| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/30/1997 | CN2258657Y Structure improved integrated unit jacket |
| 07/30/1997 | CN1155760A Controlled profile multiple chip modules |
| 07/30/1997 | CN1155759A Silicon nitride ceramic circuit substrate and semiconductor device using the same |
| 07/29/1997 | USRE35573 Heat sink clip assembly |
| 07/29/1997 | US5652696 Mechanically captivated integrated circuit chip |
| 07/29/1997 | US5652693 Substrate with thin film capacitor and insulating plug |
| 07/29/1997 | US5652557 Transmission lines and fabricating method thereof |
| 07/29/1997 | US5652467 Semiconductor device and package structure therefore and power inverter having semiconductor device |
| 07/29/1997 | US5652466 Package for a semiconductor element |
| 07/29/1997 | US5652465 Semiconductor device having dummy patterns and an upper insulating layer having cavities |
| 07/29/1997 | US5652464 Integrated circuit with a titanium nitride contact barrier having oxygen stuffed grain boundaries |
| 07/29/1997 | US5652463 Transfer modlded electronic package having a passage means |
| 07/29/1997 | US5652462 Multilevel semiconductor integrated circuit device |
| 07/29/1997 | US5652461 Semiconductor device with a convex heat sink |
| 07/29/1997 | US5652459 Moisture guard ring for integrated circuit applications |
| 07/29/1997 | US5652454 Semiconductor device on an SOI substrate |
| 07/29/1997 | US5652452 Semiconductor device with pluralities of gate electrodes |
| 07/29/1997 | US5652449 Semiconductor device with an insulating film separating conductive layers and method of maufacturing semiconductor device |
| 07/29/1997 | US5652186 Semiconductor device and a method of manufacturing thereof |
| 07/29/1997 | US5652185 Maximized substrate design for grid array based assemblies |
| 07/29/1997 | US5652184 Method of manufacturing a thin semiconductor package having many pins and likely to dissipate heat |
| 07/29/1997 | US5652175 Method for manufacturing a fuse structure |
| 07/29/1997 | US5652169 Contact hole has concave region along edges; forming conductive link in concave region; forming capping insulation film over conductive link |
| 07/29/1997 | US5652160 Method of fabricating a buried contact structure with WSix sidewall spacers |
| 07/29/1997 | US5652157 Deep, narrow conductor having a depth larger than width to minimize signal interference effects in an integrated circuit of a three-dimensional architecture |
| 07/29/1997 | US5651688 Apparatus for mounting CPU heat dissipator |
| 07/29/1997 | US5651495 Thermoelectric cooler assisted soldering |
| 07/29/1997 | US5651414 Heat-pipe type cooling apparatus |
| 07/29/1997 | US5651180 Method of making a filled via in a dielectric substrate |
| 07/29/1997 | US5651179 Conductive adhesive |
| 07/24/1997 | WO1997026727A2 Microchip partly or entirely surrounded by opaque sheathing |
| 07/24/1997 | WO1997026679A1 Antireflective coating and wiring line stack |
| 07/24/1997 | WO1997026665A1 Over-voltage protection device and method for making same |
| 07/24/1997 | DE19601649A1 Electronic component heat extracting apparatus for e.g. electronics of motor vehicle |
| 07/23/1997 | EP0785616A1 A balanced integrated semiconductor device operating with a parallel resonator circuit |
| 07/23/1997 | EP0785575A2 Semiconductor device and semiconductor module |
| 07/23/1997 | EP0785574A2 Method of forming tungsten-silicide |
| 07/23/1997 | EP0785557A1 Composite magnetic material and product for eliminating electromagnetic interference |
| 07/23/1997 | EP0613610B1 Magnetic vias within a multilayer circuit board |
| 07/23/1997 | CN2258319Y Diode capable of being stuck on circuit board |
| 07/23/1997 | CN1155370A Radiator by using oppositelly bonded fins to form ducts and cooling system to multi-microprocessor by using blower |
| 07/23/1997 | CN1155164A Multi-layer interlined structure for integrated circuit and mfg. method thereof |
| 07/23/1997 | CN1155163A Packed semicondcutor chip with reinforced heat-conductivity |
| 07/23/1997 | CN1155162A Mfg. method for semiconductor packed according to chip size |
| 07/23/1997 | CN1155161A Hand connect/disconnect machine |
| 07/23/1997 | CN1155158A Multi-layer circuit substrate and mfg. method thereof |
| 07/23/1997 | CN1154993A Lead-wire protective coating composition, prepn. method and its structure |
| 07/22/1997 | US5650920 Mount for supporting a high frequency transformer in a hybrid module |
| 07/22/1997 | US5650919 Apparatus including a peak shaped dielectric dam |
| 07/22/1997 | US5650918 Semiconductor device capable of preventing occurrence of a shearing stress |
| 07/22/1997 | US5650915 Thermally enhanced molded cavity package having a parallel lid |
