| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/15/1997 | US5621193 Ceramic edge connect process |
| 04/15/1997 | US5621190 Ceramic package main body |
| 04/15/1997 | US5620928 Ultra thin ball grid array using a flex tape or printed wiring board substrate and method |
| 04/15/1997 | US5620927 Solder ball attachment machine for semiconductor packages |
| 04/15/1997 | US5620926 Method for forming a contact with activation and silicide forming heat treatment |
| 04/15/1997 | US5620919 Methods for fabricating integrated circuits including openings to transistor regions |
| 04/15/1997 | US5620916 Method for improving via/contact coverage in an integrated circuit |
| 04/15/1997 | US5620914 Manufacturing method of semiconductor device |
| 04/15/1997 | US5620909 Method of depositing thin passivating film on microminiature semiconductor devices |
| 04/15/1997 | US5620558 Using etching solution containing hydrofluoric acid, cupric chloride and hydrochloric acid; increased resolution, reproducible control |
| 04/15/1997 | US5620327 Antistatic socket apparatus |
| 04/15/1997 | US5620131 Method of solder bonding |
| 04/15/1997 | CA2087742C Cooling structure for integrated circuits |
| 04/15/1997 | CA2082215C Room-temperature curable epoxy resin composition |
| 04/10/1997 | WO1997013393A1 Printed circuit board interconnection between layers |
| 04/10/1997 | WO1997013301A1 Test socket for leadless ic device |
| 04/10/1997 | WO1997013295A1 Connector and manufacturing method therefor |
| 04/10/1997 | WO1997013275A1 Electronic package with enhanced pad design |
| 04/10/1997 | WO1997012925A1 Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
| 04/10/1997 | WO1997008737A3 Circuit arrangement including a hybrid circuit |
| 04/10/1997 | DE19641613A1 Module with microcomponent and carrier manufacturing method |
| 04/10/1997 | DE19640542A1 Thermoplastic adhesive melting unit constructed economically in thin steel sheet for more responsive control |
| 04/10/1997 | DE19640435A1 Power dissipation device for semiconductor component, e.g. SMD or PCB |
| 04/10/1997 | DE19639906A1 New silica glass contg. boron and-or potassium oxides |
| 04/10/1997 | DE19637285A1 Adhesively bonding lead frame of semiconductor component to heat sink |
| 04/10/1997 | DE19614331A1 Semiconductor component with conductive layer |
| 04/10/1997 | DE19600306C1 Semiconductor component with hermetically-sealed housing for opto-electronic component |
| 04/09/1997 | EP0767601A1 Mechanical arrangement of fluid cooled electronic circuit |
| 04/09/1997 | EP0767496A1 Multilayer high-frequency circuit with integrated active elements |
| 04/09/1997 | EP0767495A2 Surface-mounting type semiconductor device |
| 04/09/1997 | EP0767494A2 Method of fabricating power semiconductor device and lead frame |
| 04/09/1997 | EP0767492A2 Integrated circuit test system |
| 04/09/1997 | EP0767491A2 Method of forming a contact |
| 04/09/1997 | EP0767244A1 High-strength copper based alloy free from smutting during pretreatment for plating |
| 04/09/1997 | EP0766909A1 Vertical interconnect process for silicon segments |
| 04/09/1997 | EP0766870A2 Method of manufacturing a progammable semiconductor device in the form of an anti-fuse |
| 04/09/1997 | EP0613608B1 Electromagnetic interference control in multilayer structures |
| 04/09/1997 | EP0527033B1 Semiconductor module |
| 04/09/1997 | CN1147153A Method and apparatus for fabricating self-assembling microstructures |
| 04/09/1997 | CN1147151A Semiconductor device and process for producing the same, and lead frame used in said process |
| 04/09/1997 | CN1147150A Electrode structure, forming method and mounting body for semiconductor device, and semiconductor device |
| 04/08/1997 | US5619399 Electronic assembly |
| 04/08/1997 | US5619072 Multi-level semiconductor device |
| 04/08/1997 | US5619071 For an integrated circuit |
| 04/08/1997 | US5619070 Semiconductor device which radiates heat and applies substrate potential from rear surface of semiconductor chip |
| 04/08/1997 | US5619069 Bipolar device and production thereof |
| 04/08/1997 | US5619068 Externally bondable overmolded package arrangements |
| 04/08/1997 | US5619066 Serial-port memory |
| 04/08/1997 | US5619065 Semiconductor package and method for assembling the same |
| 04/08/1997 | US5619063 Antifuse |
| 04/08/1997 | US5619062 Personalizable gate array devices |
| 04/08/1997 | US5619057 Complex film overlying a substrate with defined work function |
