| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/10/1997 | US5637919 Semiconductor chip |
| 06/10/1997 | US5637917 Lead frame assembly for a semiconductor device |
| 06/10/1997 | US5637916 Carrier based IC packaging arrangement |
| 06/10/1997 | US5637915 Semiconductor device affixed to an upper and a lower leadframe |
| 06/10/1997 | US5637914 Lead frame and semiconductor device encapsulated by resin |
| 06/10/1997 | US5637913 Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two |
| 06/10/1997 | US5637907 Three dimensional semiconductor circuit structure with optical interconnection |
| 06/10/1997 | US5637828 Semiconductor integrated circuit |
| 06/10/1997 | US5637535 Semiconductor device with reliable electrodes of projecting shape and method of forming same |
| 06/10/1997 | US5637534 Plasma etching surface of semiconductor insulating layer using carbonless chlorine-based gas, filling via hole to form plug comprising aluminum or alloy thereof |
| 06/10/1997 | US5637532 Interconnect decoupling scheme |
| 06/10/1997 | US5637406 Heat conductivity |
| 06/10/1997 | US5637274 Improved bonding strength |
| 06/10/1997 | US5637273 Method for molding of integrated circuit package |
| 06/10/1997 | US5637186 Method and monitor testsite pattern for measuring critical dimension openings |
| 06/10/1997 | US5636684 Cooling element and connector for an electronic power component cooled by a fluid electrically isolated from the component |
| 06/10/1997 | US5636430 General-purpose lead working machine |
| 06/05/1997 | WO1997020454A1 Surface mount socket for an electronic package and contact for use therewith |
| 06/05/1997 | WO1997020347A1 Semiconductor device, process for producing the same, and packaged substrate |
| 06/05/1997 | WO1997020346A1 Novel metallization sidewall passivation technology for deep sub-half micrometer ic applications |
| 06/05/1997 | WO1997020344A1 A method and device for chip assembly |
| 06/05/1997 | WO1997020339A1 Socket for a tape carrier package |
| 06/05/1997 | WO1997017720A3 Circuit structure having a flip-mounted matrix of devices |
| 06/05/1997 | DE19650331A1 Verfahren zur Herstellung eines Halbleiterbauelementes sowie Halbleiterbauelement A process for producing a semiconductor device and semiconductor device |
| 06/05/1997 | DE19649893A1 Conductive adhesive for bonding e.g. semiconductors to circuit boards |
| 06/05/1997 | DE19641875A1 HF circuit for high frequency semiconductor chip |
| 06/05/1997 | DE19629774A1 Semiconductor device |
| 06/05/1997 | DE19619737A1 Semiconductor device e.g. DRAM with fuse |
| 06/05/1997 | DE19544929A1 Verfahren und Vorrichtung zum flußmittelfreien Aufbringen eines Lötmittels auf ein Substrat oder einen Chip Method and apparatus for fluxless applying a solder to a substrate or a chip |
| 06/05/1997 | DE19544347A1 Manufacture of power semiconductor device in packaged chip |
| 06/04/1997 | EP0777275A2 Semiconductor module with heat sink |
| 06/04/1997 | EP0777274A1 A high density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate |
| 06/04/1997 | EP0777273A2 Semiconductor device |
| 06/04/1997 | EP0777272A2 Semiconductor device |
| 06/04/1997 | EP0777271A2 Semiconductor device comprising a lead frame and a heat sink |
| 06/04/1997 | EP0777270A1 Heat dissipator for electronic devices |
| 06/04/1997 | EP0776725A1 Method of marking works |
| 06/04/1997 | EP0776343A1 Polyurethanes with improved resistance to tear propagation |
| 06/04/1997 | CN2255682Y Semiconductor laser plastic forming-packaging device |
| 06/04/1997 | CN1151086A Stacked capacitor having corrugated electrode |
| 06/04/1997 | CN1035087C Method of manufacturing superconducting circuitous pattern |
| 06/03/1997 | US5636172 Reduced pitch laser redundancy fuse bank structure |
| 06/03/1997 | US5636104 Printed circuit board having solder ball mounting groove pads and a ball grid array package using such a board |
| 06/03/1997 | US5635873 Operational amplifier having dummy isolation stage |
| 06/03/1997 | US5635846 Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer |
| 06/03/1997 | US5635823 Current detector circuit |
| 06/03/1997 | US5635822 Safeguard for integrated power stages employing multiple bond-wires to a current lead of the package |
| 06/03/1997 | US5635767 Semiconductor device having built-in high frequency bypass capacitor |
| 06/03/1997 | US5635766 Protective coatings |
| 06/03/1997 | US5635764 Layer of nickel-gold alloy interposed between solder layer and ground metal and/or electrode |
| 06/03/1997 | US5635763 Include a light beams reflection suppression layer of aluminium and titanium intermetallic |
