| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/16/1997 | US5668408 Packaging assembly |
| 09/16/1997 | US5668407 Integrated circuit carrier having lead-socket array with various inner dimensions |
| 09/16/1997 | US5668406 Semiconductor device having shielding structure made of electrically conductive paste |
| 09/16/1997 | US5668405 Semiconductor device with a film carrier tape |
| 09/16/1997 | US5668404 Semiconductor device and production method thereof |
| 09/16/1997 | US5668399 Semiconductor device with increased on chip decoupling capacitance |
| 09/16/1997 | US5668398 Multilevel interconnect structure with air gaps formed between metal leads |
| 09/16/1997 | US5668389 Optimized power bus structure |
| 09/16/1997 | US5668380 Reduced area metal contact to a thin polysilicon layer contact structure having low ohmic resistance |
| 09/16/1997 | US5668348 CPU dissipator mounting apparatus |
| 09/16/1997 | US5668237 Silicon-containing polymer |
| 09/16/1997 | US5668064 Method of forming a tungsten plug in a semiconductor device |
| 09/16/1997 | US5668060 Outer lead for a semiconductor IC package and a method of fabricating the same |
| 09/16/1997 | US5668059 Filling gap with epoxy binder, filler, curing; noncracking |
| 09/16/1997 | US5668055 Method of filling of contact openings and vias by self-extrusion of overlying compressively stressed matal layer |
| 09/16/1997 | US5668052 Method of manufacturing semiconductor device |
| 09/16/1997 | US5668041 Method of manufacturing a semiconductor device having a capacitor |
| 09/16/1997 | US5668033 Method for manufacturing a semiconductor acceleration sensor device |
| 09/16/1997 | US5668030 Process for making identification alphanumeric code markings for mask ROM devices |
| 09/16/1997 | US5667884 Area bonding conductive adhesive preforms |
| 09/16/1997 | US5667595 Process for manufacturing a solar module and the solar module prepared thereby |
| 09/16/1997 | US5667132 Method for solder-bonding contact pad arrays |
| 09/16/1997 | CA2126121C Chip carrier with protective coating for circuitized surface |
| 09/12/1997 | WO1997033317A1 Chip card with esd-protection |
| 09/12/1997 | WO1997033314A1 Method for fabricating mesa interconnect structures |
| 09/12/1997 | WO1997033312A1 Method of encapsulating a semiconductor package |
| 09/12/1997 | WO1997033308A1 Os RECTIFYING SCHOTTKY AND OHMIC JUNCTION AND W/WC/TiC OHMIC CONTACTS ON SiC |
| 09/12/1997 | CA2248803A1 Os rectifying schottky and ohmic junction and w/wc/tic ohmic contacts on sic |
| 09/11/1997 | DE3250096C2 Semiconductor dynamic random access memory |
| 09/11/1997 | DE19609202A1 Photomask apparatus for structuring superconductor or semiconductor substrate |
| 09/11/1997 | DE19608683A1 Production of substrate |
| 09/11/1997 | DE19608513A1 Chipkarte mit ESD-Schutz Smart Card with ESD protection |
| 09/10/1997 | EP0794574A1 Mass memory and method for its fabrication |
| 09/10/1997 | EP0794573A2 Semiconductor device and method of manufacturing the same |
| 09/10/1997 | EP0794572A2 Electronic component, method for making the same, and lead frame and mold assembly for use therein |
| 09/10/1997 | EP0794571A1 Prepunched leadframe for making electronic components |
| 09/10/1997 | EP0794570A1 Integrated device with pads |
| 09/10/1997 | EP0794569A2 Amorphous carbon film, formation process thereof, and semiconductor device making use of the film |
| 09/10/1997 | EP0794563A2 Semiconductor device having oxygen-doped silicon layer so as to restrict diffusion from heavily doped silicon layer and process of fabrication thereof |
| 09/10/1997 | EP0794560A2 Production method for insulated semiconductor device |
| 09/10/1997 | EP0794559A2 Lead frame flash removing method and apparatus |
| 09/10/1997 | EP0794558A1 Hermetic seal for an electronic component having a secondary chamber |
| 09/10/1997 | EP0794227A2 Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
| 09/10/1997 | EP0794098A1 Electric power transforming apparatus for electric rolling stock |
| 09/10/1997 | EP0793903A1 Coating for the structured production of conductors on the surface of electrically insulating substrates |
| 09/10/1997 | EP0793859A1 Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks pass |
| 09/10/1997 | CN1159250A Integrated circuit contacts with secured stringers |
| 09/10/1997 | CN1159078A Leadframe |
| 09/10/1997 | CN1159077A Method of bulging substrate by holding soldering paste stacking |
| 09/10/1997 | CN1159076A Method for planarization of semiconductor device |
| 09/10/1997 | CN1158880A Protective material for semiconductor element, semiconductor element provided with said protective material, and semiconductor device provided with said semiconductor element |