| 04/08/1997 | US5618872 Monodisperse, nonporous, spherical particles based on silicon, titanium, and zirconium dioxides, alumina and vanadium and niobium pentoxides or mixed systems thereof |
| 04/08/1997 | US5618754 Method of fabricating a semiconductor device having an Au electrode |
| 04/08/1997 | US5618752 Method of fabrication of surface mountable integrated circuits |
| 04/08/1997 | US5618750 Method of making fuse with non-corrosive termination of corrosive fuse material |
| 04/08/1997 | US5618636 Low thermal expansion polyimide films are formed as insulation and surface protection films stacked with multilayered metal films; wiring board |
| 04/08/1997 | US5618576 Overflow plating; heat treatment; elimination pores; corrosion resistance |
| 04/03/1997 | WO1997012504A1 Method for surface mounting a heatsink to a printed circuit board |
| 04/03/1997 | WO1997012401A1 A silicide agglomeration fuse device |
| 04/03/1997 | WO1997012400A1 An integrated circuit package with permanent identification of device characteristics and method for adding the same |
| 04/03/1997 | WO1997012399A1 Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions |
| 04/03/1997 | WO1997012398A1 Integrated circuit and supply decoupling capacitor therefor |
| 04/03/1997 | WO1997012397A1 Microelectronic assemblies including z-axis conductive films |
| 04/03/1997 | WO1997012395A1 Circuit having trim pads formed in scribe channel |
| 04/03/1997 | WO1997012391A1 Improved interface between titanium and aluminum-alloy in metal stack for integrated circuit |
| 04/03/1997 | WO1997012387A2 Mounting frame for integrated circuits |
| 04/03/1997 | WO1997012341A1 Chip module |
| 04/03/1997 | WO1997011905A1 Hydrogen and moisture getter and absorber for sealed devices |
| 04/03/1997 | DE19640256A1 Connecting frame for plastics embedded semiconductor component |
| 04/03/1997 | DE19639247A1 High capacity logic device for interconnecting and packaging multiple IC chips |
| 04/03/1997 | DE19536525A1 Leiterrahmen für integrierte Schaltungen Head framework for integrated circuits |
| 04/03/1997 | DE19536278A1 Carrier element for integrated circuit element of e.g. chip card |
| 04/03/1997 | DE19535989A1 Chipmodul Chip module |
| 04/03/1997 | CA2233317A1 A silicide agglomeration fuse device |
| 04/03/1997 | CA2205810A1 Microelectronic assemblies including z-axis conductive films |
| 04/02/1997 | EP0766503A2 Multi-layered printed circuit board, and grid array package adopting the same |
| 04/02/1997 | EP0766410A2 Ultra high frequency radio communication apparatus |
| 04/02/1997 | EP0766354A1 Laser diode construction element with heat sink |
| 04/02/1997 | EP0766315A1 Stacked capacitor having a corrugated electrode |
| 04/02/1997 | EP0766310A2 Solder bump structure |
| 04/02/1997 | EP0766309A2 Field effect transistor which multi-level metallisation related to integrated circuits |
| 04/02/1997 | EP0766308A2 Reduced thermal cycling of water cooled power electronic devices |
| 04/02/1997 | EP0766307A1 Silicon nitride circuit substrate |
| 04/02/1997 | EP0766303A2 Semiconductor apparatus having wiring groove and contact hole formed in self-alignment manner and method of fabricating the same |
| 04/02/1997 | EP0766302A2 Process for fabricating a CVD aluminium layer in a semiconductor device |
| 04/02/1997 | EP0766290A2 Method for forming controlled voids in interlevel dielectric |
| 04/02/1997 | EP0765529A2 Plastic encapsulation of ic device by two level epoxy encapsulation |
| 04/02/1997 | EP0765522A1 Memory test system |
| 04/02/1997 | EP0765179A1 Fire prevention device for electronics |
| 04/02/1997 | CN1146637A Large power semiconductor module with pin |
| 04/02/1997 | CN1146636A Lead-wire frame for semicondcutor device and making method thereof |
| 04/02/1997 | CN1146634A Mask for detecting defect |
| 04/01/1997 | US5617298 Collinear terminated transmission line structure |
| 04/01/1997 | US5617295 Leadframe for supporting integrated semiconductor devices |
| 04/01/1997 | US5617294 Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board |
| 04/01/1997 | US5617292 Two piece clip for heat dissipating assemblies |
| 04/01/1997 | US5616962 Semiconductor integrated circuit devices having particular terminal geometry |
| 04/01/1997 | US5616961 Structure of contact between wiring layers in semiconductor integrated circuit device |
| 04/01/1997 | US5616960 Multilayered interconnection substrate having a resin wall formed on side surfaces of a contact hole |