H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1997
10/14/1997	US5677203 Method for providing known good bare semiconductor die
10/14/1997	US5677052 Aluminum nitride ceramics and method for preparing the same
10/14/1997	US5677045 Low thermal stress, low thermal expansion
10/14/1997	US5676907 Method for making near net shape ceramic-metal composites
10/14/1997	US5676855 Multiple substrate and process for its production
10/14/1997	US5676850 Micromechanical barb and method for making the same
10/14/1997	US5676788 Method for forming cavity structures using thermally decomposable surface layer
10/14/1997	US5676781 Mixing hollow and non-hollow inorganic powders, binder, solvent to form slurry, spreading on substrate, drying, cutting into sheets, forming via holes, printing conductor paste on surface, stacking sheets, firing
10/14/1997	US5676199 Thermostat controlled cooler for a CPU
10/14/1997	US5676198 Cooling apparatus for an electronic component
10/14/1997	US5675889 Solder ball connections and assembly process
10/14/1997	US5675884 Apparatus for multilayer conductor chip packaging
10/09/1997	WO1997037520A1 Method for depositing solder onto pad-on and pad-off via contacts
10/09/1997	WO1997037383A1 Standardized bonding location process and apparatus
10/09/1997	WO1997037373A2 Method for connecting area grid arrays to printed wire board
10/09/1997	DE19615481A1 Metallised ceramic electrical or electronic substrate - has convex curvature for elastic bending into tight contact with heat sink
10/09/1997	DE19614765A1 Manufacture of thin composites useful for e.g. circuit boards
10/09/1997	DE19613409A1 Power component module for MOSFET, e.g. DMOS, or bipolar transistor
10/08/1997	EP0800243A2 Semiconductor laser module
10/08/1997	EP0800217A1 Metal-insulator-metal capacitor
10/08/1997	EP0800211A1 Integrated circuit package
10/08/1997	EP0800210A1 Compact microwave module
10/08/1997	EP0800209A1 Safety device for a semi-conductor chip
10/08/1997	EP0800208A2 Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrier, and manufacturing method of the semiconductor device
10/08/1997	EP0799903A2 Methods of sputtering a metal onto a substrate and semiconductor processing apparatus
10/08/1997	EP0799849A1 Process for the preparation of phosphorus modified epoxy resins
10/08/1997	EP0799847A1 Phosphorus modified epoxy resin compositions based on epoxy resins, phosphor containing compounds and a curing agent
10/08/1997	EP0799845A2 Phosphorus-modified epoxy resin compositions
10/08/1997	EP0799500A1 Semiconductor resistor device
10/08/1997	EP0799498A1 Electrostatic discharge protection device
10/08/1997	EP0799497A1 Novel processing techniques for achieving production-worthy, low dielectric, low interconnect resistance and high performance ic
10/08/1997	EP0799496A1 Function-differentiated temperature compensated crystal oscillator and method of producing the same
10/08/1997	EP0799325A1 Computer disk substrate, the process for making same, and the material made therefrom
10/08/1997	EP0799286A1 Mouldings made of polyurethane hot-melt-type adhesives
10/08/1997	CN1161761A 球栅阵列插座 Ball grid array socket
10/08/1997	CN1161573A Semiconductor IC device and method for mfg. same
10/08/1997	CN1161570A Bumpless method of attaching inner leads to semiconductor integrated circuits
10/08/1997	CN1161568A Method for mfg. semiconductor device
10/07/1997	US5675501 Method of designing semiconductor integrated circuit apparatus having no dead space
10/07/1997	US5675474 Multilayer wiring board comprising aluminum plates bonding to base plate using aluminum-silicon blazing material; lightweight, noncracking, nondeforming
10/07/1997	US5675310 Thin film resistors on organic surfaces
10/07/1997	US5675298 Low-loss, low-inductance interconnect for microcircuits
10/07/1997	US5675295 Microwave oscillator, an antenna therefor and methods of manufacture
10/07/1997	US5675187 Reliability of metal leads in high speed LSI semiconductors using dummy vias
10/07/1997	US5675186 A nonstoichiometric titanium nitride layer is interposed between titanium and aluminum interconnect layer to improve adhesion and prevent lifting of interconnect layer
10/07/1997	US5675184 Integrated circuit device
10/07/1997	US5675182 Heat sink for plastic casings
10/07/1997	US5675181 Zirconia-added alumina substrate with direct bonding of copper
10/07/1997	US5675180 Vertical interconnect process for silicon segments
