H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1997
10/28/1997	US5682065 Semiconductor wafer
10/28/1997	US5682064 Repairable wafer scale integration system
10/28/1997	US5682063 Substrate for semiconductor device
10/28/1997	US5682062 System for interconnecting stacked integrated circuits
10/28/1997	US5682061 Component for connecting a semiconductor chip to a substrate
10/28/1997	US5682059 Semiconductor device including anti-fuse element and method of manufacturing the device
10/28/1997	US5682058 Multilayer antifuse with low leakage and method of manufacture therefor
10/28/1997	US5682057 Semiconductor device incorporating a temperature fuse
10/28/1997	US5682053 Silicon wafer having substrate and monocrystalline silicon layer separated by buried silicon dioxide layer
10/28/1997	US5682052 Method for forming isolated intra-polycrystalline silicon structure
10/28/1997	US5682048 Groove-type semiconductor device
10/28/1997	US5682018 Interface regions between metal and ceramic in a metal/ceramic substrate
10/28/1997	US5681883 Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
10/28/1997	US5681779 Method of doping metal layers for electromigration resistance
10/28/1997	US5681777 Process for manufacturing a multi-layer tab tape semiconductor device
10/28/1997	US5681663 Heatspreader carrier strip
10/28/1997	US5681647 Nail-shaped conductive elements filled through holes of self-supporting polymeric layer; connectors
10/28/1997	US5681613 Filtering technique for CVD chamber process gases
10/28/1997	US5681444 Electroplating connector holes with nickel, then oxidizing it and covering with screen printed dielectric glass, firing to remove organic binders and solvents, applying conductive ink containing metal powder and glass, then more firing
10/26/1997	CA2203737A1 Laser diode pumped solid-state laser apparatus
10/23/1997	WO1997039485A1 Silicon carbide cmos and method of fabrication
10/23/1997	WO1997039484A1 Method of fabricating an interconnect structure comprising lamination of a porous dielectric membrane
10/23/1997	WO1997039483A1 Method for manufacturing multi-chip modules utilizing direct lead attach
10/23/1997	WO1997039482A1 Methods for manufacturing a semiconductor package
10/23/1997	WO1997039480A1 Two-step projecting bump for semiconductor chip and method for forming the same
10/23/1997	WO1997034321A3 Semiconductor body with a substrate glued to a support body
10/23/1997	WO1997027619A3 Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
10/23/1997	DE19615787A1 Verfahren zur Herstellung eines keramischen Multilayer-Substrats A method for producing a ceramic multilayer substrate
10/23/1997	DE19615032A1 Heat sink assembly for integrated circuit e.g CPU
10/23/1997	CA2252102A1 Two-step projecting bump for semiconductor chip and method for forming the same
10/22/1997	EP0802566A2 Semiconductor devices, method of connecting semiconductor devices, and semicondutor device connectors
10/22/1997	EP0802507A2 Smart cards having thin die
10/22/1997	EP0801816A1 Semiconductor device having a passivation layer
10/22/1997	EP0785917A4 Method of treating an anti-reflective coating on a substrate
10/22/1997	EP0766909A4 Vertical interconnect process for silicon segments
10/22/1997	EP0654175B1 Power converter
10/22/1997	CN1162843A Integrated circuit having integral decoupling capacitor
10/22/1997	CN1162842A Electrostatic protecting circuits for semiconductor device and structure thereof
10/22/1997	CN1162841A Semiconductor device and manufacturing method thereof
10/22/1997	CN1162840A Semiconductor device
10/22/1997	CN1036227C A dynamic random access memory made by using silic on-on-insulator and a method for making the same
10/21/1997	US5680132 Semiconductor device
10/21/1997	US5679983 Semiconductors; packages; chips; titanium, zirconium, hafnium with low level of impurities
10/21/1997	US5679982 Barrier against metal diffusion
10/21/1997	US5679981 Semiconductor device having planarized wiring
10/21/1997	US5679978 Semiconductor device having resin gate hole through substrate for resin encapsulation
10/21/1997	US5679977 Semiconductor chip assemblies, methods of making same and components for same
10/21/1997	US5679976 Molded electric parts and method of manufacturing the same
10/21/1997	US5679975 Conductive encapsulating shield for an integrated circuit
10/21/1997	US5679974 Antifuse element and semiconductor device having antifuse elements
