| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/21/1997 | WO1997030494A1 Heat sink including a surface on which an electronic component can be mounted |
| 08/21/1997 | WO1997030480A1 Low resistivity thin film conductor for high temperature integrated circuit electronics |
| 08/21/1997 | WO1997030479A1 Deposition of a conductor in a via hole or trench |
| 08/21/1997 | WO1997030478A1 Semiconductor device and multilayered lead frame used for the same |
| 08/21/1997 | WO1997030477A1 Ball grid array electronic package standoff design |
| 08/21/1997 | WO1997030476A1 Chromium refractory metal alloys conductors for use in high temperature integrated circuits |
| 08/21/1997 | WO1997030475A1 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device |
| 08/21/1997 | WO1997030001A1 Glass and glass-ceramic compositions; glass and glass-ceramic substrates |
| 08/21/1997 | WO1997019462A3 Vertically integrated semiconductor component and method of producing the same |
| 08/21/1997 | WO1997002733A3 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 08/21/1997 | EP0782766A3 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 08/21/1997 | DE19651109A1 Semiconductor device having high integration |
| 08/21/1997 | DE19606053A1 Housing for electrical or electronic components and/or circuits |
| 08/21/1997 | DE19605302A1 Kühlkörper mit einer Montagefläche für ein elektronisches Bauteil Cooling body with a mounting surface for an electronic component |
| 08/20/1997 | EP0790762A2 Conductive cooling of a heat-generating electronic component |
| 08/20/1997 | EP0790653A2 IC package and its assembly method |
| 08/20/1997 | EP0790649A2 Integrated ciruit having integral decoupling capacitor |
| 08/20/1997 | EP0790648A2 Vertical power transistor, circuit and method |
| 08/20/1997 | EP0790647A2 Semiconductor body having a solder layer and method of soldering the semiconductor body on a metal suppporting plate |
| 08/20/1997 | EP0790646A2 Method of forming a wiring layer filling a contact hole |
| 08/20/1997 | EP0790645A2 Intermetal dielectric planarization |
| 08/20/1997 | EP0790643A2 Method of dry etching for patterning refractory metal layer improved in etching rate, anisotropy and selectivity to silicon oxide |
| 08/20/1997 | EP0789934A1 Ballast monitoring for radio frequency power transistors |
| 08/20/1997 | EP0643883A4 Sub-nanoscale electronic systems, devices and processes. |
| 08/20/1997 | CN1157628A Epoxy resin mixtures for prepregs and composites |
| 08/20/1997 | CN1157627A Epoxy resin mixtures for prepregs and composites |
| 08/20/1997 | CN1157625A Phosphorus-modified epoxide resins, process for producing the same and their use |
| 08/20/1997 | CN1157487A Fabrication method of semiconductor device |
| 08/20/1997 | CN1157486A Lead frame taping apparatus and taping method |
| 08/20/1997 | CN1157481A Semiconductor device and method of fabricating same |
| 08/20/1997 | CN1157476A Semiconductor device and making method thereof |
| 08/19/1997 | US5659458 Heat dissipative means for integrated circuit chip package |
| 08/19/1997 | US5659455 Packaging for electronic circuits using a capacitor as a structural member |
| 08/19/1997 | US5659203 Sealing space between surface of chip and surface of substrate with thermoplastic polymer containing a filler and having specified glass transition temperature and that does not degrade at solder relow temperatures |
| 08/19/1997 | US5659202 Semiconductor device with a pair of dummy electrodes below an inner lead |
| 08/19/1997 | US5659201 High conductivity interconnection line |
| 08/19/1997 | US5659200 Semiconductor device having radiator structure |
| 08/19/1997 | US5659199 Resin sealed semiconductor device |
| 08/19/1997 | US5659198 TCP type semiconductor device capable of preventing crosstalk |
| 08/19/1997 | US5659182 Three-terminal fuse |
| 08/19/1997 | US5658994 Microelectronics |
| 08/19/1997 | US5658835 Aluminum, silicon, magnesium, zinc, boron oxides; high adhesive strength |
| 08/19/1997 | US5658831 Providing substrate with integrated circuit chip and heat conducting mechanism with gap mounted thereon, saturating with liquid metal alloy, compressing |
| 08/19/1997 | US5658829 Semiconductor processing method of forming an electrically conductive contact plug |
| 08/19/1997 | US5658828 Method for forming an aluminum contact through an insulating layer |
| 08/19/1997 | US5658827 Method for forming solder balls on a substrate |
| 08/19/1997 | US5658819 Antifuse structure and process for manufacturing the same |
| 08/19/1997 | US5658804 Method for measuring parasitic components of a field effect transistor and a semiconductor integrated circuit |
| 08/19/1997 | US5658698 Microstructure, process for manufacturing thereof and devices incorporating the same |
| 08/19/1997 | US5658664 Thin gold-alloy wire for semiconductor device |
| 08/19/1997 | US5658499 Waterbase binder comprising an acrylic homo- or copolyemr and a neutralizing agent to promot silver flake dispersion |
| 08/19/1997 | US5658153 Socket apparatus |
