| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/12/1997 | US5656830 Integrated circuit chip composite having a parylene coating |
| 08/12/1997 | US5656826 Liquid crystal device with thick passivation layer over driver region |
| 08/12/1997 | US5656776 Semiconductor sensor with sealed package |
| 08/12/1997 | US5656551 Interposing adhesive coated carrier having circular cross-section between semiconductor wafer section and support |
| 08/12/1997 | US5656550 Method of producing a semicondutor device having a lead portion with outer connecting terminal |
| 08/12/1997 | US5656548 Method for forming three dimensional processor using transferred thin film circuits |
| 08/12/1997 | US5656547 Method for making a leadless surface mounted device with wrap-around flange interface contacts |
| 08/12/1997 | US5656546 Self-aligned tin formation by N2+ implantation during two-step annealing Ti-salicidation |
| 08/12/1997 | US5656545 Elimination of tungsten dimple for stacked contact or via application |
| 08/12/1997 | US5656543 Whereby even if via is misaligned with line, portion of via not enclosed by metal is enclosed by etch stop spacer, and via is always capped by metal |
| 08/12/1997 | US5656542 Covering substrate with dielectric film having groove, then forming layers of three different metals on film surface and removing them except in groove, annealing and alloying while controlling resistance |
| 08/12/1997 | US5656534 Method for forming an ESD protection device for antifuses with top polysilicon electrode |
| 08/12/1997 | US5656530 Method of making electric field emitter device for electrostatic discharge protection of integrated circuits |
| 08/12/1997 | US5656510 Method for manufacturing gate oxide capacitors including wafer backside dielectric and implantation electron flood gun current control |
| 08/12/1997 | US5656509 Method and test structure for determining gouging in a flash EPROM cell during SAS etch |
| 08/12/1997 | US5656414 Methods of forming tall, high-aspect ratio vias and trenches in photo-imageable materials, photoresist materials, and the like |
| 08/12/1997 | US5655926 Socket for semiconductor device |
| 08/12/1997 | US5655290 Method for making a three-dimensional multichip module |
| 08/12/1997 | CA2125994C Field control and stability enhancement in multi-layer 3-dimensional structures |
| 08/07/1997 | WO1997028675A1 Multiple chip module for mother board |
| 08/07/1997 | WO1997028673A1 Polymer based circuit and method of making same |
| 08/07/1997 | WO1997028564A1 Facet etch for improved step coverage of integrated circuit contacts |
| 08/07/1997 | WO1997028562A1 Contact bump structure and method for fabricating contact bumps |
| 08/07/1997 | WO1997028420A1 Lead inspection apparatus of ic package |
| 08/07/1997 | WO1997028296A1 Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath |
| 08/07/1997 | WO1997028194A1 Dual-curing coating formulation and method |
| 08/07/1997 | DE19640225A1 Semiconductor module with housing for integrated circuit |
| 08/07/1997 | DE19639033C1 Copy prevention arrangement for semiconductor chip |
| 08/07/1997 | DE19603488A1 Cooling arrangement for electrical power component, e.g. in commercial motor vehicle |
| 08/06/1997 | EP0788161A2 Microelectronic device with thin film electrostatic discharge protection structure |
| 08/06/1997 | EP0788160A2 Semiconductor device having a multi-layered wire structure |
| 08/06/1997 | EP0788159A2 Microelectronic integrated circuit mounted on circuit board with solder column interconnection |
| 08/06/1997 | EP0788158A2 Electronic Package |
| 08/06/1997 | EP0788157A2 Resin molded package with excellent high frequency characteristics |
| 08/06/1997 | EP0788156A2 Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD |
| 08/06/1997 | EP0788155A1 Spring clip for electronics assembly |
| 08/06/1997 | EP0788154A2 Electronic circuit substrate |
| 08/06/1997 | EP0788153A2 Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same |
| 08/06/1997 | EP0788152A2 Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance |
| 08/06/1997 | EP0788150A2 Method of soldering a semi-conductor body to a metallic supporting plate |
| 08/06/1997 | EP0787162A2 Curable epoxy resin accelerated by boric acid and its analogs |
| 08/06/1997 | EP0591312B1 Structured conductor tracks and process for making them |
| 08/06/1997 | EP0564652B1 Manufacture of multilayer ceramic part, and multilayer ceramic part |
| 08/06/1997 | CN1156336A Semiconductor apparatus and method for producing semiconductor apparatus |
| 08/06/1997 | CN1156335A Semiconductor device |
| 08/06/1997 | CN1156333A Semiconductor device |
| 08/05/1997 | US5655213 For bonding to sintered ceramic substrates for semiconductors |
| 08/05/1997 | US5655209 Forming plurality of dielectric ceramic layers and of self-supporting conductive layers, firing |