10/21/1997	US5679967 Customizable three metal layer gate array devices
10/21/1997	US5679609 Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses
10/21/1997	US5679608 Using tri-layer resist structure comprising a first layer of dissolvable polymer, a second layer of a hard mask material and a third layer of a resist material; spin coating of benzocyclobutene prevent diffusion of low resistance metal
10/21/1997	US5679590 Method for manufacturing contact hole for a nonvolatile semiconductor device
10/21/1997	US5679469 Aluminum nitride, metallized layer comprising tungsten and molybdenum, glass component, iron, nickel, or cobalt or oxide or alloy thereof; thermoconductivity, heat dissipation for electronics
10/21/1997	US5679269 Diamond-like carbon for use in VLSI and ULSI interconnect systems
10/21/1997	US5679194 Fabrication of leads on semiconductor connection components
10/21/1997	US5678627 CPU heat sink mounting structure
10/21/1997	US5678301 Method for forming an interconnect for testing unpackaged semiconductor dice
10/21/1997	US5678287 Uses of uniaxially electrically conductive articles
10/16/1997	WO1997038563A1 Structrure and method for supporting one or more electronic components
10/16/1997	WO1997038443A1 Pcmcia memory card
10/16/1997	WO1997038441A1 Curing liquid resin encapsulants of microelectronics components with microwave energy
10/16/1997	WO1997038274A1 Apparatus and method for spray-cooling an electronic module
10/16/1997	WO1997037948A1 Ceramic composition and method of making same
10/16/1997	DE19649409A1 Diamond film fine processing method
10/16/1997	DE19626038A1 Semiconductor component composite structure formation method
10/16/1997	DE19614501A1 Ceramic-metal substrate with differential thermal expansion compensation
10/16/1997	CA2250817A1 Curing liquid resin encapsulants of microelectronics components with microwave energy
10/15/1997	EP0801424A2 Semiconductor device and assembling method thereof
10/15/1997	EP0801418A2 Method for forming a T-shaped gate electrode in a semi-conductor device, and the T-shaped gate electrode
10/15/1997	EP0800890A1 Heat sink
10/15/1997	EP0800754A1 Compliant interface for a semiconductor chip
10/15/1997	EP0800706A1 Forming polyimide coatings by screen printing
10/15/1997	CN1162366A Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
10/15/1997	CN1162194A Method for mfg. electronic element with organic substrate
10/15/1997	CN1162193A Semiconductor device packaged by resin
10/15/1997	CA2202316A1 Electronic device assembly
10/14/1997	US5678168 Two conductive thick film pastes, each containing gold, platinum and palladium powders, glasses and oxides, chromium oxide, bismuth oxide, organic vehicle in differing amounts; one paste to be deposited on substrate, other on first layer
10/14/1997	US5677829 Fan attachment clip for heat sink
10/14/1997	US5677712 Semiconductor device
10/14/1997	US5677576 Chip sized semiconductor device
10/14/1997	US5677575 Semiconductor package having semiconductor chip mounted on board in face-down relation
10/14/1997	US5677574 Airbridge wiring structure for MMIC
10/14/1997	US5677571 Semiconductor package having reinforced lead pins
10/14/1997	US5677570 Semiconductor integrated circuit devices for high-speed or high frequency
10/14/1997	US5677569 Semiconductor multi-package stack
10/14/1997	US5677568 Thin IC card
10/14/1997	US5677567 Leads between chips assembly
10/14/1997	US5677566 Semiconductor chip package
10/14/1997	US5677563 Gate stack structure of a field effect transistor
10/14/1997	US5677557 Method for forming buried plug contacts on semiconductor integrated circuits
10/14/1997	US5677547 Thin film transistor and display device including same
10/14/1997	US5677249 Semiconductor apparatus and production method for the same
10/14/1997	US5677247 Low-profile socketed packaging system with land-grid array and thermally conductive slug
10/14/1997	US5677245 Small outline optocoupler package method
10/14/1997	US5677241 Integrated circuitry having a pair of adjacent conductive lines and method of forming
10/14/1997	US5677237 Forming a voidless tungsten filled contact holes by selective depositing tungsten on surface and inside the contact hole
10/14/1997	US5677212 Method of forming a liquid crystal device
10/14/1997	US5677208 Method for making FET having reduced oxidation inductive stacking fault

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