Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/02/2013EP2644989A1 Heat conducting lamp base and led lamp including the same
10/02/2013EP2644652A2 Encapsulation composition and photovoltaic module
10/02/2013EP2643261A1 Method for the wafer-level integration of shape memory alloy wires
10/02/2013EP1333502B1 Surface-mount package for an optical sensing device
10/02/2013DE112012000264T5 Halbleiter-auf-Isolator-Einheit mit asymmetrischer Struktur Semiconductor-on-insulator device with asymmetric structure
10/02/2013DE112011104211T5 Bondhügellose Aufbauschicht- und Laminatkernhybridstrukturen und Verfahren für ihre Montage Bump lots Aufbauschicht- and laminate core hybrid structures and methods for their assembly
10/02/2013DE112010006032T5 Leistungsmodul Power module
10/02/2013DE102013205472A1 Klemmschaltung Clamp circuit
10/02/2013DE102013205249A1 Halbleitervorrichtung und Herstellungsverfahren hierfür A semiconductor device and manufacturing method thereof
10/02/2013DE102013103465A1 Längliche Bumps in integrierten Schaltungen Elongated bumps in integrated circuits
10/02/2013DE102013103138A1 Gedrehte Halbleiterbauelementgehäuse auf Wafer-Ebene vom Fan-Out-Typ und Verfahren zum Herstellen gedrehter Halbleiterbauelementgehäuse auf Wafer-Ebene vom Fan-Out-Typ Turned semiconductor device package wafer-level fan-out type and method of manufacturing semiconductor device package turned on wafer-level fan-out type
10/02/2013DE102013103085A1 Mehrfachchip-Leistungshalbleiterbauteil Multi-chip power semiconductor component
10/02/2013DE102013103015A1 Gitter-Gehäuse auf Wafer-Ebene vom Fan-Out-Typ und Verfahren zum Herstellen eines Gitter-Gehäuses auf Wafer-Ebene vom Fan-Out-Typ Grid housing at the wafer level fan-out type and method of manufacturing a curtain housing at the wafer level fan-out type
10/02/2013DE102013103011A1 Eine Chipanordnung und ein Verfahren zum Bilden einer Chipanordnung A chip assembly and a method for forming a chip assembly
10/02/2013DE102013102973A1 Halbleiterpackages und Verfahren zu deren Ausbildung Semiconductor packages and methods of training
10/02/2013DE102013102720A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
10/02/2013DE102013004464A1 Gate-überspannungsschutz für verbindungshalbleitertransistoren Gate overvoltage protection for compound semiconductor transistors
10/02/2013DE102012205240A1 Method for manufacturing substrate for power semiconductor component e.g. MOSFET for power converter, involves arranging electroplating ridges in recesses formed in bottom metallization layer of insulating material portion
10/02/2013DE102012205209A1 Method for determination of temperature gradient of switch of power semiconductor switch module of power converter, involves determining temperature function, and determining gradient of switch by Fourier inverse transformation of function
10/02/2013DE102012204835A1 Sensor, Verfahren zum Herstellen eines Sensors und Verfahren zum Montieren eines Sensors Sensor, method of manufacturing a sensor and method for mounting a sensor
10/02/2013DE102012109338A1 Verbindungsstruktur und Verfahren zur Ausbildung derselben Connection structure and method of forming same
10/02/2013DE102012102847A1 Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements The light-emitting semiconductor device and method of manufacturing a light-emitting semiconductor component
10/02/2013DE102012102788A1 SPERRSCHICHTTEMPERATURMESSUNG EINES LEISTUNGS-MOSFETs BARRIER TEMPERATURE MEASUREMENT OF POWER MOSFETs
10/02/2013DE102008051466B4 Bauelement, das einen Halbleiterchip mit mehreren Elektroden enthält und Verfahren zur Herstellung eines solchen Bauelements Component that includes a semiconductor chip having a plurality of electrodes and methods for producing such a component
10/02/2013DE102004064032B4 Beschleunigungssensor und Verfahren zum Herstellen eines Beschleunigungssensors Acceleration sensor and method for producing an acceleration sensor
10/02/2013CN203225983U Mounting structure for IC (Integrated Circuit) heat sink
10/02/2013CN203225249U Multi-wafer packaging structure
10/02/2013CN203225248U Heat pipe radiator based on static VAR generator
10/02/2013CN203225247U An integrated circuit packaging body
10/02/2013CN103340022A Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
10/02/2013CN103339756A Battery adapter with flex circuit and silicone spring
10/02/2013CN103339732A Vertical semiconductor device with thinned substrate
10/02/2013CN103339726A Electronic device, method for producing the latter, and printed circuit board comprising electronic device
10/02/2013CN103339725A Compliant interconnects in wafers
