H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1997
11/20/1997	WO1997043887A1 Heat spreader system and method for cooling heat generating components
11/20/1997	WO1997043787A1 Microelectronics package
11/20/1997	WO1997043786A1 High frequency microelectronics package
11/20/1997	WO1997043783A1 A method and an apparatus for manufacturing heat-sink devices
11/20/1997	WO1997043656A2 Wafer-level burn-in and test
11/20/1997	WO1997043654A1 Microelectronic spring contact elements
11/20/1997	WO1997043653A1 Contact tip structures for microelectronic interconnection elements and methods of making same
11/20/1997	DE19720275A1 Substrate for stacked semiconductor component
11/20/1997	DE19719983A1 Ball grid array for semiconductor component
11/20/1997	DE19716668A1 Small outline, stacking J-lead package for semiconductor chip encapsulation
11/20/1997	DE19713501A1 Conductive layer in Semiconductor component coupling method
11/20/1997	DE19712551A1 Mass production of modern chip-sized semiconductor chip packages
11/20/1997	DE19704149A1 Metal wiring with self-aligned via corners
11/20/1997	DE19700868A1 Internal connection in semiconductor component formation method
11/20/1997	DE19619060A1 Metal heat-sink for electronic module
11/20/1997	CA2255060A1 Heat spreader system and method for cooling heat generating components
11/19/1997	EP0807976A2 Solid-state imaging apparatus and camera using the same
11/19/1997	EP0807975A1 Power semiconductor device
11/19/1997	EP0807974A1 Multilayer interconnections having a low lateral parasitic capacitance
11/19/1997	EP0807973A2 Plastic molded type semiconductor device and method of manufacturing the same
11/19/1997	EP0807972A2 Semiconductor device and method of its fabrication
11/19/1997	EP0807971A2 Ultrahigh-frequency electronic component and method of manufacturing the same
11/19/1997	EP0807372A1 Printed circuit board and heat sink arrangement
11/19/1997	EP0807369A1 Stackable modules and multimodular assemblies
11/19/1997	EP0807318A1 Process for producing a glass-coated article and article produced thereby
11/19/1997	EP0807189A2 Hard disk drive components and methods of making same
11/19/1997	CN1165609A Coating for the structured production of conductors on the surface of electrically insulating substrates
11/19/1997	CN1165584A Microelectronic assemblies including z-axis conductive films
11/19/1997	CN1165579A Composite magnetic material and electromagnetic interference suppressor use said material
11/19/1997	CN1165523A Milled carbon fiber reinforced polymer composition
11/19/1997	CN1165400A Semiconductor device and assembling method thereof
11/19/1997	CN1165398A Towered organisator and towered forming method
11/18/1997	US5689457 Semiconductor Memory
11/18/1997	US5689428 Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture
11/18/1997	US5689404 Heat sink having air movement device positioned among tins and between heating elements
11/18/1997	US5689140 Method for forming studs and interconnects in a multi-layered semiconductor device
11/18/1997	US5689139 Enhanced electromigration lifetime of metal interconnection lines
11/18/1997	US5689138 Integrated microwave semiconductor device with active and passive components
11/18/1997	US5689136 Semiconductor device and fabrication method
11/18/1997	US5689135 Multi-chip device and method of fabrication employing leads over and under processes
11/18/1997	US5689134 Integrated circuit structure having reduced cross-talk and method of making same
11/18/1997	US5689091 Multi-layer substrate structure
11/18/1997	US5689089 Electronic control module having fluid-tight seals of a polymer material which expands when wet
11/18/1997	US5688717 Construction that prevents the undercut of interconnect lines in plasma metal etch systems
11/18/1997	US5688716 Fan-out semiconductor chip assembly
11/18/1997	US5688606 Anodized aluminum substrate having increased breakdown voltage
11/18/1997	US5688441 Used to connect wiring layers of ceramic multilayer substrate, metal and glass powders, vehicle, metal salt of organic acid, boron or silicon compound
11/18/1997	US5688408 Multilayer printed wiring board
11/18/1997	US5688128 Detachable socket for an IC chip
11/18/1997	US5687577 Apparatus and method for spray-cooling an electronic module
