| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/13/1997 | US5629887 Dynamic semiconductor memory device |
| 05/13/1997 | US5629840 High powered die with bus bars |
| 05/13/1997 | US5629838 Apparatus for non-conductively interconnecting integrated circuits using half capacitors |
| 05/13/1997 | US5629835 Metal ball grid array package with improved thermal conductivity |
| 05/13/1997 | US5629834 Electronic component cooling apparatus |
| 05/13/1997 | US5629566 Flip-chip semiconductor devices having two encapsulants |
| 05/13/1997 | US5629564 Electroplated solder terminal |
| 05/13/1997 | US5629562 Conductive contact structure for two conductors |
| 05/13/1997 | US5629561 Semiconductor package with integral heat dissipator |
| 05/13/1997 | US5629560 Integrated circuit package |
| 05/13/1997 | US5629559 Package for semiconductor device |
| 05/13/1997 | US5629557 Semiconductor device capable of preventing humidity invasion |
| 05/13/1997 | US5629552 Stable high voltage semiconductor device structure |
| 05/13/1997 | US5629532 Integrated optical circuit device |
| 05/13/1997 | US5629531 Microelectronics |
| 05/13/1997 | US5629242 Process for planarizing surface of a semiconductor device |
| 05/13/1997 | US5629241 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 05/13/1997 | US5629240 Method for direct attachment of an on-chip bypass capacitor in an integrated circuit |
| 05/13/1997 | US5629239 Manufacture of semiconductor connection components with frangible lead sections |
| 05/13/1997 | US5629238 Method for forming conductive line of semiconductor device |
| 05/13/1997 | US5629236 Method of manufacture of semiconductor device |
| 05/13/1997 | US5629227 Process of making ESD protection devices for use with antifuses |
| 05/13/1997 | US5628919 Forming via holes in unsintered green sheets, burying a portion of an internal conductor in via holes, obtaining a multilayr structure, pressing, and sintering to form a carrier body, and concave portions on lower face of carrier |
| 05/13/1997 | US5628870 Method for marking a substrate using ionized gas |
| 05/13/1997 | US5628852 Method for manufacturing a polyimide multilayer wiring substrate |
| 05/13/1997 | US5628645 IC socket |
| 05/13/1997 | US5628635 Test socket for an integrated circuit |
| 05/13/1997 | US5628111 Methods of fabricating of semiconductor package and mounting of semiconductor device |
| 05/13/1997 | CA2109441C Composite microwave circuit module assembly and its connection structure |
| 05/09/1997 | WO1997016866A2 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices |
| 05/09/1997 | WO1997016851A1 Antifuse structure and process for manufacturing the same |
| 05/09/1997 | WO1997016850A1 Antifuse structure and process for manufacturing the same |
| 05/09/1997 | WO1997016846A2 Chip module |
| 05/09/1997 | WO1997016383A1 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board |
| 05/07/1997 | EP0772274A2 Apparatus for electro-static discharge protection in a semiconductor device |
| 05/07/1997 | EP0772234A2 Integrated circuit package |
| 05/07/1997 | EP0772233A1 A solder ball array package |
| 05/07/1997 | EP0772232A1 Electronic module assembly for electronic memory cards and associated manufacturing process |
| 05/07/1997 | EP0771519A1 Integrally bumped electronic package components |
| 05/07/1997 | EP0771474A1 Electrostatic discharge protection device |
| 05/07/1997 | EP0771473A1 Molded plastic semiconductor package including heat spreader |
| 05/07/1997 | EP0771423A1 Three axis packaging |
| 05/07/1997 | EP0631691A4 Ic chip package and method of making same. |
| 05/07/1997 | DE19645033A1 Verfahren zur Bildung eines Metalldrahtes A method of forming a metal wire |
| 05/07/1997 | DE19619310A1 One-piece chip carrier for chip card |
| 05/07/1997 | DE19618976A1 Resin encapsulated semiconductor device |
| 05/07/1997 | DE19600427A1 Semiconductor wafer aligner with marker |
| 05/07/1997 | DE19541072A1 Chipmodul Chip module |
| 05/07/1997 | DE19541039A1 Chip module e.g. for chip card |
| 05/07/1997 | DE19541030A1 Coating circuit boards, electric modules, hybrid circuits etc |
| 05/07/1997 | CN2253869Y Adjustable integrated circuit radiator snap device |
| 05/07/1997 | CN1149202A Power semiconductor module |
| 05/07/1997 | CN1149201A Ball-grid-array-type semiconductor device |
| 05/06/1997 | US5627711 Self-protected semiconductor protection component |
| 05/06/1997 | US5627408 Wire bonding structure for semiconductor devices |
| 05/06/1997 | US5627407 Electronic package with reduced bending stress |
| 05/06/1997 | US5627406 Inverted chip bonded module with high packaging efficiency |
| 05/06/1997 | US5627405 Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer |
| 05/06/1997 | US5627404 Semiconductor device provided on an organic resin substrate |
| 05/06/1997 | US5627403 Adhesion between dielectric layers in an integrated circuit |
| 05/06/1997 | US5627400 Semiconductor memory device |
| 05/06/1997 | US5627399 Semiconductor device |
| 05/06/1997 | US5627345 Multilevel interconnect structure |
| 05/06/1997 | US5627344 Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate |
| 05/06/1997 | US5627101 Method of fabricating polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures |
| 05/06/1997 | US5627098 Method of forming an antifuse in an integrated circuit |
| 05/06/1997 | US5627093 Method of manufacturing a wiring layer for use in a semiconductor device having a plurality of conductive layers |
| 05/06/1997 | US5627083 Method of fabricating semiconductor device including step of forming superposition error measuring patterns |
| 05/06/1997 | US5627082 High thermal resistance backfill material for hybrid UFPA's |
| 05/06/1997 | US5626914 Ceramic body with copper metal infiltration |
| 05/06/1997 | US5626771 Multilayer electronic circuit packages |
| 05/06/1997 | US5626484 Connector employing liquid conductor for electrical contact |
| 05/06/1997 | US5626279 Gallium is selectively deposited on surface of electroconductive substrate; forming intermetallic |
| 05/06/1997 | US5626277 Mounting apparatus of solder-balls |
| 05/06/1997 | US5626169 Device for bending leads of a lead frame |
| 05/06/1997 | US5625935 Method of manufacturing a multilayer electronic component |
| 05/06/1997 | CA2047020C Substrate for superconducting device |
| 05/02/1997 | EP0771138A1 Cooling device for electric components in a casing of a travelling structure |
| 05/02/1997 | EP0771030A1 Process for detecting the presence of a passivation over an integrated circuit |
| 05/02/1997 | EP0771029A2 Semiconductor device having an improved structure for preventing cracks, and method of manufacturing the same |
| 05/02/1997 | EP0771028A2 Semiconductor device with passivation structure |
| 05/02/1997 | EP0771027A1 Semiconductor device |
| 05/02/1997 | EP0771026A2 Method of forming air bridges |
| 05/02/1997 | EP0771024A1 Borderless contact etch process with sidewall spacer and selective isotropic etch process |
| 05/02/1997 | EP0771023A2 Method of applying a protective coating on a semiconductor integrated circuit |
| 05/02/1997 | EP0770652A2 Tamper-proof electronic coatings |
| 05/02/1997 | EP0770305A2 Image display apparatus with line number conversion |
| 05/02/1997 | EP0770267A2 Method of manufacturing a device, by which method a substrate with semiconductor element and conductor tracks is glued to a support body with metallization |
| 05/02/1997 | EP0770266A2 Method of manufacturing a semiconductor device suitable for surface mounting |
| 05/02/1997 | EP0770200A1 Flexible heat pipe for integrated circuit cooling apparatus |
| 05/02/1997 | EP0654169A4 Cubic metal oxide thin film epitaxially grown on silicon. |
| 05/01/1997 | WO1997015951A1 Parylene polymer layers |
| 05/01/1997 | WO1997015801A1 Liquid cooled heat sink for cooling electronic components |
| 05/01/1997 | CA2235620A1 Liquid cooled heat sink for cooling electronic components |
| 04/30/1997 | DE19625240A1 Semiconductor intelligent power module device for e.g. IGBT |
| 04/30/1997 | DE19540348A1 Identification of components |
| 04/30/1997 | DE19540140A1 Plate-shaped substrate for e.g. solid state laser module connecting to optical fibre |
| 04/30/1997 | CN1148733A Plastic moulded integrated circuit assembly with low-glancing-flatness deviation lead wire |
| 04/30/1997 | CN1148732A Out-fitted type semiconductor device, semiconductor fitting component, and production method thereof |
| 04/30/1997 | CN1148637A Figure forming method |