| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/24/1997 | US5641714 Method of manufacturing members |
| 06/24/1997 | US5641713 Applying sealant along top edge of base, applying metal seal ring over sealant, covering with lid to create cavity, compressing ring between lid and base to provide hermetic seal at room temperature in inert environment, curing sealant |
| 06/24/1997 | US5641712 Method and structure for reducing capacitance between interconnect lines |
| 06/24/1997 | US5641711 Providing layer of patterned conductors on substrate, directionally depositing layer of dielectric material, forming dielectric bridge between one pair of conductors, creating gas dielectric region which lowers capacitance |
| 06/24/1997 | US5641710 Vapor depositing, photolithographic process, etching, laminating forming a contact hole and protective coatings on surface |
| 06/24/1997 | US5641709 Forming sacrificial layer on semiconductor substrate, forming metal oxide composite on layer, removing sacrificial layer to form air gap |
| 06/24/1997 | US5641703 Voltage programmable links for integrated circuits |
| 06/24/1997 | US5641581 Semiconductor device |
| 06/24/1997 | US5640762 Method and apparatus for manufacturing known good semiconductor die |
| 06/24/1997 | US5640761 Method of making multi-layer circuit |
| 06/24/1997 | US5640760 Method for the 3D interconnection of packages of electronic components using printed circuit boards |
| 06/24/1997 | CA2084394C Superconducting multilayer interconnection formed of oxide superconductor material and method for manufacturing the same |
| 06/21/1997 | CA2193707A1 Flexible epoxy adhesives with low bleeding tendency |
| 06/19/1997 | WO1997022146A1 Semiconductor package with multilayered circuit and semiconductor device |
| 06/19/1997 | WO1997022145A1 Method of manufacturing a semiconductor device for surface mounting suitable for comparatively high voltages, and such a semiconductor device |
| 06/19/1997 | WO1997022138A2 Flip-chip process for producing a multi-chip module |
| 06/19/1997 | WO1997017721A3 Method for making a circuit structure having a flip-mounted matrix of devices |
| 06/19/1997 | WO1997016866A3 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices |
| 06/19/1997 | WO1997015068A3 Improved metal-to-metal via-type antifuse and methods of programming |
| 06/19/1997 | DE19651554A1 Semiconductor component with electronic circuit |
| 06/19/1997 | DE19546285A1 Electronic module with circuit on substrate surface |
| 06/18/1997 | EP0779773A1 Copper conductor paste and production method of copper conductor film |
| 06/18/1997 | EP0779772A1 Printed wiring board, method of producing the same and electronic devices |
| 06/18/1997 | EP0779658A2 A heat sink arrangement |
| 06/18/1997 | EP0779657A2 Surface-mounted semiconductor package and its manufacturing method |
| 06/18/1997 | EP0742898B1 Device for imaging a three-dimensional object |
| 06/18/1997 | EP0560925B1 High frequency oscillator comprising cointegrated thin film resonator and active device |
| 06/18/1997 | CN1152371A 陶瓷电路基板 A ceramic circuit substrate |
| 06/18/1997 | CN1152299A Highly heat-conductive silicon nitride sinter, process for producing the same and pressure-welded structure |
| 06/18/1997 | CN1152298A Aluminum Nitride sinter and process for production thereof |
| 06/18/1997 | CN1152191A Semiconductor device and manufacturing method thereof |
| 06/18/1997 | CN1152190A Systems interconneted by bumps of joining material |
| 06/17/1997 | US5640308 Field programmable circuit module |
| 06/17/1997 | US5640305 Anchor for securing a heat sink to a printed circuit board |
| 06/17/1997 | US5640304 Power electronic device mounting apparatus |
| 06/17/1997 | US5640097 Test pattern for separately determining plug resistance and interfactial resistance |
| 06/17/1997 | US5640053 Inverse open frame alignment mark and method of fabrication |
| 06/17/1997 | US5640052 Interconnection structure of electronic parts |
| 06/17/1997 | US5640051 Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex |
| 06/17/1997 | US5640049 Metal interconnect structures for use with integrated circuit devices to form integrated circuit structures |
| 06/17/1997 | US5640048 Ball grid array package for a integrated circuit |
| 06/17/1997 | US5640047 Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function |
| 06/17/1997 | US5640046 Cooling structure for integrated circuit element modules, electronic device and heat sink block |
| 06/17/1997 | US5640045 Thermal stress minimization in power semiconductor devices |
| 06/17/1997 | US5640044 Semiconductor device and method of producing said semiconductor device |
| 06/17/1997 | US5640036 High voltage cut-off semiconductor device |
| 06/17/1997 | US5639990 Solid printed substrate and electronic circuit package using the same |
| 06/17/1997 | US5639989 Shielded electronic component assembly and method for making the same |
| 06/17/1997 | US5639696 Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array |
| 06/17/1997 | US5639695 Low-profile ball-grid array semiconductor package and method |