| 06/03/1997 | US5635762 Flip chip semiconductor device with dual purpose metallized ground conductor |
| 06/03/1997 | US5635761 Internal resistor termination in multi-chip module environments |
| 06/03/1997 | US5635760 Surface mount semiconductor device |
| 06/03/1997 | US5635759 Semiconductor device for mounting high-frequency element |
| 06/03/1997 | US5635756 Semiconductor device, lead frame therefor and memory card to provide a thin structure |
| 06/03/1997 | US5635755 For connecting packaged miniaturized integrated circuits to external circuits |
| 06/03/1997 | US5635754 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| 06/03/1997 | US5635751 Semiconductor device |
| 06/03/1997 | US5635736 MOS gate type semiconductor device |
| 06/03/1997 | US5635734 Insulated gate type semiconductor device in which the reliability and characteristics thereof are not deteriorated due to pressing action and power inverter using the same |
| 06/03/1997 | US5635672 Ceramic oxide body, metal foil covering; sealed with epoxy resin |
| 06/03/1997 | US5635671 Mold runner removal from a substrate-based packaged electronic device |
| 06/03/1997 | US5635670 Multilayer electronic component |
| 06/03/1997 | US5635669 Multilayer electronic component |
| 06/03/1997 | US5635429 Method of making a substrate of a ceramic material |
| 06/03/1997 | US5635428 Global planarization using a polyimide block |
| 06/03/1997 | US5635427 Method for assembling a pressure contact semiconductor device in a flat package |
| 06/03/1997 | US5635424 High-density bond pad layout arrangements for semiconductor dies, and connecting to the bond pads |
| 06/03/1997 | US5635336 Method for the preparation of a pattern overlay accuracy-measuring mark |
| 06/03/1997 | US5635301 First layer of relatively dense crystalline glass, second layer of porous crystalline glass of low dielectric constant |
| 06/03/1997 | US5635249 Applying mixture of hydrogen silsesquioxane resin and phosphor filler to substrate, then non-pyrolytic heating yields noncracking coatings |
| 06/03/1997 | US5635240 Electronic coating materials using mixed polymers |
| 06/03/1997 | US5635220 Molding die for sealing semiconductor device with reduced resin burrs |
| 06/03/1997 | US5635042 Apparatus for automatic loading/unloading of rack carrying lead frame |
| 06/03/1997 | US5635009 Method for sticking an insulating film to a lead frame |
| 06/03/1997 | US5634801 Electrical interconnect contact system |
| 06/03/1997 | US5634351 Two-phase cooling system for a laptop computer lid |
| 06/03/1997 | US5634268 Method for making direct chip attach circuit card |
| 06/03/1997 | US5634267 Method and apparatus for manufacturing known good semiconductor die |
| 05/29/1997 | WO1997019579A1 Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar |
| 05/29/1997 | WO1997019491A1 An electrically conductive wire |
| 05/29/1997 | WO1997019470A1 Ground ring for metal electronic package |
| 05/29/1997 | WO1997019469A1 Semiconductor package with ground or power ring |
| 05/29/1997 | WO1997019463A2 Chip module |
| 05/29/1997 | WO1997019462A2 Vertically integrated semiconductor component and method of producing the same |
| 05/29/1997 | WO1997019204A1 Method and apparatus for surface treatment |
| 05/28/1997 | EP0776040A2 Integrated circuit interconnect and method |
| 05/28/1997 | EP0776039A2 Improvements in or relating to semiconductor packages |
| 05/28/1997 | EP0776038A2 Integrated circuit driver for a liquid crystal device |
| 05/28/1997 | EP0776033A2 Method for forming aluminium contacts by sputtering |
| 05/28/1997 | EP0775931A2 Method for manufacturing liquid crystal display |
| 05/28/1997 | EP0775716A1 Novel heat-fusible copolymer, and powder, film, laminated heat insulator, electronic module, and capacitor produced from said copolymer, and process for producing the same |
| 05/28/1997 | EP0775680A1 Protective coating for electronic devices |
| 05/28/1997 | EP0775369A2 Miniature semiconductor device for surface mounting |
| 05/28/1997 | EP0775368A1 Plastic substrate for electronic circuits with bondable contact pins |
| 05/28/1997 | EP0521163B1 Aluminum alloy wiring layer, manufacturing thereof, and aluminum alloy sputtering target |
| 05/28/1997 | CN1150696A Glass composition for insulation, insulation paste, and thick-film printed circuit |
| 05/27/1997 | US5633785 Integrated circuit component package with integral passive component |
| 05/27/1997 | US5633783 Multi-chip ceramic module for mounting electric parts on both substrate and cap connected through interconnecting pins |