H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1997
11/11/1997	US5686362 Method of manufacturing a semiconductor integrated circuit device
11/11/1997	US5686361 Method for manufacturing a semiconductor device having a heat radiator
11/11/1997	US5686358 Method for forming a plug in a semiconductor device
11/11/1997	US5686356 Conductor reticulation for improved device planarity
11/11/1997	US5686353 Semiconductor device and manufacturing method thereof
11/11/1997	US5686318 Method of forming a die-to-insert permanent connection
11/11/1997	US5686317 Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die
11/11/1997	US5686190 Controlled oxygen content copper clad laminate
11/11/1997	US5686172 Metal-foil-clad composite ceramic board and process for the production thereof
11/11/1997	US5686162 Protecting electronic components in acidic and basic environments
11/11/1997	US5685960 Method for forming aluminum contacts
11/11/1997	US5685939 Process for making a Z-axis adhesive and establishing electrical interconnection therewith
11/11/1997	US5685885 Wafer-scale techniques for fabrication of semiconductor chip assemblies
11/11/1997	US5685725 IC socket
11/11/1997	US5685477 Method for attaching and handling conductive spheres to a substrate
11/11/1997	US5685361 Motor vehicle with a heat exchanger housing system for cooling automotive accessory components and a heat exchanger housing system for cooling automotive accessory components in a motor vehicle
11/11/1997	US5685071 Method of constructing a sealed chip-on-board electronic module
11/11/1997	US5685070 Method of making printed circuit board
11/06/1997	WO1997041602A2 Semiconductor device provided with a resistance element
11/06/1997	WO1997041600A1 Bridge and mounting method for power transistors with improved cooling
11/06/1997	WO1997041599A1 Conformal thermal interface material for electronic components
11/06/1997	WO1997041594A1 Multilayer solder/barrier attach for semiconductor chip
11/06/1997	WO1997041592A1 A fluorinated oxide low permittivity dielectric stack for reduced capacitive coupling
11/06/1997	WO1997040958A1 Microelectronic connections with liquid conductive elements
11/06/1997	DE19717611A1 Electronic component housing structure for e.g. semiconductor sensor and control integrated circuit
11/06/1997	DE19710480A1 Cut-off display mechanism for semiconductor switching element
11/06/1997	DE19703457A1 IGBT-free wheel diode formation structure used in motor controller
11/06/1997	DE19617621A1 Laminate with embedded component in middle layer e.g. chip for smart cards
11/05/1997	EP0805618A1 Heat dissipating spacer for electronic equipments
11/05/1997	EP0805614A1 Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar
11/05/1997	EP0805494A2 Semiconductor multilayer power module having high package density
11/05/1997	EP0805493A2 Electrical connecting member and manufacturing method therefor
11/05/1997	EP0805492A2 Curved metal ceramic substrate
11/05/1997	EP0805491A2 Interconnect structure and method of manufacturing using two different low dielectric constant insulators
11/05/1997	EP0805489A2 Selective via fill using a sacrificial layer
11/05/1997	EP0805488A2 Prevention of abnormal WSix oxidation by in-situ amorphous silicon deposition
11/05/1997	EP0804817A1 An electrically conductive wire
11/05/1997	EP0804806A1 Device for superheating steam
11/05/1997	EP0804803A1 Barrier enhancement at the sialicide layer
11/05/1997	EP0804313A1 Method and cutting insert for threading
11/05/1997	CN1164245A Curable epoxy resin accelerated by boric acid and its analogs
11/05/1997	CN1164128A Electrode structure of semiconductor integrated circuit and method for forming package therefor
11/05/1997	CN1164127A Lead frame and semiconductor device using the lead frame and method of manufacturing the same
11/05/1997	CN1036348C Epoxy resin composition for plastic sealing semiconductor device and its preparing method
11/04/1997	US5684676 Clip for securing heat dissipator to computer central processing unit
11/04/1997	US5684675 Semiconductor device unit having holder
