| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/27/1997 | US5633780 Electrostatic discharge protection device |
| 05/27/1997 | US5633536 Press contact type semiconductor device |
| 05/27/1997 | US5633534 Integrated circuit with enhanced planarization |
| 05/27/1997 | US5633533 Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto |
| 05/27/1997 | US5633532 Semiconductor device interconnection |
| 05/27/1997 | US5633531 Metal alloy housing; thermoconductivity, workability, corrosion resistance |
| 05/27/1997 | US5633530 Multichip module having a multi-level configuration |
| 05/27/1997 | US5633529 Resin sealing type semiconductor device and method of making the same |
| 05/27/1997 | US5633528 Lead frame structure for IC devices with strengthened encapsulation adhesion |
| 05/27/1997 | US5633525 Lateral field effect transistor |
| 05/27/1997 | US5633505 Semiconductor wafer incorporating marks for inspecting first layer overlay shift in global alignment process |
| 05/27/1997 | US5633479 Multilayer wiring structure for attaining high-speed signal propagation |
| 05/27/1997 | US5633209 Method of forming a circuit membrane with a polysilicon film |
| 05/27/1997 | US5633207 Method of forming a wiring layer for a semiconductor device |
| 05/27/1997 | US5633206 Forming lead frame, placing layer of polyamic acid film on backing, thermally compressing to form polyimide film |
| 05/27/1997 | US5633205 Lead frame and process of producing such a frame |
| 05/27/1997 | US5633204 Method and apparatus for forming bump structure used for flip-chip mounting, the bump structure and the flip-chip |
| 05/27/1997 | US5633198 Method of forming wiring with gaps in bend to improve electromigration resistance |
| 05/27/1997 | US5633197 Metallization to improve electromigration resistance by etching concavo-concave opening |
| 05/27/1997 | US5633196 Forming active region on substrate, forming dielectric layer having opening exposing portion of active region, forming silicide landing pad, forming second dielectric layer, forming conductive layer |
| 05/27/1997 | US5633189 Method of making metal to metal antifuse |
| 05/27/1997 | US5633173 Method for detecting wafer defects |
| 05/27/1997 | US5633047 Electronic devices having metallurgies containing copper-semiconductor compounds |
| 05/27/1997 | US5633034 Process for forming a circuit assembly |
| 05/27/1997 | US5632812 Diamond electronic device and process for producing the same |
| 05/27/1997 | US5632631 Microelectronic contacts with asperities and methods of making same |
| 05/27/1997 | US5632158 Electronic component cooling unit |
| 05/27/1997 | CA2081045C Integrated circuit package having a cooling mechanism |
| 05/22/1997 | WO1997018587A1 Semiconductor interlayer staggered contact structure |
| 05/22/1997 | WO1997018586A1 Reduction of electromagnetic interference in integrated circuit device packages |
| 05/22/1997 | WO1997018585A1 Tri-layer pre-metal interlayer dielectric compatible with advanced cmos technologies |
| 05/22/1997 | DE19648308A1 Funkkommunikationsmodul Radiocommunication module |
| 05/22/1997 | DE19648082A1 Verfahren zum Ebnen einer Halbleitereinrichtung A method for planarizing a semiconductor device |
| 05/22/1997 | DE19616854C1 Semiconductor component mfr. for integrated semiconductor power module |
| 05/22/1997 | DE19546045C1 Flip-Chip-Verfahren zur Herstellung eines Multichip-Moduls Flip-chip process for producing a multi-chip module |
| 05/22/1997 | DE19543427A1 Chipmodul Chip module |
| 05/22/1997 | DE19543260A1 Electric module with multiple electric components |
| 05/22/1997 | DE19542943A1 Composite structure for micro-electronic power component |
| 05/21/1997 | EP0774785A2 Electrostatic protection devices for protecting semiconductor integrated circuitry |
| 05/21/1997 | EP0774783A2 Protection of devices from electrostatic discharge |
| 05/21/1997 | EP0774782A2 Semiconductor power module |
| 05/21/1997 | EP0774779A1 Method of fabricating a micromodule, particularly for chip cards |
| 05/21/1997 | EP0774775A1 Method of fabricating semiconductor device and semiconductor device fabricated thereby |
| 05/21/1997 | EP0774662A1 Batch manufacturing method for chips having coated selective electrodes |
| 05/21/1997 | EP0774315A2 Tungsten-copper composite powder |
| 05/21/1997 | EP0774164A1 Raised tungsten plug antifuse and fabrication process |
| 05/21/1997 | EP0774163A1 Reduced leakage antifuse structure and fabrication method |
| 05/21/1997 | EP0774162A1 Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities |
| 05/21/1997 | EP0773968A1 Phosphorus-modified epoxide resins, process for producing the same and their use |
| 05/21/1997 | CN2254589Y Radiator for semiconductor |
| 05/21/1997 | CN1150334A Semiconductor apparatus |
| 05/21/1997 | CN1150333A Furnace tube apparatus for manufacturing semiconductors |
| 05/21/1997 | CN1150332A Semiconductor package apparatus and calculating method for parasitic capacitance created by formed substance |
| 05/21/1997 | CN1150328A Method of manufacturing semiconductor chip package |
| 05/21/1997 | CN1150325A Process for fabricating CVD aluminum layer in semiconductor device |
| 05/21/1997 | CA2190416A1 Electrostatic protection devices for protecting semiconductor integrated circuitry |
| 05/20/1997 | US5631809 Semiconductor device for ultrahigh frequency band and semiconductor apparatus including the semiconductor device |
| 05/20/1997 | US5631806 Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints |
| 05/20/1997 | US5631799 Fusion heat sink for integrated circuit |
| 05/20/1997 | US5631624 Dielectric ceramics and electronic parts using the same |
| 05/20/1997 | US5631609 Piezoelectric oscillator, voltage-controlled oscillator and production method thereof |
| 05/20/1997 | US5631596 Process monitor for CMOS integrated circuits |
| 05/20/1997 | US5631502 Multi-chip module |
| 05/20/1997 | US5631499 Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics |
| 05/20/1997 | US5631498 Thin film metallization process for improved metal to substrate adhesion |
| 05/20/1997 | US5631497 Film carrier tape and laminated multi-chip semiconductor device incorporating the same |
| 05/20/1997 | US5631496 Covering layer of boron-doped, amorphous hydrogenous carbon |
| 05/20/1997 | US5631495 High performance bipolar devices with plurality of base contact regions formed around the emitter layer |
| 05/20/1997 | US5631478 Semiconductor integrated circuits with specific pitch multilevel interconnections |
| 05/20/1997 | US5631476 MOS-technology power device chip and package assembly |
| 05/20/1997 | US5631473 Solid state array with supplemental dielectric layer crossover structure |
| 05/20/1997 | US5631447 Uses of uniaxially electrically conductive articles |
| 05/20/1997 | US5631193 High density lead-on-package fabrication method |
| 05/20/1997 | US5631191 Method for connecting a die to electrically conductive traces on a flexible lead-frame |
| 05/20/1997 | US5631186 Method for making a dynamic random access memory using silicon-on-insulator techniques |
| 05/20/1997 | US5631181 Method of making a monolithic diode array |
| 05/20/1997 | US5630469 Mounted on a circuit board |
| 05/20/1997 | CA2041461C Circuit pack cooling using perforations |
| 05/15/1997 | WO1997017755A1 Push-pull power amplifier |
| 05/15/1997 | WO1997017738A1 Slotline-to-coplanar waveguide transition |
| 05/15/1997 | WO1997017727A1 A flip-chip assembly |
| 05/15/1997 | WO1997017724A1 Semiconductor device having local wiring section and process for manufacturing the same |
| 05/15/1997 | WO1997017721A2 Method for making a circuit structure having a flip-mounted matrix of devices |
| 05/15/1997 | WO1997017720A2 Circuit structure having a flip-mounted matrix of devices |
| 05/15/1997 | WO1997008483A3 Heat pipe |
| 05/15/1997 | DE19644813A1 Semiconductor chip protective housing moulding apparatus for lead frame device |
| 05/15/1997 | DE19612838A1 Power semiconductor component, e.g. thyristor, for high voltage direct current use |
| 05/14/1997 | EP0773709A2 Two-layer solderable gold for thick film circuits |
| 05/14/1997 | EP0773587A2 Method of making a semiconductor power module |
| 05/14/1997 | EP0773586A2 Separate circuit devices in an intrapackage configuration and assembly techniques |
| 05/14/1997 | EP0773585A2 Pressure-contact type semiconductor device |
| 05/14/1997 | EP0773584A2 Device having resin package and method of producing the same |
| 05/14/1997 | EP0773579A2 Semiconductor device with improved insulating/passivating layer |
| 05/14/1997 | EP0773437A2 Temperature sensing device and applications thereof |
| 05/14/1997 | EP0772888A1 Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method |
| 05/14/1997 | EP0772756A1 Microcomponent sheet architecture |
| 05/14/1997 | CN1149930A Electronic component comprising thin-film structure with passive elements |
| 05/14/1997 | CN1149766A 树脂密封型半导体器件 Resin-sealed type semiconductor device |
| 05/14/1997 | CN1149765A Semiconductor packaging with transparent window and its producing method |
| 05/14/1997 | CN1149764A Interconnection structure for mounting semiconductor device on substrate |