| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/29/1997 | USRE35496 Semiconductor device and method of producing the same |
| 04/29/1997 | US5625536 Semiconductor device |
| 04/29/1997 | US5625528 Monolithic, buried-substrate, ceramic multiple capacitors isolated, one to the next, by dual-dielectric-constant, three-layer-laminate isolation layers |
| 04/29/1997 | US5625235 Multichip integrated circuit module with crossed bonding wires |
| 04/29/1997 | US5625233 For prevention of degradation during high temperature annealing |
| 04/29/1997 | US5625232 Reliability of metal leads in high speed LSI semiconductors using dummy vias |
| 04/29/1997 | US5625231 Low cost solution to high aspect ratio contact/via adhesion layer application for deep sub-half micrometer back-end-of line technology |
| 04/29/1997 | US5625230 Integrated circuit chip structure |
| 04/29/1997 | US5625229 Heat sink fin assembly for cooling an LSI package |
| 04/29/1997 | US5625228 High performance semiconductor package with area array leads |
| 04/29/1997 | US5625227 Circuit board-mounted IC package cooling apparatus |
| 04/29/1997 | US5625226 Surface mount package with improved heat transfer |
| 04/29/1997 | US5625225 Multi-layered, integrated circuit package having reduced parasitic noise characteristics |
| 04/29/1997 | US5625224 Method and apparatus for an integrated circuit chip carrier having improved mounting pad density |
| 04/29/1997 | US5625223 Surface mounting type diode |
| 04/29/1997 | US5625222 Semiconductor device in a resin package housed in a frame having high thermal conductivity |
| 04/29/1997 | US5625220 Sublithographic antifuse |
| 04/29/1997 | US5625219 Programmable semiconductor device using anti-fuse elements with floating electrode |
| 04/29/1997 | US5625218 Semiconductor device equipped with a heat-fusible thin film resistor and production method thereof |
| 04/29/1997 | US5625207 Semiconductor component with conductors at different levels |
| 04/29/1997 | US5625166 Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices with wire bond interconnect |
| 04/29/1997 | US5624989 Metal oxide and hydroxide encapsulated in thermosetting resin, heat resistance, flame retardance |
| 04/29/1997 | US5624874 Barrier layer enhancement in metallization scheme for semiconductor device fabrication |
| 04/29/1997 | US5624268 Electrical connectors using anisotropic conductive films |
| 04/29/1997 | CA2124196C Magnetic vias within multilayer, 3 dimensional structures/substrates |
| 04/29/1997 | CA2057689C Universal surface mount package |
| 04/24/1997 | WO1997015081A1 Semiconductor resistor device |
| 04/24/1997 | WO1997015078A1 Polymer stud grid array |
| 04/24/1997 | WO1997015077A1 Polymer stud-matrix housing for microwave circuit arrangements |
| 04/24/1997 | WO1997015076A1 A ball grid array structure and method for packaging an integrated circuit chip |
| 04/24/1997 | WO1997015070A2 Fabrication method and contact bump structure for high-density surface-mount connections of solid-state device chips |
| 04/24/1997 | WO1997015068A2 Improved metal-to-metal via-type antifuse and methods of programming |
| 04/24/1997 | DE19629886A1 Mfg. semiconductor device with buried electrode conductor |
| 04/24/1997 | DE19612450A1 Semiconductor module with two metal connections on substrate |
| 04/24/1997 | DE19539193A1 Making epoxy] resin coated films for via sheets for multi layer switches for IC s |
| 04/24/1997 | DE19539181A1 Chip-card module with manufacturing method |
| 04/24/1997 | DE19538642A1 Cooling and assembly device for series of semiconductor components |
| 04/23/1997 | EP0769812A2 Method of manufacturing chip-size package-type semiconductor device |
| 04/23/1997 | EP0769808A2 Wet etching process with high selectivity between Cu and Cu3Ge |
| 04/23/1997 | EP0769788A2 Low dielectric constant material for use as an insulation element in an electronic device |
| 04/23/1997 | EP0769528A2 Organopolysiloxane composition for impregnating electronic components and electronic components impregnated therewith |
| 04/23/1997 | EP0769346A1 Composite solder paste for flip chip bumping |
| 04/23/1997 | EP0344292B1 A process of fabricating self-aligned semiconductor devices |
| 04/23/1997 | CN2253100Y Micro-channel cooling heat sink |
| 04/23/1997 | CN1148267A Improved method of die attach |
| 04/23/1997 | CN1034702C Microelectronic device package contg. liquid, and method for mfg. same |
| 04/22/1997 | US5623550 Battery power supply circuit which supplies correct power polarity irrespective of battery orientation |
| 04/22/1997 | US5623394 Apparatus for cooling of chips using a plurality of customized thermally conductive materials |