| 09/09/1997 | US5666272 Detachable module/ball grid array package |
| 09/09/1997 | US5666270 Bump electrode, semiconductor integrated circuit device using the same, multi-chip module having the semiconductor integrated circuit devices and method for producing semicondutcor device having the bump electrode |
| 09/09/1997 | US5666269 Metal matrix composite power dissipation apparatus |
| 09/09/1997 | US5666064 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device |
| 09/09/1997 | US5666009 Wire bonding structure for a semiconductor device |
| 09/09/1997 | US5666008 Flip chip semiconductor device |
| 09/09/1997 | US5666007 Interconnect structures for integrated circuits |
| 09/09/1997 | US5666004 Integrated circuit package |
| 09/09/1997 | US5666003 Packaged semiconductor device incorporating heat sink plate |
| 09/09/1997 | US5666000 Microcavity capacitive device |
| 09/09/1997 | US5665996 Vertical power transistor |
| 09/09/1997 | US5665991 Device having current ballasting and busing over active area using a multi-level conductor process |
| 09/09/1997 | US5665845 Electronic device with a spin-on glass dielectric layer |
| 09/09/1997 | US5665655 Process for producing crackstops on semiconductor devices and devices containing the crackstops |
| 09/09/1997 | US5665651 Process for encapsulating a semiconductor device and lead frame |
| 09/09/1997 | US5665650 Method for manufacturing a high density electronic circuit assembly |
| 09/09/1997 | US5665649 Process for forming a semiconductor device base array and mounting semiconductor devices thereon |
| 09/09/1997 | US5665648 Integrated circuit spring contact fabrication methods |
| 09/09/1997 | US5665646 Method for manufacturing semiconductor device with low electric resistance silicide layer on silicon surface |
| 09/09/1997 | US5665645 Method of manufacturing a semiconductor device using reticles |
| 09/09/1997 | US5665644 Semiconductor processing method of forming electrically conductive interconnect lines and integrated circuitry |
| 09/09/1997 | US5665642 Process of making a semiconductor device with a multilayer wiring and pillar formation |
| 09/09/1997 | US5665638 Method for repairing a defect generated cell using a laser |
| 09/09/1997 | US5665636 Suscepter and process for production thereof |
| 09/09/1997 | US5665634 Method of increasing maximum terminal voltage of a semiconductor device |
| 09/09/1997 | US5665633 Process for forming a semiconductor device having field isolation |
| 09/09/1997 | US5665473 Of a base plate and a conductive layer which is laminated onto the base via an adhesive layer |
| 09/09/1997 | US5665459 Low-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereof |
| 09/09/1997 | US5665260 Ceramic electrostatic chuck with built-in heater |
| 09/09/1997 | US5664624 Sloped wall type heat radiating member for chip |
| 09/09/1997 | US5664622 Heat sink with deformable hangers for mounting |
| 09/09/1997 | CA2088747C Cooling structure for electronic circuit package |
| 09/07/1997 | CA2199347A1 Amorphous carbon film, formation process therof, and semiconductor device making use of the film |
| 09/05/1997 | CA2198422A1 Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
| 09/04/1997 | DE19708254A1 Perforating organic film by two successive pulsed laser beams |
| 09/04/1997 | DE19700650A1 Metal conducting structure used in semiconductor device |
| 09/04/1997 | DE19637800C1 Cable amplifier with heat sink partly uncovered by circuit board e.g. for cable television (TV) |
| 09/03/1997 | EP0793405A2 Multilayer electronic assembly utilizing a sinterable composition and related method of forming |
| 09/03/1997 | EP0793271A2 Semiconductor device having a metal silicide film and method of fabricating the same |
| 09/03/1997 | EP0793270A1 Housing for thermal emission components with improved heat transfer caracteristics, and its method of fabrication |
| 09/03/1997 | EP0793269A1 Semiconductor device having a chip with via hole soldered on a support, and its method of fabrication |
| 09/03/1997 | EP0793146A1 Photoimageable, dielectric, crosslinkable, copolyester film-forming mixture |
| 09/03/1997 | EP0792573A1 Compliant thermal connectors, methods and assemblies |
| 09/03/1997 | EP0792520A1 Transistor structure with specific gate and pad areas |
| 09/03/1997 | EP0792519A1 Interconnection elements for microelectronic components |
| 09/03/1997 | EP0792517A1 Electrical contact structures from flexible wire |
| 09/03/1997 | EP0792513A1 Damascene process for reduced feature size |
| 09/03/1997 | EP0792497A1 Active security device with electronic memory |
| 09/03/1997 | EP0792463A1 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |