| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/02/1997 | EP0782189A2 Aluminium alloy for on-chip wiring applications |
| 07/02/1997 | EP0782188A2 High density gate array cell architecture |
| 07/02/1997 | EP0782184A1 Heat dissipating and supporting structure for a package |
| 07/02/1997 | EP0782088A1 Active connector for chip card |
| 07/02/1997 | EP0782040A2 Method for manufacturing liquid crystal display |
| 07/02/1997 | EP0781991A2 Improvements in or relating to semiconductor devices |
| 07/02/1997 | EP0781455A1 Integrated circuit contacts with secured stringers |
| 07/02/1997 | EP0707741A4 Surface mount and flip chip technology |
| 07/02/1997 | CN1153579A Miniature semiconductor device for surface mounting |
| 07/02/1997 | CN1153400A Conductive ball carring device |
| 07/02/1997 | CN1153222A High-strength copper based alloy free from smutting during pretreatment for plating |
| 07/01/1997 | US5644526 Integrated circuit with improved immunity to large metallization defects |
| 07/01/1997 | US5644500 Routing program generating method and apparatus therefor, placement program generating method and apparatus therefor, and automatic routing method and apparatus therefor |
| 07/01/1997 | US5644281 Electronic component incorporating solder fuse wire |
| 07/01/1997 | US5644277 Three-wire-line vertical interconnect structure for multilevel substrates |
| 07/01/1997 | US5644168 Mechanical interlocking of fillers and epoxy/resin |
| 07/01/1997 | US5644167 Integrated circuit package assemblies including an electrostatic discharge interposer |
| 07/01/1997 | US5644166 Improved diffusion barriers; low resistance contacts |
| 07/01/1997 | US5644164 Semiconductor device which dissipates heat |
| 07/01/1997 | US5644163 Semiconductor device |
| 07/01/1997 | US5644162 Semiconductor chip having chip metal layer and transfer metal layer composed of same metal, and corresponding electronic module |
| 07/01/1997 | US5644161 Ultra-high density warp-resistant memory module |
| 07/01/1997 | US5644143 Method for protecting a semiconductor device with a superconductive line |
| 07/01/1997 | US5644107 Method of manufacturing a multilayer electronic component |
| 07/01/1997 | US5644102 Integrated circuit packages with distinctive coloration |
| 07/01/1997 | US5644003 Soldering resistance and seals |
| 07/01/1997 | US5643835 Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs |
| 07/01/1997 | US5643834 Covering metal base with stress relieving dielectric film(s) by vapor deposition while controlling concentrations of silicon and nitrogen, then mounting semiconductors |
| 07/01/1997 | US5643833 Forming electroconductive layer, forming insulating layer, forming antireflection layer, patterning, forming insulating layers, etching, depositing electroconductive connector layer |
| 07/01/1997 | US5643830 Process for manufacturing off-axis power branches for interior bond pad arrangements |
| 07/01/1997 | US5643822 Controlled doping of ledge adjacent to trench on substrate surface to suppress conductivity and improve leakage of field effect transistor |
| 07/01/1997 | US5643805 Process for producing a bipolar device |
| 07/01/1997 | US5643802 Method of producing a semiconductor device by gang bonding followed by point bonding |
| 07/01/1997 | US5643642 Polymeric metal oxide materials and their formation and use |
| 07/01/1997 | US5643433 Photoresists patterns formed by electrodeposition |
| 07/01/1997 | US5642779 Plate shaped diamond substrate, fins; for radiation of semiconductor devices |
| 07/01/1997 | US5642776 Electrically insulated envelope heat pipe |
| 06/26/1997 | WO1997023123A1 A ball grid array integrated circuit package that has vias located within the solder pads |
| 06/26/1997 | WO1997023121A1 Spheres useful in a detachable connective medium for ball grid array assemblies |
| 06/26/1997 | WO1997022998A1 Electrostatic discharge protection device |
| 06/26/1997 | WO1997022997A1 Electrostatic discharge protection device |
| 06/26/1997 | WO1997022996A1 Multi-chip device and method of fabrication employing leads over and under processes |
| 06/26/1997 | WO1997022995A1 Semiconductor device containing two or more metallic wiring layers and method for manufacturing the same |
| 06/26/1997 | WO1997022993A1 Electronic package with spacer means |
| 06/26/1997 | WO1997022990A1 Secure semiconductor device |
| 06/26/1997 | WO1997022989A1 Process for single mask c4 solder bump fabrication |
| 06/26/1997 | WO1997022860A1 Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays |
| 06/26/1997 | WO1997016846A3 Chip module |
| 06/26/1997 | DE19653956A1 Flat heat tube device for e.g. IGBT or intelligent power module |
| 06/26/1997 | DE19653499A1 Solder application method for solder bump manufacture in e.g. ball grid array |
| 06/26/1997 | DE19634202A1 Semiconductor power module with semiconductor heat convecting heat radiator plate |
