| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/16/1997 | CN1154576A Conductor for forming conductive path on integrated circuit and method |
| 07/16/1997 | CN1154575A Semiconductor integrated circuit device having multi-level wiring structure without dot pattern and process of fabrication thereof |
| 07/16/1997 | CN1154574A TAB tape and semiconductor device including TAB tape |
| 07/15/1997 | US5648893 Upgradable multi-chip module |
| 07/15/1997 | US5648890 Upgradable multi-chip module |
| 07/15/1997 | US5648889 Attachment device for semiconductor circuit elements |
| 07/15/1997 | US5648687 Resin for sealing compound semiconductor, semiconductor device, and process for manufacturing it |
| 07/15/1997 | US5648686 Connecting electrode portion in semiconductor device |
| 07/15/1997 | US5648685 For an electro-optical device |
| 07/15/1997 | US5648684 Endcap chip with conductive, monolithic L-connect for multichip stack |
| 07/15/1997 | US5648683 Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package |
| 07/15/1997 | US5648682 Resin-sealed semiconductor device and lead frame used in a resin-sealed semiconductor device |
| 07/15/1997 | US5648681 Semiconductor device having a supporting lead to support a bypass lead portion |
| 07/15/1997 | US5648680 Lead-on-chip semiconductor device |
| 07/15/1997 | US5648679 Tape ball lead integrated circuit package |
| 07/15/1997 | US5648678 Programmable element in barrier metal device |
| 07/15/1997 | US5648320 Thermosetting resins |
| 07/15/1997 | US5648299 Packaged semiconductor device and a leadframe therefor |
| 07/15/1997 | US5648157 Multilayer; metal plate, conductor circuit and dielectric |
| 07/15/1997 | US5648156 Metal base board and electronic equipment using the same |
| 07/15/1997 | US5648148 Thermal management of electronic components using synthetic diamond |
| 07/15/1997 | US5648146 Multilayer |
| 07/15/1997 | US5647750 Socket for a tape carrier package |
| 07/15/1997 | US5647740 Lead frame baking oven |
| 07/15/1997 | US5647528 Bondhead lead clamp apparatus and method |
| 07/15/1997 | US5647527 Method of determining order of wire-bonding |
| 07/15/1997 | US5647430 Electronic component cooling unit |
| 07/15/1997 | US5647429 Coupled, flux transformer heat pipes |
| 07/15/1997 | US5647124 Method of attachment of a semiconductor slotted lead to a substrate |
| 07/15/1997 | US5647122 Manufacturing method for an integrated circuit card |
| 07/10/1997 | WO1997024763A1 An integrated circuit package with internally readable permanent identification of device characteristics |
| 07/10/1997 | WO1997024762A1 Rectifier diode |
| 07/10/1997 | WO1997024755A1 Semiconductor structure using modulation doped silicate glasses |
| 07/10/1997 | WO1997024740A1 High density inter-chip connections by electromagnetic coupling |
| 07/10/1997 | WO1997024402A1 Epoxy resin composition |
| 07/10/1997 | DE19600481A1 Chip- or intelligent-card design |
| 07/09/1997 | EP0783183A2 Semiconductor device and method of fabrication |
| 07/09/1997 | EP0783182A2 Fuse in a semiconductor integrated circuit |
| 07/09/1997 | EP0783178A2 Gas-dielectric interconnect process |
| 07/09/1997 | EP0783177A1 Method for the production of a microcapsule type conductive filler |
| 07/09/1997 | EP0782766A2 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 07/09/1997 | EP0782765A1 Polymer stud grid array |
| 07/09/1997 | EP0516765B1 Methods of forming electronic packages |
| 07/09/1997 | CN2257637Y Vacuume quartz heater |
| 07/09/1997 | CN1154180A 半导体器件 Semiconductor devices |
| 07/09/1997 | CN1153999A Semiconductor package having connection member |
| 07/09/1997 | CN1153998A Loc (Lead on chip) package and fabricating method thereof |
| 07/09/1997 | CN1153997A Improved integrated chip package with reduced dimensions |
| 07/09/1997 | CN1153748A Glass composition having low dielectric constant for high-frequency circuits |
| 07/08/1997 | US5646879 Zener programmable read only memory |
| 07/08/1997 | US5646831 Electrically enhanced power quad flat pack arrangement |
| 07/08/1997 | US5646830 Semiconductor device having an interconnecting circuit board |
| 07/08/1997 | US5646829 Resin sealing type semiconductor device having fixed inner leads |
| 07/08/1997 | US5646828 Thin packaging of multi-chip modules with enhanced thermal/power management |
| 07/08/1997 | US5646827 Electronic device having a plurality of circuit boards arranged therein |
| 07/08/1997 | US5646826 Printed circuit board and heat sink arrangement |
