| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/03/1997 | EP0792462A1 Probe card assembly and kit, and methods of using same |
| 09/03/1997 | EP0792408A2 Downhole system for extending the life span of electronic components |
| 09/03/1997 | CN2261677Y Uninsulated electric power semiconductor module |
| 09/03/1997 | CN1158689A Printed wiring board, method of producing the same and electronic device |
| 09/03/1997 | CN1158581A Method of marking works |
| 09/03/1997 | CN1158549A Microchannel cooling heat sink |
| 09/03/1997 | CN1158497A Method for packing semiconductor |
| 09/02/1997 | US5663872 Encapsulation of electronic components |
| 09/02/1997 | US5663677 Integrated circuit multi-level interconnection technique |
| 09/02/1997 | US5663654 For testing an array of semiconductor dice located on a wafer |
| 09/02/1997 | US5663651 Method of separately determining plug resistor and interfacial resistor and test pattern for the same |
| 09/02/1997 | US5663599 Metal layout pattern for improved passivation layer coverage |
| 09/02/1997 | US5663598 Electrical circuit bonding interconnect component and flip chip interconnect bond |
| 09/02/1997 | US5663597 RF device package for high frequency applications |
| 09/02/1997 | US5663596 Semiconductor chip |
| 09/02/1997 | US5663595 Diamond heat sink comprising synthetic diamond film |
| 09/02/1997 | US5663594 Ball grid array type of semiconductor device |
| 09/02/1997 | US5663593 Electrical device |
| 09/02/1997 | US5663591 Antifuse with double via, spacer-defined contact |
| 09/02/1997 | US5663590 Product of process for formation of vias (or contact openings) and fuses in the same insulation layer with minimal additional steps |
| 09/02/1997 | US5663530 For an electronic device |
| 09/02/1997 | US5663108 Semiconductors |
| 09/02/1997 | US5663106 Method of encapsulating die and chip carrier |
| 09/02/1997 | US5663104 Method of manufacturing a semiconductor device for power supply use |
| 09/02/1997 | US5663102 Method for forming multi-layered metal wiring semiconductor element using cmp or etch back |
| 09/02/1997 | US5663101 Semiconductor structure having multiple levels of self-aligned interconnection metallization, and methods for its preparation |
| 09/02/1997 | US5663099 Method for producing semiconductor device having alignment mark |
| 09/02/1997 | US5663097 Method of fabricating a semiconductor device having an insulating side wall |
| 09/02/1997 | US5663095 Method of making a micro-dimensional coupling conductor |
| 09/02/1997 | US5663094 Process for producing semiconductor device with wire for three conductive layers |
| 09/02/1997 | US5663091 Method for fabricating an electrically programmable antifuse |
| 09/02/1997 | US5662755 Method of making multi-layered ceramic substrates |
| 09/02/1997 | US5662263 Single point bonding method |
| 09/02/1997 | US5662163 Readily removable heat sink assembly |
| 09/02/1997 | US5661902 Methods of making printed circuit boards and heat sink structures |
| 09/02/1997 | US5661882 Method of integrating electronic components into electronic circuit structures made using LTCC tape |
| 09/01/1997 | CA2198786A1 Photoimageable, dielectric crosslinkable copolyesters |
| 08/28/1997 | WO1997031513A1 Heat conductive device |
| 08/28/1997 | WO1997031512A1 Cooling body for cooling power gates |
| 08/28/1997 | WO1997031394A1 Semiconductor device and method for manufacturing the same |
| 08/28/1997 | WO1997031393A1 Method of making an air tight cavity in an assembly package |
| 08/28/1997 | WO1997031236A1 Active heat sink structure with flow augmenting rings and method for removing heat |
| 08/28/1997 | DE3051195C2 Package for integrated circuit incorporated in identity cards |
| 08/28/1997 | DE19635071C1 Screening of a microelectronic circuit chip on an integrated circuit board |
| 08/28/1997 | DE19606972A1 Kühlkörper zum Kühlen von Leistungsbauelementen Heat sink for cooling of power components |
| 08/28/1997 | DE19546997A1 Joining metal to non-metallic, especially glass or ceramic part |
| 08/28/1997 | CA2196024A1 Multilayer electronic assembly utilizing a sinterable composition and related method of forming |
| 08/27/1997 | EP0791963A1 Integrated circuit with gate-array interconnections routed over memory area |
| 08/27/1997 | EP0791960A2 Semiconductor devices having protruding contacts and method for making the same |
| 08/27/1997 | EP0791663A1 Titanium nitride barrier layers |
| 08/27/1997 | EP0791567A1 Electronic coating composition |
| 08/27/1997 | EP0791228A1 Enhanced electromigration lifetime of metal interconnection lines |