| 07/22/1997 | US5650914 Compliant thermal connectors, methods of making the same and assemblies incorporating the same |
| 07/22/1997 | US5650913 Thermally activated clamping apparatus and component part and method of use thereof |
| 07/22/1997 | US5650912 Heat sink for cooling a heat producing element and application |
| 07/22/1997 | US5650760 Microwave enclosure |
| 07/22/1997 | US5650666 Method and apparatus for preventing cracks in semiconductor die |
| 07/22/1997 | US5650665 Hybrid integrated circuit device including circuit patterns of different conductivity and circuit elements mounted on an insulating substrate |
| 07/22/1997 | US5650664 Connector effecting an improved electrical connection and a semiconductor apparatus using such connector |
| 07/22/1997 | US5650663 Electronic package with improved thermal properties |
| 07/22/1997 | US5650662 Multilayer substrate with ceramic surface bonding to heat distributor through an eutectic metal having high melting |
| 07/22/1997 | US5650661 Protective coating combination for lead frames |
| 07/22/1997 | US5650660 Circuit pattern for a ball grid array integrated circuit package |
| 07/22/1997 | US5650659 Semiconductor component package assembly including an integral RF/EMI shield |
| 07/22/1997 | US5650651 Plasma damage reduction device for sub-half micron technology |
| 07/22/1997 | US5650650 High speed semiconductor device with a metallic substrate |
| 07/22/1997 | US5650640 Integrated electro-optic package |
| 07/22/1997 | US5650639 Integrated circuit with diamond insulator |
| 07/22/1997 | US5650638 Semiconductor device having a passivation layer |
| 07/22/1997 | US5650637 Active matrix assembly |
| 07/22/1997 | US5650629 Field-symmetric beam detector for semiconductors |
| 07/22/1997 | US5650595 Electronic module with multiple solder dams in soldermask window |
| 07/22/1997 | US5650593 Thermally enhanced chip carrier package |
| 07/22/1997 | US5650592 Graphite composites for electronic packaging |
| 07/22/1997 | US5650360 Method for manufacturing semiconductor device with multilayer wiring structure, including improved step of forming insulating film which covers wiring layer |
| 07/22/1997 | US5650359 First, silicon dioxide film is deposited by plasma-enhanced decomposition of tetraethoxysilane, followed by second silicon oxide layer by reacting ozone with tetraethoxysilane, finally silicon nitride film is deposited |
| 07/22/1997 | US5650357 Process for manufacturing a lead frame capacitor and capacitively-coupled isolator circuit using same |
| 07/22/1997 | US5650355 Process of making and process of trimming a fuse in a top level metal and in a step |
| 07/22/1997 | US5650199 Printing an electrode on a ceramic layer with conductive ink, printing a pattern, coating with wet ceramic slurry, drying and printing |
| 07/22/1997 | US5649981 Tool and fixture for the removal of tab leads bonded to semiconductor die pads |
| 07/22/1997 | US5649836 Electrical connector having a menber preloading a contact to reduce an insertion force |
| 07/22/1997 | US5649593 Radiator member |
| 07/17/1997 | WO1997025847A1 Shielding of electronic components embedded in plastics directly on circuit board |
| 07/17/1997 | WO1997025743A1 Laser antifuse using gate capacitor |
| 07/17/1997 | WO1997025742A1 Multi-chip integrated circuit package |
| 07/17/1997 | WO1997025741A1 Cooling unit with pin elements |
| 07/17/1997 | DE4115043A1 High density interconnect structure for packaging microwave and other overlay sensitive chips |
| 07/17/1997 | DE19700523A1 Test apparatus for testing multipolar integrated circuit chip using burn-in test |
| 07/17/1997 | DE19601390A1 Mikrochip mit einem diesen ganz oder teilweise umgebenden lichtundurchlässigen Ummantelungsabschnitt Microchip with a surrounding wholly or partially opaque shroud portion |
| 07/17/1997 | DE19600769A1 Security module with integral safety foil e.g. for electronic cash protection |
| 07/17/1997 | DE19600401A1 Surface-mounted semiconductor device |
| 07/17/1997 | DE19600166A1 Cooling body |
| 07/17/1997 | DE19600164A1 Cooling body |
| 07/16/1997 | EP0784342A2 Pressure contact type semiconductor device and assembly method therefor |
| 07/16/1997 | EP0784341A1 Method of manufacture of material for semiconductor substrate, material for semiconductor substrate, and package for semiconductor |
| 07/16/1997 | EP0784338A2 Process for manufacturing trenches or holes side by side |
| 07/16/1997 | EP0784099A2 Copper-chromium-titanium-silicon alloy and its use |
| 07/16/1997 | EP0783765A1 Chip packaging technique |
| 07/16/1997 | EP0783532A1 Milled carbon fiber reinforced polymer composition |
| 07/16/1997 | EP0591174B1 Reworkable adhesive for electronic applications |
| 07/16/1997 | CN1154577A Method and apparatus for forming bumps on substrates |