| 07/08/1997 | US5646824 Electronic equipment and lap-top type electronic equipment |
| 07/08/1997 | US5646543 Integrated circuit having reduced inductive noise |
| 07/08/1997 | US5646452 Registration accuracy measurement mark for semiconductor devices |
| 07/08/1997 | US5646451 Multifunctional chip wire bonds |
| 07/08/1997 | US5646450 Semiconductor structures and method of manufacturing |
| 07/08/1997 | US5646449 Semiconductor device having a multi-layered conductive structure which includes an aluminum alloy layer, a high melting temperature metal layer, and a high melting temperature nitride layer |
| 07/08/1997 | US5646446 Three-dimensional flexible assembly of integrated circuits |
| 07/08/1997 | US5646445 Semiconductor device having electrodes embedded in an insulating case |
| 07/08/1997 | US5646444 Apparatus and method for mounting a component to an electrical circuit |
| 07/08/1997 | US5646443 Semiconductor package |
| 07/08/1997 | US5646442 Contact structure for IC socket |
| 07/08/1997 | US5646441 TCP TAB design with radial outer leads |
| 07/08/1997 | US5646440 Interlayer dielectric structure for semiconductor device |
| 07/08/1997 | US5646439 Electronic chip component with passivation film and organic protective film |
| 07/08/1997 | US5646438 Programmable semiconductor memory |
| 07/08/1997 | US5646434 Semiconductor component with protective structure for protecting against electrostatic discharge |
| 07/08/1997 | US5646373 Apparatus for improving the power dissipation of a semiconductor device |
| 07/08/1997 | US5646315 Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives |
| 07/08/1997 | US5646204 Epoxy resin composition and resin-encapsulated semiconductor device |
| 07/08/1997 | US5646070 Hydrosilation |
| 07/08/1997 | US5646068 Forming regions on substrate for connection of electrical components to substrate using first metallurgy, form pattern of bumps using second metallurgy on coupon, applying bumps to substrate |
| 07/08/1997 | US5646067 Depositing multilayer barrier and adhesion material |
| 07/08/1997 | US5645937 At least two diamond layers and at least one interlayer of brazing alloy containing at least one carbide-forming metal |
| 07/08/1997 | US5645787 Sealing semiconductor chip by transfer molding |
| 07/08/1997 | US5645123 Semiconductor device having temperature regulation means formed in circuit board |
| 07/03/1997 | WO1997024021A1 Substrate for mounting electronic part and process for manufacturing the same |
| 07/03/1997 | WO1997023950A1 Electronic component, especially one operating with acoustic surface waves (sw component) |
| 07/03/1997 | WO1997023949A1 Electrical component, especially one operating with acoustic surface waves (sw component) and process for its production |
| 07/03/1997 | WO1997023907A1 Reduced pitch laser redundancy fuse bank structure |
| 07/03/1997 | WO1997023904A1 Process for producing contacts on electrical components suitable for a flip-chip assembly |
| 07/03/1997 | DE19654737A1 Semiconductor device for LSI devices |
| 07/03/1997 | DE19653614A1 Connection or interconnection formation method for semiconductor component |
| 07/03/1997 | DE19636693A1 Single chip memory device for board, video card and cash memory |
| 07/03/1997 | DE19623156A1 Laminated coupling structure for semiconductor memory |
| 07/03/1997 | DE19603654C1 Verfahren zum Löten eines Halbleiterkörpers auf eine Trägerplatte und Halbleiterkörper zur Durchführung des Verfahrens A method for soldering a semiconductor body on a support plate and the semiconductor body for performing the method |
| 07/03/1997 | DE19549202A1 Gleichrichterdiode Rectifier diode |
| 07/03/1997 | DE19549011A1 Power semiconductor module with parallel IGBT chips |
| 07/03/1997 | CA2241132A1 Electronic component, especially one operating with acoustic surface waves (sw component) |
| 07/03/1997 | CA2241100A1 Electrical component, especially one operating with acoustic surface waves (sw component) and process for its production |
| 07/03/1997 | CA2241037A1 Method for the production of contacts of electrical components, said contacts being suitable for flip-chip mounting |
| 07/02/1997 | EP0782254A1 Microelectronic device package and method |
| 07/02/1997 | EP0782201A1 MOS-technology power device integrated structure |
| 07/02/1997 | EP0782198A2 High-voltage bipolar transistor utilizing field-terminated bond-pad electrodes |
| 07/02/1997 | EP0782190A2 Semiconductor device comprising an inductor element |