11/04/1997	US5684333 Wafer structure in a semiconductor device manufacturing process
11/04/1997	US5684332 Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom
11/04/1997	US5684331 Multilayered interconnection of semiconductor device
11/04/1997	US5684330 Chip-sized package having metal circuit substrate
11/04/1997	US5684329 Lead frame for semiconductor device
11/04/1997	US5684328 Semiconductor chip package using improved tape mounting
11/04/1997	US5684327 Lead frame for use in a resin-sealed type semiconductor device
11/04/1997	US5684323 Protection circuit for semiconductor device
11/04/1997	US5684304 Structure for testing integrated circuits
11/04/1997	US5683944 Method of fabricating a thermally enhanced lead frame
11/04/1997	US5683943 Process for etching a semiconductor lead frame
11/04/1997	US5683942 Method for manufacturing bump leaded film carrier type semiconductor device
11/04/1997	US5683940 Method of depositing a reflow SiO2 film
11/04/1997	US5683939 Diamond insulator devices and method of fabrication
11/04/1997	US5683938 Method for filling contact holes with metal by two-step deposition
11/04/1997	US5683936 Reactive ion etched assisted gold post process
11/04/1997	US5683806 Semiconductors
11/04/1997	US5683529 Process of producing aluminum nitride multiple-layer circuit board
11/04/1997	US5683515 Apparatus for manufacturing a semiconductor device having conductive then films
11/04/1997	US5683262 IC socket
11/04/1997	US5682948 Heat exchanger for cooling semi-conductor elements or the like
11/04/1997	US5682943 Honeycomb sandwich panel with built in heat pipes
11/02/1997	CA2204226A1 Improved low profile mounting of electronic components
10/1997
10/30/1997	WO1997040654A1 Semiconductor device
10/30/1997	WO1997040651A1 Grid array assembly and method of making
10/30/1997	WO1997040533A1 Insulating film for use in semiconductor device
10/30/1997	WO1997040532A2 Molded flex circuit ball grid array and method of making
10/30/1997	WO1997040530A1 Solder bump apparatus, electronic component and method for forming a solder bump
10/30/1997	WO1997040529A1 Process for producing a ceramic multilayer substrate
10/30/1997	DE19712825A1 Production of ceramic conductor substrate
10/30/1997	DE19710225A1 Power electronic component heat sink
10/30/1997	DE19709934A1 Heat sink cooler employing boiling and condensing refrigerant
10/30/1997	DE19708282A1 Vapour-condensing cooler with radiator e.g. for semiconductor devices
10/30/1997	DE19616424A1 Electrically isolating material with electronic module
10/30/1997	CA2252833A1 Molded flex circuit ball grid array and method of making
10/30/1997	CA2252379A1 Grid array assembly and method of making
10/29/1997	EP0803946A2 Laser diode pumped solid-state laser apparatus
10/29/1997	EP0803907A2 Ribbon, bonding wire and microwave circuit package
10/29/1997	EP0803906A2 Tape carrier package and liquid crystal display device
10/29/1997	EP0803902A2 Semiconductor device with on-board memory areas for test purposes
10/29/1997	EP0803901A2 Method of mounting a plurality of semiconductor devices in corresponding supporters
10/29/1997	EP0803584A2 Fe-ni based alloy
10/29/1997	EP0803174A2 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
10/29/1997	EP0803173A1 Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
10/29/1997	EP0803132A1 Flip chip bonding with non-conductive adhesive
10/29/1997	EP0721660A4 Method for assembling an electronic package
10/29/1997	EP0678232B1 Plated compliant lead
10/29/1997	CN1163511A Balance integrated semiconductor device worked with parallel resonant circuit
10/29/1997	CN1163480A Chip carrier and semiconductor device with it
10/29/1997	CN1163479A Semiconductor device and its producing technology
10/29/1997	CN1163478A Electronic module and its producing method and its used lead wire frame and metal mould
10/29/1997	CN1163477A Integrated circuit device with displaying integrated circuit chip window and its relative method
10/29/1997	CN1163209A Power change-over device for electric driven car
10/28/1997	US5682589 Multilayer; overcoated with tungsten, molybdenum alloy

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