10/07/1997	US5675179 Universal test die and method for fine pad pitch designs
10/07/1997	US5675177 Ultra-thin noble metal coatings for electronic packaging
10/07/1997	US5675174 Method for using fuse structure in semiconductor device
10/07/1997	US5675122 Sealable electronics packages
10/07/1997	US5674785 Forming wire electroconnection between the patterned pads and patterned conductor through the opening; materials handling; packaging
10/07/1997	US5674781 Vapor depositing titanium and titanium nitride stacking multilayer and reducing capacitance
10/07/1997	US5674759 Heating the sandwiched nitride layer to diffuse hydrogen from silicon layer into transistor
10/07/1997	US5674599 Coating of inorganic buffer layer on plastic substrate, the stress of buffer layer is maintained at a preferential range; switching element for flat panel display for office automation equipments and television; high reliability
10/07/1997	US5674355 Diamond-like carbon for use in VLSI and ULSI interconnect systems
10/07/1997	US5674343 Method for manufacturing a semiconductor
10/07/1997	US5673995 Support element for a motor vehicle indicating display, and a method of making it
10/07/1997	US5673479 Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer
10/07/1997	CA2102662C Structure for cooling an integrated circuit
10/04/1997	CA2201771A1 Compact microwave frequency module
10/02/1997	WO1997036466A1 Perimeter matrix ball grid array circuit package with a populated center
10/02/1997	WO1997036363A1 Gas-insulated high-voltage semiconductor valve means
10/02/1997	WO1997036326A1 Integrated circuit protection device and method
10/02/1997	WO1997036325A1 Packaging and interconnect system for integrated circuits
10/02/1997	WO1997035816A1 Controlled dielectric loss aluminum nitride
10/02/1997	DE19651122A1 Semiconductor mounting chip device e.g. ball grid array
10/02/1997	DE19650296A1 Semiconductor device, e.g. ball grid array, production method
10/02/1997	DE19650148A1 Semiconductor integrated circuit package apparatus
10/02/1997	DE19638684A1 Semiconductor device, e.g. field effect transistor, with contact hole for DRAM cell
10/02/1997	DE19612760A1 Carrier plate for electronic component connection structure, e.g for printhead of electrographic printer or copier
10/02/1997	DE19612392A1 Semiconductor chip package of paddle-free design
10/02/1997	DE19612259A1 Integrated circuit component with cooling arrangement for high pin count package
10/01/1997	EP0798782A2 Microwave circuit package
10/01/1997	EP0798781A2 Silicon nitride circuit board and producing method therefor
10/01/1997	EP0798780A2 Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
10/01/1997	EP0798779A1 Ceramic circuit board
10/01/1997	EP0798778A2 Method of manufacturing a semiconductor device of multilayer wire structure
10/01/1997	EP0798777A2 Method of metallizing submicronie (e.g. micronie) contact holes in semiconductor body
10/01/1997	EP0798772A1 Process for realizing a deposition on a detachable support, and realized deposition on a support
10/01/1997	EP0798764A2 Hollow package manufacturing method and apparatus
10/01/1997	EP0798393A2 Aluminum composite material of low-thermal expansion and high-thermal conductivity and method of producing same
10/01/1997	EP0609264A4 Universal interconnect matrix array.
10/01/1997	CN1160984A Semiconductor device manufacturing method and package for semiconductor device
10/01/1997	CN1160934A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/01/1997	CN1160933A 半导体器件 Semiconductor devices
10/01/1997	CN1160932A Semiconductor device
10/01/1997	CN1160931A 半导体装置 Semiconductor device
10/01/1997	CN1160928A Method of manufacturing semiconductor device
10/01/1997	CN1160773A Tungsten-copper composite powder
10/01/1997	CN1036043C Power module
09/1997
09/30/1997	US5673228 Integrated circuit having an EEPROM, semiconductor wafer provided with such integrated circuits, and method of testing such a semiconductor wafer
09/30/1997	US5673177 Heat sink structure with corrugated wound wire heat conductive elements
09/30/1997	US5672994 Antifuse circuit using standard MOSFET devices
09/30/1997	US5672915 For a semiconductor device
09/30/1997	US5672913 Renders non-solder wettable members wettable by solder
09/30/1997	US5672912 Resin-sealed type semiconductor device and method for manufacturing the same
09/30/1997	US5672911 Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device package

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