| 06/17/1997 | US5639694 Electrically connecting selected signal sites to respective signal leads and selective ground sites to common ground portion of leadframe; electrically isolating each of signal leads from each other and from common ground portion |
| 06/17/1997 | US5639693 Semiconductor device and process for fabricating the same |
| 06/17/1997 | US5639692 Non-etch back SOG process using a metal via stud |
| 06/17/1997 | US5639690 Eliminating variations of wiring resistance by causing breakage of an aluminum or aluminum alloy layer of a laminated structure at certain positions |
| 06/17/1997 | US5639689 Method for fabricating storage electrode of semiconductor device |
| 06/17/1997 | US5639686 Method of fabricating circuit elements on an insulating substrate |
| 06/17/1997 | US5639683 Structure and method for intergrating microwave components on a substrate |
| 06/17/1997 | US5639678 Miniaturized transistor |
| 06/17/1997 | US5639562 Co-sintered surface metallization for pin-join, wire-bond and chip attach |
| 06/17/1997 | US5639558 Insulating resin-coated bonding wire |
| 06/17/1997 | US5639385 Method of fabricating a wafer probe card for testing an integrated circuit die |
| 06/17/1997 | US5639325 Process for producing a glass-coated article |
| 06/17/1997 | US5639316 Thin film multi-layer oxygen diffusion barrier consisting of aluminum on refractory metal |
| 06/17/1997 | US5639247 Contacting system for electrical devices |
| 06/17/1997 | US5639014 Electronic packages; applying corrosion resistant material onto metal strip; then solderable material; roll cladding |
| 06/17/1997 | US5638895 For an electronic component |
| 06/17/1997 | US5638687 Substrate cooling method and apparatus |
| 06/17/1997 | US5638597 Manufacturing flexible circuit board assemblies with common heat spreaders |
| 06/17/1997 | US5638596 Method of employing multi-layer tab tape in semiconductor device assembly by selecting, breaking, downwardly bending and bonding tab tape trace free ends to a ground or power plane |
| 06/17/1997 | CA2118758C Lead frame for integrated circuits |
| 06/12/1997 | WO1997021248A1 Gate turn-off thyristor and power converter device using the same |
| 06/12/1997 | WO1997021246A1 Heterolithic microwave integrated impedance matching circuitry and method of manufacture |
| 06/12/1997 | WO1997021245A1 Shaftless roller for lead forming apparatus |
| 06/12/1997 | WO1997021243A1 Method for processing semiconductor wafer, method for manufacturing ic card, and carrier |
| 06/12/1997 | WO1997020673A1 Process for manufacturing resin-encapsulated electronic product |
| 06/12/1997 | WO1997020654A1 Process and device for applying a solder to a substrate or chip without flux |
| 06/12/1997 | WO1997015070A3 Fabrication method and contact bump structure for high-density surface-mount connections of solid-state device chips |
| 06/12/1997 | WO1997012387A3 Mounting frame for integrated circuits |
| 06/12/1997 | DE19645971A1 Gehäusungssystem, für Feldeffekttransistoren Gehäusungssystem, for field-effect transistors |
| 06/12/1997 | DE19545448A1 Multi-function housing for static converter of motor vehicle |
| 06/12/1997 | CA2238974A1 Method for processing semiconductor wafer, method for manufacturing ic card, and carrier |
| 06/11/1997 | EP0778619A2 Structure and fabrication method for thin film capacitors |
| 06/11/1997 | EP0778618A2 Lead frame and method for manufacturing it |
| 06/11/1997 | EP0778617A2 Electronic device package enclosed by pliant medium laterally confined by a plastic rim member |
| 06/11/1997 | EP0778616A2 Method of packaging devices with a gel medium confined by a rim member |
| 06/11/1997 | EP0778593A1 Method for realizing magnetic circuits in an integrated circuit |
| 06/11/1997 | EP0778249A1 Highly heat-conductive silicon nitride sinter, process for producing the same, and pressure-welded structure |
| 06/11/1997 | EP0710178A4 Conformal thermally conductive interface material |
| 06/11/1997 | CN1151612A High thermal conductivity silicon nitride circuit substrat, and semiconductor device using the same |
| 06/11/1997 | CN1151610A Method for forming metal wire |
| 06/10/1997 | US5638469 Microelectronic module having optical and electrical interconnects |
| 06/10/1997 | US5638391 Semiconductor laser device and optical disc apparatus provided with the semiclonductor laser device |
| 06/10/1997 | US5638258 CPU heat sink fastener |
| 06/10/1997 | US5638021 Power semiconductor component with temperature sensor |
| 06/10/1997 | US5637925 Uses of uniaxially electrically conductive articles |
| 06/10/1997 | US5637924 Semiconductor device having planarized wiring with good thermal resistance |
| 06/10/1997 | US5637923 Semiconductor device, carrier for carrying semiconductor device |
| 06/10/1997 | US5637922 Wireless radio frequency power semiconductor devices using high density interconnect |
| 06/10/1997 | US5637921 Sub-ambient temperature electronic package |
| 06/10/1997 | US5637920 High contact density ball grid array package for flip-chips |