011493A1 Semiconductor memory circuitry
03/27/1997	WO1997011491A1 Heat transfer module incorporating liquid metal squeezed from a compliant body, and sub-assembly of same
03/27/1997	WO1997011490A1 Low rc interconnection
03/27/1997	WO1997011488A1 Interconnect scheme for integrated circuits
03/27/1997	WO1997011487A1 Semiconductor device and method of producing the same
03/27/1997	WO1997011485A1 Semiconductor device and its manufacturing method
03/27/1997	WO1997011442A1 Method for determining an encryption key associated with an integrated circuit
03/27/1997	WO1997011323A1 Absorbent pair refrigeration system
03/27/1997	WO1997011105A1 Epoxy resin composition for electrolaminates having aryl substituted guanidine and/or biguanide as cross-linking agent
03/27/1997	DE19638380A1 Glass compsn. used as electrically insulating material
03/27/1997	DE19634125A1 Junction layer in semiconductor component manufacturing method for integrated semiconductor module
03/27/1997	DE19627630A1 Semiconductor component for e.g. micro computer, memory or gate array
03/27/1997	DE19623134A1 Lead frame for semiconductor device
03/27/1997	DE19600398C1 Fusible link for integrated semiconductor circuit
03/27/1997	DE19535068A1 Beschichtung zur strukturierten Erzeugung von Leiterbahnen auf der Oberfläche von elektrisch isolierenden Substraten Coating for the structured production of conductor tracks on the surface of electrically insulating substrates
03/27/1997	CA2232061A1 Absorbent pair refrigeration system
03/26/1997	EP0764995A1 Microwave shielding structures
03/26/1997	EP0764985A2 Digital circuit with transistor geometry and channel stops providing camouflage against reverse engineering
03/26/1997	EP0764984A2 Protection housing for semiconductor chips bonded to a circuit substrate by means of bonding wires
03/26/1997	EP0764978A2 Method for bonding electronic components on a substrate by means of pressure sintering
03/26/1997	EP0764618A2 Thick film conductor paste compositions for aluminum nitride substrates
03/26/1997	EP0764393A1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology
03/26/1997	EP0764352A1 Microelectronic contacts and assemblies
03/26/1997	EP0764345A1 Multi-layer lead frame
03/26/1997	EP0674808B1 Electrical interconnect structures
03/26/1997	EP0644803A4 Flame retardant epoxy molding compound.
03/26/1997	CN1146273A Arrangement for shielding and/or cooling electronic components mounted on circuit board
03/26/1997	CN1146075A Ultra-thin noble coatings for electronic packaging
03/26/1997	CN1146074A Lead frame assembly for semiconductor device
03/26/1997	CN1146073A Structure and production of silicone semiconductor diode and chip and their insulator
03/26/1997	CN1146055A Thick film conductor paste compositions for aluminum nitride substrates
03/25/1997	US5615096 Direct current power supply conditioning circuit
03/25/1997	US5615089 BGA semiconductor device including a plurality of semiconductor chips located on upper and lower surfaces of a first substrate
03/25/1997	US5615087 Insulated surface mount circuit board construction
03/25/1997	US5615086 Apparatus for cooling a plurality of electrical components mounted on a printed circuit board
03/25/1997	US5615084 Enhanced flow distributor for integrated circuit spot coolers
03/25/1997	US5614767 Alignment accuracy check pattern
03/25/1997	US5614765 Integrated circuit semiconductor device
03/25/1997	US5614764 Endcap reservoir to reduce electromigration
03/25/1997	US5614762 Field effect transistors having comb-shaped electrode assemblies
03/25/1997	US5614761 Electronic circuit package including plural semiconductor chips formed on a wiring substrate
03/25/1997	US5614760 Tape carrier package semiconductor device
03/25/1997	US5614759 Automated assembly of semiconductor devices using a pair of lead frames
03/25/1997	US5614756 Metal-to-metal antifuse with conductive
03/25/1997	US5614745 Contact structure between two conductive layers in semiconductor device and method of manufacturing the same
03/25/1997	US5614743 Microwave integrated circuit (MIC) having a reactance element formed on a groove
03/25/1997	US5614735 Semiconductor laser device
03/25/1997	US5614443 Method of producing a frame made of connected semiconductor die mounting substrates
03/25/1997	US5614442 Method of making flip-chip microwave integrated circuit
03/25/1997	US5614441 Process of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated package
03/25/1997	US5614440 Method of forming a thermally activated noise immune fuse
03/25/1997	US5614439 Method of making a planar wiring in an insulated groove using alkylaluminum hydride
03/25/1997	US5614437 Method for fabricating reliable metallization with Ta-Si-N barrier for semiconductors
03/25/1997	US5614320 Coatings
03/25/1997	US5614316 Adhesive tape for electronic parts and liquid adhesive
03/25/1997	US5614291 Semiconductor device and method of manufacturing the same
03/25/1997	US5614070 Sputtering apparatus for forming metal lines
03/25/1997	US5614043 Method for fabricating electronic components incorporating ceramic-metal composites
03/25/1997	US5613861 Photolithographically patterned spring contact
03/25/1997	US5613552 Cooling apparatus using boiling and condensing refrigerant
03/25/1997	US5613295 Semiconductor device having an interconnecting circuit board and method for manufacturing same
03/25/1997	CA2110891C Electrical interconnects having a bulge configuration
03/25/1997	CA2080094C Multilayer circuit board with repaired i/o pin and process for repairing i/o pin on multilayer circuit board
03/25/1997	CA2066125C Electronic circuits and their fabrication
03/20/1997	WO1997010614A1 Enhanced electromigration lifetime of metal interconnection lines
03/20/1997	WO1997010612A1 Damascene process for reduced feature size
03/20/1997	WO1996038858A3 Method and probe card for testing semiconductor devices
03/20/1997	DE19638402A1 Test component for semiconductor chip in multi-contact integrated circuit

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