| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/30/1997 | US5672910 Semiconductor device and semiconductor module |
| 09/30/1997 | US5672909 Interdigitated wirebond programmable fixed voltage planes |
| 09/30/1997 | US5672908 Thin semiconductor integrated circuit device assembly |
| 09/30/1997 | US5672907 Flattening |
| 09/30/1997 | US5672905 Semiconductor fuse and method |
| 09/30/1997 | US5672902 Image sensor |
| 09/30/1997 | US5672901 Structure for interconnecting different polysilicon zones on semiconductor substrates for integrated circuits |
| 09/30/1997 | US5672894 Semiconductor device |
| 09/30/1997 | US5672848 Ceramic circuit board |
| 09/30/1997 | US5672760 Obtaining a photoabsorber-containing acrylic polymer by using n-2-hydroxyethyl-n-ethyl aniline to obtain 4-((2-hydroxyethyl)ethylamino)-4'-(trifluoromethylsulfonyl)-tolane which reacts with a polymerizable methacrylic acid |
| 09/30/1997 | US5672569 Patterned wiring circuits; thin film of superconductive oxide on substrate; crustal structure |
| 09/30/1997 | US5672548 Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy |
| 09/30/1997 | US5672547 Plastic encapsulation process |
| 09/30/1997 | US5672546 Semiconductor interconnect method and structure for high temperature applications |
| 09/30/1997 | US5672542 Method of making solder balls by contained paste deposition |
| 09/30/1997 | US5672528 Method for making semiconductor device having field limiting ring |
| 09/30/1997 | US5672520 Method of checking alignment accuracy in photolithography |
| 09/30/1997 | US5672435 Hard disk drive components and methods of making same |
| 09/30/1997 | US5672433 Cast magnesium matrix composite, with reinforcement particles, which has thermal expansion matching that of electronic component with which it is in heat exchanging contact |
| 09/30/1997 | US5672414 Multilayered printed board structure |
| 09/30/1997 | US5672251 Dopes, tantalum |
| 09/30/1997 | US5671531 Fabrication process for circuit substrate having interconnection leads |
| 09/25/1997 | WO1997035460A1 Fan attachment clip for heat sink |
| 09/25/1997 | WO1997035347A1 Semiconductor device |
| 09/25/1997 | WO1997035344A1 Semiconductor device shielded by an array of electrically conducting pins and a method to manufacture such a device |
| 09/25/1997 | WO1997035343A1 Improved solder joint reliability |
| 09/25/1997 | WO1997035342A1 Printed wiring board substrate for chip on board device and process for fabrication thereof |
| 09/25/1997 | WO1997035340A1 Heterolithic microwave integrated circuits and process of making hmic circuits |
| 09/25/1997 | WO1997035338A1 Calibration standard for calibrating a defect inspection system and a method of forming same |
| 09/25/1997 | WO1997035234A1 Alignment device and lithographic apparatus provided with such a device |
| 09/25/1997 | DE19708002A1 Semiconductor component for resin encapsulated component, e.g. quad-flat pack |
| 09/25/1997 | DE19700056A1 Semiconductor module with mounting region for semiconductor element |
| 09/25/1997 | DE19645568A1 Semiconductor wafer apparatus with integrated circuit forming region |
| 09/25/1997 | DE19611046A1 Halbleitervorrichtung Semiconductor device |
| 09/24/1997 | EP0797254A2 LSI package and manufacturing method thereof |
| 09/24/1997 | EP0797253A2 Chip carrier and semiconductor device using the same |
| 09/24/1997 | EP0797249A1 Single step process for blanket-selective CVD metal deposition |
| 09/24/1997 | EP0797247A1 Substrate on which bumps are formed and method of forming the same |
| 09/24/1997 | EP0796508A1 Multilayer solar cells with bypass diode protection |
| 09/24/1997 | EP0796200A2 Method and apparatus for filling a ball grid array |
| 09/24/1997 | EP0616724B1 Electronic device and production method therefor |
| 09/24/1997 | CN2263403Y Non-fan radiator for semiconductor element |
| 09/24/1997 | CN1160449A Support element |
| 09/24/1997 | CN1160448A Circuit with chip card module and coil connected therewith |
| 09/24/1997 | CN1160292A Semiconductor device |
| 09/24/1997 | CN1160290A Semiconductor wafer, semiconductor device and manufacturing method of semiconductor device |
| 09/24/1997 | CN1160261A Liquid crystal display |
| 09/24/1997 | CN1160240A Fan assisted heat sink device |
| 09/24/1997 | CN1159967A Tie bar cutting method and tie bar cutting apparatus |
| 09/23/1997 | US5671173 Semiconductor integrated circuit device with oblique metallization lines over memory bit and word lines |