| 08/19/1997 | US5657538 Method of centering integrated circuit lead frame |
| 08/19/1997 | US5657537 Method for fabricating a stack of two dimensional circuit modules |
| 08/19/1997 | CA2054597C Superconducting circuit and a process for fabricating the same |
| 08/14/1997 | WO1997029515A2 Separable connecting bridge (fuse) and connectable line interruption (anti-fuse) and process for producing and activating a fuse and an anti-fuse |
| 08/14/1997 | WO1997029514A1 Semiconductor component |
| 08/14/1997 | WO1997029513A1 Method of connecting semiconductor chips to a lead frame and assembly carrier for such a method |
| 08/14/1997 | WO1997029512A1 Semiconductor component with a capacitor |
| 08/14/1997 | WO1997019463A3 Chip module |
| 08/14/1997 | DE19704385A1 Connecting semiconductor chip to lead-frame using LOC technology |
| 08/14/1997 | DE19604776A1 Auftrennbare Verbindungsbrücke (Fuse) und verbindbare Leitungsunterbrechung (Anti-Fuse), sowie Verfahren zur Herstellung und Aktivierung einer Fuse und einer Anti-Fuse Disconnectable connecting bridge (FUSE) and connectable to line interruption (anti-fuse), and processes for preparation and activation of a fuse and an antifuse |
| 08/14/1997 | DE19604614A1 Encapsulated electronic control device e.g. for motor vehicles |
| 08/14/1997 | DE19603822A1 Aluminium nitride substrate especially for direct copper bond metallisation |
| 08/13/1997 | EP0789507A2 Encapsulated electronic controlling device and method of fabricating the same |
| 08/13/1997 | EP0789405A2 Method of cooling solar cells |
| 08/13/1997 | EP0789397A2 Circuit board and semiconductor device using the circuit board |
| 08/13/1997 | EP0789396A2 Cooling member for semi-conductor components or the same |
| 08/13/1997 | EP0789394A2 Process for the separation of electronic devices from a body |
| 08/13/1997 | EP0789392A2 Bumpless method of attaching inner leads to semiconductor integrated circuits |
| 08/13/1997 | EP0789390A2 A method for producing multilayer hybrid circuit |
| 08/13/1997 | EP0789334A2 Integrated circuit device having an opening exposing the integrated circuit die and related methods |
| 08/13/1997 | EP0789057A1 Curable epoxy resin compositions and electronic components |
| 08/13/1997 | EP0788659A1 High voltage lateral dmos device with enhanced drift region |
| 08/13/1997 | EP0721588B1 Built-in electronic sensor for the characterization of physical quantities and method of production |
| 08/13/1997 | EP0603296B1 Solder bump fabrication method and solder bumps formed thereby |
| 08/13/1997 | CN2259687Y Micro-high-voltage silicon rectifier stack combination block package die |
| 08/13/1997 | CN1157075A Image display apparatus with line number conversion |
| 08/13/1997 | CN1157057A Method of manufacturing semiconductor device suitable for surface mounting |
| 08/13/1997 | CN1156904A Semiconductor device, method of manufacturing same, and lead frame used therefor |
| 08/13/1997 | CN1156903A Plate and column type semiconductor package having heat sink |
| 08/12/1997 | USRE35578 Cutting metallized layer into electrically insulated zones, covering with polyimide layer, connecting terminals, encapsulating entire component in resin which is hardened by heating, fastening into housing cavity |
| 08/12/1997 | US5657242 Method of determining routes for a plurality of wiring connections and a circuit board produced by such a method |
| 08/12/1997 | US5657207 Alignment means for integrated circuit chips |
| 08/12/1997 | US5657206 Conductive epoxy flip-chip package and method |
| 08/12/1997 | US5657203 Electronic device having a plurality of circuit boards arranged therein |
| 08/12/1997 | US5657199 Close physical mounting of leaded amplifier/receivers to through holes in monolithic, buried-substrate, multiple capacitors simultaneous with electrical connection to dual capacitors otherwise transpiring, particularly for hearing aid filters |
| 08/12/1997 | US5656864 Semiconductor device having upper and lower package bodies and manufacturing method thereof |
| 08/12/1997 | US5656863 Resin seal semiconductor package |
| 08/12/1997 | US5656862 Gap created by solder connections filled with curable cycloaliphatic polyepoxide or cyanate ester |
| 08/12/1997 | US5656861 Integrated circuit |
| 08/12/1997 | US5656860 Wiring structure for semiconductor device and fabrication method therefor |
| 08/12/1997 | US5656858 Semiconductor device with bump structure |
| 08/12/1997 | US5656857 Semiconductor device with insulating resin layer and substrate having low sheet resistance |
| 08/12/1997 | US5656856 Reduced noise semiconductor package stack |
| 08/12/1997 | US5656855 Lead frame and method for manufacturing same |
| 08/12/1997 | US5656854 Lead frame for a multiplicity of terminals |
| 08/12/1997 | US5656849 Two-level spiral inductor structure having a high inductance to area ratio |
| 08/12/1997 | US5656848 High thermal resistance backfill material for hybrid UFPA's |
| 08/12/1997 | US5656841 Semiconductor device with contact hole |