11/18/1997	US5687474 Method of assembling and cooling a package structure with accessible chip
11/13/1997	WO1997042662A1 Integrable circuit inductor
11/13/1997	WO1997042658A1 Chip card module with conductive plastic coating and process for manufacturing the same
11/13/1997	WO1997042657A1 Electric component in integrated circuit form for hot insertion in a substrate and methods for manufacturing same
11/13/1997	WO1997042656A1 Integrated circuit comprising connection pads emerging on one surface
11/13/1997	WO1997042655A1 Carrier with at least one integrated printed circuit and process for producing the same
11/13/1997	WO1997042356A1 Chemical vapor deposition of fluorocarbon polymer thin films
11/13/1997	DE19718093A1 Assembly base plate for mounting electronic components
11/13/1997	DE19717780A1 Conductive frame for semiconductor components
11/13/1997	DE19713986A1 Semiconductor component element test unit with test and handling sections
11/13/1997	DE19648492A1 Three=dimensional multi-chip module, e.g. memory module
11/13/1997	DE19618103A1 Chipkartenmodul mit Beschichtung aus leitfähigem Kunststoff und Verfahren zu dessen Herstellung Chip card module with coating of conductive plastic material and process for its preparation
11/13/1997	DE19618101A1 Trägerelement mit wenigstens einem integrierten Schaltkreis sowie Verfahren zur Herstellung eines solchen Trägerelementes Support member having at least an integrated circuit and method for producing such a support member
11/12/1997	EP0806892A1 Faraday cage
11/12/1997	EP0806891A1 A lid assembly for shielding electronic components from EMI/RFI interferences
11/12/1997	EP0806835A2 Electronic component
11/12/1997	EP0806799A1 Method of forming interconnections in an integrated circuit
11/12/1997	EP0806795A2 Crack stop formation in integrated circuit chip manufacture
11/12/1997	EP0806702A1 Liquid crystal device
11/12/1997	EP0806701A1 Liquid crystal device
11/12/1997	EP0806700A1 Liquid crystal device
11/12/1997	EP0806063A1 Array of electrical components with leads attached
11/12/1997	EP0806056A1 Glass bonding layer for a ceramic circuit board support substrate
11/12/1997	EP0805832A1 Reaction resin system with a phosphorus-containing component
11/12/1997	EP0805785A1 Low dielectric loss glasses
11/12/1997	EP0805727A1 Improved metal matrix composite
11/12/1997	EP0795200A4 Mounting electronic components to a circuit board
11/12/1997	EP0650504B1 Process for producing a flame-resistant epoxy resin molding material
11/12/1997	CN1164765A 半导体封装件 The semiconductor package
11/12/1997	CN1164764A Multi-layer bottom lead package
11/11/1997	US5687267 Integrated optoelectronic coupling and connector
11/11/1997	US5687062 High-thermal conductivity circuit board
11/11/1997	US5686855 Process monitor for CMOS integrated circuits
11/11/1997	US5686764 Flip chip package with reduced number of package layers
11/11/1997	US5686763 Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics
11/11/1997	US5686762 Semiconductor device with improved bond pads
11/11/1997	US5686761 Titanium nitride
11/11/1997	US5686760 Film preventing diffusion
11/11/1997	US5686759 Integrated circuit package with permanent identification of device characteristics and method for adding the same
11/11/1997	US5686757 Film carrier tape for use in tape automated bonding
11/11/1997	US5686754 Polysilicon field ring structure for power IC
11/11/1997	US5686751 For protecting an internal circuit
11/11/1997	US5686747 Integrated circuits comprising interconnecting plugs
11/11/1997	US5686743 Method of forming airbridged metallization for integrated circuit fabrication
11/11/1997	US5686702 Polyimide multilayer wiring substrate
11/11/1997	US5686699 Semiconductor board providing high signal pin utilization
11/11/1997	US5686698 Package for electrical components having a molded structure with a port extending into the molded structure
11/11/1997	US5686560 Polyquinazolines and methods for their preparation
11/11/1997	US5686525 Polyimide precursor composition and the production of said polyimide precursor composition
11/11/1997	US5686521 Milled carbon fiber reinforced polymer composition

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