| 09/23/1997 | US5671125 Vertical package mounted on both sides of a printed circuit board |
| 09/23/1997 | US5671121 Printed circuit board assembly |
| 09/23/1997 | US5671118 Heat sink and retainer for electronic integrated circuits |
| 09/23/1997 | US5671111 Apparatus for electro-static discharge protection in a semiconductor device |
| 09/23/1997 | US5670994 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion |
| 09/23/1997 | US5670891 Structures to extract defect size information of poly and source-drain semiconductor devices and method for making the same |
| 09/23/1997 | US5670883 Integrated circuit interlevel conductor defect characterization test structure and system |
| 09/23/1997 | US5670867 Current sensing circuit |
| 09/23/1997 | US5670828 Tunneling technology for reducing intra-conductive layer capacitance |
| 09/23/1997 | US5670826 Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method |
| 09/23/1997 | US5670825 Integrated circuit package with internally readable permanent identification of device characteristics |
| 09/23/1997 | US5670823 Nitrided layers of titanium-tungsten |
| 09/23/1997 | US5670819 Semiconductor device with pad electrode |
| 09/23/1997 | US5670818 In an integrated circuit |
| 09/23/1997 | US5670815 Layout for noise reduction on a reference voltage |
| 09/23/1997 | US5670802 Semiconductor device |
| 09/23/1997 | US5670801 Heterojunction bipolar transistor |
| 09/23/1997 | US5670800 Intermetallic layer on base substrate; semiconductor layer on intermetallic layer; semiconductor elements on wiring |
| 09/23/1997 | US5670428 Semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same |
| 09/23/1997 | US5670424 Method for making local interconnect structure |
| 09/23/1997 | US5670422 Tungsten buried in contact holes by blanket vapor deposition |
| 09/23/1997 | US5670421 Process for forming multilayer wiring |
| 09/23/1997 | US5670419 Depositing amorphous silicon in low pressure, nitrogen-free atmosphere to prevent nitriding |
| 09/23/1997 | US5670410 End-point detection |
| 09/23/1997 | US5670403 Dielectric-polysilicon-dielectric antifuse for field programmable logic applications |
| 09/23/1997 | US5670241 Metal base board and electronic equipment using the same |
| 09/23/1997 | US5669136 Method of making high input/output density MLC flat pack |
| 09/18/1997 | WO1997034364A1 Integrated circuit packaged power supply |
| 09/18/1997 | WO1997034321A2 Semiconductor body with a substrate glued to a support body |
| 09/18/1997 | WO1997029515A3 Separable connecting bridge (fuse) and connectable line interruption (anti-fuse) and process for producing and activating a fuse and an anti-fuse |
| 09/18/1997 | WO1997026727A3 Microchip partly or entirely surrounded by opaque sheathing |
| 09/18/1997 | DE19707253A1 Repeated firing resistant ceramic circuit substrate |
| 09/18/1997 | DE19609929A1 Power semiconductor module with base plate |
| 09/17/1997 | EP0795908A2 Multilayer high frequency circuit with integrated active elements |
| 09/17/1997 | EP0795907A1 Multilayer high-frequency circuit with integrated active elements |
| 09/17/1997 | EP0795905A2 Heat sink for semi-conductor devices or similar arrangements |
| 09/17/1997 | EP0795904A2 Semiconductor device, display device with a semiconductor device, and production method thereof |
| 09/17/1997 | EP0795903A1 Method and apparatus for mounting components on a substrate |
| 09/17/1997 | EP0795895A2 Semiconductor device with a plurality of stacked wiring layers and manufacturing method of the same |
| 09/17/1997 | EP0795891A2 Semiconductor chips soldering |
| 09/17/1997 | EP0795772A1 Drive circuit connection structure and display apparatus including the connection structure |
| 09/17/1997 | EP0795570A1 Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
| 09/17/1997 | EP0795200A1 Mounting electronic components to a circuit board |
| 09/16/1997 | US5669059 Metal matrix compositions and method of manufacturing thereof |
| 09/16/1997 | US5668702 Combination axial and surface mount cylindrical package containing one or more electronic components |
| 09/16/1997 | US5668700 Panel assembly structure capable of connecting wiring line with electrode at fine pitch |
| 09/16/1997 | US5668413 Semiconductor device including via hole |
| 09/16/1997 | US5668411 Titanium nitride |
| 09/16/1997 | US5668410 Projecting electrode structure having a double-layer conductive layer |
| 09/16/1997 | US5668409 Integrated circuit with edge connections and method |