| 08/27/1997 | EP0791227A1 Forming a planar surface over a substrate by modifying the topography of the substrate |
| 08/27/1997 | EP0526456B1 A multi-layer package incorporating a recessed cavity for a semiconductor chip |
| 08/27/1997 | CN1158006A High density interconnected circuit module with compliant layer as part of stress-reducing molded substrate |
| 08/27/1997 | CN1158005A Semiconductor device capable of preventing crosstalk between metal lines and method of manufacturing the same |
| 08/27/1997 | CN1158004A Composite silicon-on-insulator substrate and method of fabricating the same |
| 08/27/1997 | CN1158002A Intermetal dielectric planarization ULSI circuits |
| 08/27/1997 | CN1158000A Label for semiconductor wafer |
| 08/27/1997 | CN1157934A Active matrix liquid crystal display |
| 08/26/1997 | US5661639 Structure for attaching a heat sink to a semiconductor device |
| 08/26/1997 | US5661638 High performance spiral heat sink |
| 08/26/1997 | US5661637 Thermal management system having a thermally conductive sheet and a liquid transporting material |
| 08/26/1997 | US5661420 Mounting configuration for monolithic integrated circuit |
| 08/26/1997 | US5661409 Field programmable printed circuit board |
| 08/26/1997 | US5661345 Semiconductor device having a single-crystal metal wiring |
| 08/26/1997 | US5661344 Porous dielectric material with a passivation layer for electronics applications |
| 08/26/1997 | US5661343 Power hybrid integrated circuit apparatus |
| 08/26/1997 | US5661342 Semiconductor device with heat sink including positioning pins |
| 08/26/1997 | US5661341 Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method |
| 08/26/1997 | US5661339 Thin multichip module |
| 08/26/1997 | US5661338 Chip mounting plate construction of lead frame for semiconductor package |
| 08/26/1997 | US5661337 Technique for improving bonding strength of leadframe to substrate in semiconductor IC chip packages |
| 08/26/1997 | US5661336 Tape application platform and processes therefor |
| 08/26/1997 | US5661334 Inter-metal dielectric structure which combines fluorine-doped glass and barrier layers |
| 08/26/1997 | US5661331 Fuse bank |
| 08/26/1997 | US5661330 Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses |
| 08/26/1997 | US5661327 Transistor structure and method for fabricating the same |
| 08/26/1997 | US5661323 Integrated circuit fuse programming and reading circuits |
| 08/26/1997 | US5661093 Method for the stabilization of halogen-doped films through the use of multiple sealing layers |
| 08/26/1997 | US5661090 Process and apparatus for manufacturing ceramic semiconductor packages |
| 08/26/1997 | US5661089 Method for making a semiconductor chip package with enhanced thermal conductivity |
| 08/26/1997 | US5661088 Disposing a malleable metallic layer overlying the first surface of substrate and hole, diposing an electroconductive layer in the hole, coupled to malleable layer, deforming the malleable layer, disposing an encapsulant into the hole |
| 08/26/1997 | US5661087 Vertical interconnect process for silicon segments |
| 08/26/1997 | US5661086 Process for manufacturing a plurality of strip lead frame semiconductor devices |
| 08/26/1997 | US5661085 Method for forming a low contact leakage and low contact resistance integrated circuit device electrode |
| 08/26/1997 | US5661082 Process for forming a semiconductor device having a bond pad |
| 08/26/1997 | US5661081 Method of bonding an aluminum wire to an intergrated circuit bond pad |
| 08/26/1997 | US5661078 Method of manufacturing a semiconductor device having a wiring formed by silver bromide |
| 08/26/1997 | US5661071 Heavily doped n-type silicon coated with a layer of oxide-nitride-oxide, top contact is made through a layer of tungsten silicide sandwiched between two layers of n-type polysilicon |
| 08/26/1997 | US5660921 Poly (aryl ether benzimidazoles) their use capping layers in microelectronic structures |
| 08/26/1997 | US5660920 Integrated circuit; crosslinked polymer |
| 08/26/1997 | US5660917 Thermal conductivity sheet |
| 08/26/1997 | US5660708 Process for manufacturing a lead frame |
| 08/26/1997 | US5660696 Method for forming metal lines by sputtering |
| 08/26/1997 | US5660321 Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts |
| 08/26/1997 | US5660227 Heat exchanger for high power electrical component |
| 08/26/1997 | US5659953 Method of manufacturing an apparatus having inner layers supporting surface-mount components |
| 08/26/1997 | US5659952 Method of fabricating compliant interface for semiconductor chip |
| 08/26/1997 | US5659950 Method of forming a package assembly |