| 06/26/1997 | DE19617055C1 High-density multilayer prepreg semiconductor power module |
| 06/26/1997 | DE19548062A1 Elektrisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - sowie ein Verfahren zu dessen Herstellung Electrical component, in particular working with surface acoustic wave device - SAW component - as well as a process for its preparation |
| 06/26/1997 | DE19548050A1 Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - Electronic component, in particular operating with acoustic surface waves component - SAW component - |
| 06/26/1997 | DE19548046A1 Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen A method for preparing suitable for a flip-chip mounting contacts of electrical components |
| 06/25/1997 | EP0780898A1 Semiconductor device comprising semiconductor power elements |
| 06/25/1997 | EP0780897A1 High-speed MOS-technology power device integrated structure with reduced gate resistance |
| 06/25/1997 | EP0780896A2 Improvements in or relating to electronic packages |
| 06/25/1997 | EP0780894A2 Method of forming submicron contacts and vias in an integrated circuit |
| 06/25/1997 | EP0780893A2 Semiconductor device and method of manufacturing the same |
| 06/25/1997 | EP0780766A2 Array on substrate and producing method therefor |
| 06/25/1997 | EP0780720A1 Method for repairing low noise metal lines in thin film imagers |
| 06/25/1997 | EP0780694A1 Fabrication of a reference sample for a device for determination of the implanted dose |
| 06/25/1997 | EP0780436A1 Epoxy resin composition |
| 06/25/1997 | EP0780435A1 Flexible epoxy adhesives with low bleeding tendency |
| 06/25/1997 | EP0780351A1 Aluminum nitride sinter and process for the production thereof |
| 06/25/1997 | EP0780007A1 Radio frequency circuit and memory in thin flexible package |
| 06/25/1997 | EP0780005A1 Support element |
| 06/25/1997 | EP0780004A1 Circuit with a chip card module and a coil connected therewith |
| 06/25/1997 | EP0779906A1 Epoxy resin mixtures for prepregs and composites |
| 06/25/1997 | EP0779904A1 Epoxy resin mixtures for prepregs and composites |
| 06/25/1997 | EP0779891A1 Novel acylphosphine oxides |
| 06/25/1997 | CN1152799A Semiconductor device and making process |
| 06/25/1997 | CN1152797A Elements with resin shell capsulation and making method |
| 06/25/1997 | CN1152794A Semiconductor device and making process |
| 06/24/1997 | US5642307 Die identifier and die indentification method |
| 06/24/1997 | US5642276 High frequency surface mount transformer-diode power module |
| 06/24/1997 | US5642265 Ball grid array package with detachable module |
| 06/24/1997 | US5642262 High-density programmable logic device in a multi-chip module package with improved interconnect scheme |
| 06/24/1997 | US5642261 Ball-grid-array integrated circuit package with solder-connected thermal conductor |
| 06/24/1997 | US5641997 Plastic-encapsulated semiconductor device |
| 06/24/1997 | US5641996 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging |
| 06/24/1997 | US5641995 Electronic circuit device |
| 06/24/1997 | US5641994 Integrated circuits; improved electromigration characteristics |
| 06/24/1997 | US5641993 Having grain size of aluminum or alloy in lower wiring layer smaller than minimum bottom size of contact holes to prevent disconnection of wiring layers at interfaces |
| 06/24/1997 | US5641992 Comprising a titanium nitride layer preventing silicon precipitates |
| 06/24/1997 | US5641991 Semiconductor device containing conductor plug that can reduce contact resistance |
| 06/24/1997 | US5641990 Laminated solder column |
| 06/24/1997 | US5641988 Multi-layered, integrated circuit package having reduced parasitic noise characteristics |
| 06/24/1997 | US5641987 Heat spreader suitable for use in semiconductor packages having different pad sizes |
| 06/24/1997 | US5641985 In an integrated circuit device |
| 06/24/1997 | US5641983 Semiconductor device having a gate electrode having a low dopant concentration |
| 06/24/1997 | US5641981 Semiconductor apparatus and horizontal register for solid-state image pickup apparatus with protection circuit for bypassing an excess signal |
| 06/24/1997 | US5641978 Input/output buffer layout having overlapping buffers for reducing die area of pad-limited integrated circuit |
| 06/24/1997 | US5641976 Pressure contact type semiconductor device with axial bias and radial restraint between a distortion buffer plate and a semiconductor body |
| 06/24/1997 | US5641946 Method and circuit board structure for leveling solder balls in ball grid array semiconductor packages |
| 06/24/1997 | US5641945 Contacting structure with respect to spherical bump |
| 06/24/1997 | US5641840 Epoxy resin composition for sealing photosemiconductor element and photosemiconductor device sealed with the epoxy resin composition |
| 06/24/1997 | US5641839 Heat resistance, moldability, reduced stress |
| 06/24/1997 | US5641718 Integrated circuits, thermoconductivity |