| 04/22/1997 | US5623231 Push-pull power amplifier |
| 04/22/1997 | US5623167 Semiconductor device |
| 04/22/1997 | US5623166 Interconnectors |
| 04/22/1997 | US5623163 Leadframe for semiconductor devices |
| 04/22/1997 | US5623162 Lead frame having cut-out wing leads |
| 04/22/1997 | US5623161 Electronic element and method of producing same |
| 04/22/1997 | US5623160 Signal-routing or interconnect substrate, structure and apparatus |
| 04/22/1997 | US5623157 Semiconductor device having a lead including aluminum |
| 04/22/1997 | US5623123 Semiconductor device package with small die pad and method of making same |
| 04/22/1997 | US5622898 Process of making an integrated circuit chip composite including parylene coated wire |
| 04/22/1997 | US5622896 Method of manufacturing a thin silicon-oxide layer |
| 04/22/1997 | US5622895 Metallization for polymer-dielectric multichip modules |
| 04/22/1997 | US5622892 Buried under quartz and polyimide |
| 04/22/1997 | US5622890 Method of making contact regions for narrow trenches in semiconductor devices |
| 04/22/1997 | US5622873 Process for manufacturing a resin molded image pick-up semiconductor chip having a window |
| 04/22/1997 | US5622788 Multilayer bonding pad |
| 04/22/1997 | US5622769 Ceramic circuit board having a thermal conductivity substrate |
| 04/22/1997 | US5622608 Depositing copper and magnesium on substrate, annealing to form inert magnesium oxide layer |
| 04/22/1997 | US5622590 Semiconductor device and method of manufacturing the same |
| 04/22/1997 | US5622588 Methods of making multi-tier laminate substrates for electronic device packaging |
| 04/22/1997 | US5622586 Method of fabricating device made of thin diamond foil |
| 04/22/1997 | US5622547 Containing tall oil ester |
| 04/22/1997 | US5622305 Laser device |
| 04/17/1997 | WO1997014185A1 Semiconductor device with a planarized interconnect with poly-plug and self-aligned contacts |
| 04/17/1997 | WO1997014184A1 Solderable transistor clip and heat sink |
| 04/17/1997 | WO1997014183A1 Function-differentiated temperature compensated crystal oscillator and method of producing the same |
| 04/17/1997 | WO1997013956A1 Microminiature stirling cycle cryocoolers and engines |
| 04/17/1997 | WO1997013885A1 Wiring film, sputter target for forming the wiring film and electronic component using the same |
| 04/17/1997 | WO1997013600A1 Improved metal matrix composite |
| 04/17/1997 | DE19642405A1 Cooling device for electronic part, e.g. CPU |
| 04/17/1997 | DE19537633A1 Heat conductor device for connection between component and heat sink |
| 04/17/1997 | CA2234271A1 Microminiature stirling cycle cryocoolers and engines |
| 04/16/1997 | EP0768767A2 Integrated circuit having reduced inductive noise |
| 04/16/1997 | EP0768762A1 Output circuit |
| 04/16/1997 | EP0768712A2 Bump-type contact head for a circuit board and semiconductor module using the same |
| 04/16/1997 | EP0768711A2 Microelectronic package with device cooling |
| 04/16/1997 | EP0768710A2 Electrode or wiring for a semiconductor device, an active matrix substrate and process for production thereof |
| 04/16/1997 | EP0767970A2 Method of manufacturing an electronic multilayer component |
| 04/16/1997 | CN1147692A Method of forming metal wirings on semiconductor substrate by dry etching |
| 04/16/1997 | CN1147526A Liquid organopolysiloxane resins, process for their preparation, low viscosity polydiorganosiloxane compositions containing liquid organopolysiloxane resins and their use |
| 04/15/1997 | US5621635 Integrated circuit packaged power supply |
| 04/15/1997 | US5621616 High density CMOS integrated circuit with heat transfer structure for improved cooling |
| 04/15/1997 | US5621615 For an integrated circuit chip |
| 04/15/1997 | US5621555 Liquid crystal display having redundant pixel electrodes and thin film transistors and a manufacturing method thereof |
| 04/15/1997 | US5621246 Substrate for mounting integrated circuit semiconductor chips |
| 04/15/1997 | US5621245 Apparatus for optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon |
| 04/15/1997 | US5621244 For dissipating heat generated by an integrated circuit chip |
| 04/15/1997 | US5621243 Semiconductor device having thermal stress resistance structure |
| 04/15/1997 | US5621242 Semiconductor package having support film formed on inner leads |
| 04/15/1997 | US5621241 Enhancement in throughput and planarity during CMP using a dielectric stack containing HDP-SiO2 films |
| 04/15/1997 | US5621237 Semiconductor device |
| 04/15/1997 | US5621235 TiSi2 /TiN clad interconnect technology |