| 08/05/1997 | US5654897 Method and structure for improving patterning design for processing |
| 08/05/1997 | US5654895 For determining a relative strength of a semiconductor fabrication process |
| 08/05/1997 | US5654877 Lead-on-chip integrated circuit apparatus |
| 08/05/1997 | US5654876 Demountable heat sink |
| 08/05/1997 | US5654590 Multichip-module having an HDI and a temporary supporting substrate |
| 08/05/1997 | US5654589 Having titanium/titanium nitride stack interconnect structures usable both as local interconnects and as contact landing pads |
| 08/05/1997 | US5654588 Semiconductor wafer |
| 08/05/1997 | US5654587 Stackable heatsink structure for semiconductor devices |
| 08/05/1997 | US5654586 High thermal conductivity, avoidance of fatigue, cracking |
| 08/05/1997 | US5654585 Semiconductor device with at least one lead having a plurality of bent portions |
| 08/05/1997 | US5654584 Semiconductor device having tape automated bonding leads |
| 08/05/1997 | US5654582 Circuit wafer and TEG test pad electrode |
| 08/05/1997 | US5654575 TiSi2 /TiN clad interconnect technology |
| 08/05/1997 | US5654567 Capacitor, electrode or wiring structure, and semi conductor device |
| 08/05/1997 | US5654564 Interconnect structure with programmable IC for interconnecting electronic components, including circuitry for controlling programmable IC |
| 08/05/1997 | US5654563 Microelectronic integrated circuit including triangular semiconductor "or"g |
| 08/05/1997 | US5654559 Optical coupling device and method for manufacturing the same |
| 08/05/1997 | US5654245 Implantation of nucleating species for selective metallization and products thereof |
| 08/05/1997 | US5654243 Process for fabricating a semiconductor device in a resin package housed in a frame having high conductivity |
| 08/05/1997 | US5654239 Method of manufacturing a contact structure of an interconnection layer for a semiconductor device and a multilayer interconnection SRAM |
| 08/05/1997 | US5654236 Method for manufacturing contact structure capable of avoiding short-circuit |
| 08/05/1997 | US5654235 Method of manufacturing contact structure using barrier metal |
| 08/05/1997 | US5654220 Method of making a stacked 3D integrated circuit structure |
| 08/05/1997 | US5654206 Amorphous silicon layer for top surface of semiconductor device |
| 08/05/1997 | US5654205 Apparatus and method for depositing particles onto a wafer |
| 08/05/1997 | US5653891 Etching thermally conductive material to separate into plurality of convex heat sinks each having projecting portion |
| 08/05/1997 | US5653834 Insulating opening with nickel oxideand glass; filling with conductive metal |
| 08/05/1997 | US5653599 Method and apparatus for retention of a fragile conductive trace with a protective clamp |
| 08/05/1997 | US5653597 Pin socket with connecting portions |
| 08/05/1997 | US5653285 Heat sink apparatus |
| 08/05/1997 | US5653280 Heat sink assembly and method of affixing the same to electronic devices |
| 08/05/1997 | US5653017 Method of mechanical and electrical substrate connection |
| 08/05/1997 | CA2196641A1 Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same |
| 07/31/1997 | WO1997027627A1 Lead frame with circular lead tip layout and improved assembly |
| 07/31/1997 | WO1997027626A1 Integrated circuit package having enhanced heat dissipation and grounding |
| 07/31/1997 | WO1997027625A1 Process for fitting a frame on a substrate and device for implementing it |
| 07/31/1997 | WO1997027619A2 Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method |
| 07/31/1997 | WO1997027492A1 Method for mounting bare chip and bare chip carrier |
| 07/31/1997 | WO1997022138A3 Flip-chip process for producing a multi-chip module |
| 07/31/1997 | WO1996038031A3 Chip socket assembly and chip file assembly for semiconductor chips |
| 07/31/1997 | DE3051130C2 Bipolar or isolated gate transistor |
| 07/31/1997 | DE19631133A1 Semiconductor device with fuse layer |
| 07/31/1997 | DE19602436A1 Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens Method for mounting a frame on a carrier material and apparatus for carrying out the method |
| 07/30/1997 | EP0786809A1 Electronic circuit package |
| 07/30/1997 | EP0786808A1 Anisotropic conductive sheet and printed circuit board |
| 07/30/1997 | EP0786807A1 Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes |
| 07/30/1997 | EP0786806A1 High I/O density package for high power wire-bonded IC chips and method for making the same |
| 07/30/1997 | EP0786802A2 Wafer dicing/bonding sheet and process for producing semiconductor device |
| 07/30/1997 | EP0786196A1 High conductivity hybrid material for thermal management |
| 07/30/1997 | EP0785917A1 Method of treating an anti-reflective coating on a substrate |
| 07/30/1997 | EP0774162A4 Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities |
| 07/30/1997 | EP0640151B1 Solder bumping of integrated circuit die |