10/02/2013CN103339724A 功率半导体模块 Power semiconductor module
10/02/2013CN103339723A Method for manufacturing heat dissipating plate for semiconductor module, said heat dissipating plate, and semiconductor module using said heat dissipating plate
10/02/2013CN103339722A Resin for electrical components, semiconductor device, and wiring board
10/02/2013CN103339717A Stacked microelectronic assembly with tsvs formed in stages and carrier above chip
10/02/2013CN103339716A Single layer BGA substrate process
10/02/2013CN103339297A Insulated metal substrate
10/02/2013CN103339206A 树脂组合物和半导体装置 The resin composition and a semiconductor device
10/02/2013CN103337580A LED light with ceramic heat dissipation baseplate
10/02/2013CN103337494A 电感结构 Inductive structure
10/02/2013CN103337493A Integrated through hole multilayer electronic structure extending in a direction in plane
10/02/2013CN103337492A Trimming structure for reducing fuse wire hillocks and manufacturing method thereof
10/02/2013CN103337491A Metal capacitor for all-directional connection and layout method
10/02/2013CN103337490A Chip on film tape and chip on film structure
10/02/2013CN103337489A SOP-8L package lead frame
10/02/2013CN103337488A A leading wire framework
10/02/2013CN103337487A Method and apparatus for attachment of integrated circuits
10/02/2013CN103337486A 半导体封装构造及其制造方法 Semiconductor package and method for manufacturing
10/02/2013CN103337485A Novel safe layout method of core circuit module ports
10/02/2013CN103337484A Heat-dissipation device
10/02/2013CN103337483A Ultrathin VSOP (very thin small outline package) packaging part and production method thereof
10/02/2013CN103337466A Protection ring for preventing short circuit of test structure, and manufacturing method and package testing method thereof
10/02/2013CN103337463A Production method and structure of copper pillar micro bump
10/02/2013CN103337454A Design method of grooved MOS scribing groove
10/02/2013CN102468246B Semiconductor device and manufacturing method thereof
10/02/2013CN102290378B Semiconductor device and method for manufacturing the same
10/02/2013CN102176426B Method for manufacturing integrated circuit chip and integrated circuit structure
10/02/2013CN102169879B Highly integrated wafer fan-out packaging structure
10/02/2013CN102162961B Array substrate
10/02/2013CN102117752B Lead frame package structure and manufacturing method thereof
10/02/2013CN101770982B Liquid crystal display, liquid crystal display substrate and formation method thereof
10/02/2013CN101740415B Integrated circuit structure and method of forming same
10/02/2013CN101510548B Semiconductor device and method of manufacturing same
10/02/2013CN101375392B Package of light emitting diode and method for manufacturing the same
10/02/2013CN101312200B Image sensing devices and methods for fabricating same
10/01/2013US8549460 Supplying power to integrated circuits using a grid matrix formed of through-silicon vias
10/01/2013US8547701 Electronics module and method for manufacturing the same
10/01/2013US8547693 Mounting apparatus for fan
10/01/2013US8546962 Mark structure and method for measuring alignment accuracy between former layer and latter layer
10/01/2013US8546961 Alignment marks to enable 3D integration
10/01/2013US8546960 Manufacturing method of semiconductor device, semiconductor device and mobile communication device
10/01/2013US8546959 Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device
10/01/2013US8546958 Pressure-sensitive adhesive sheet for protecting semiconductor wafer
10/01/2013US8546956 Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding
10/01/2013US8546955 Multi-die stack package
10/01/2013US8546954 Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package
10/01/2013US8546953 Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit
10/01/2013US8546952 Electrical test structure applying 3D-ICS bonding technology for stacking error measurement
10/01/2013US8546951 3D integration microelectronic assembly for integrated circuit devices
10/01/2013US8546950 Semiconductor package and manufacturing method thereof
10/01/2013US8546949 Semiconductor device having wirings formed by damascene
10/01/2013US8546948 Silicon structure having bonding pad
10/01/2013US8546947 Chip structure and process for forming the same
10/01/2013US8546946 Chip stack package having spiral interconnection strands
10/01/2013US8546945 Pillar structure having a non-planar surface for semiconductor devices
10/01/2013US8546944 Multilayer dielectric memory device
10/01/2013US8546943 Ball grid array substrate with insulating layer and semiconductor chip package
10/01/2013US8546942 Flip-chip semiconductor device having anisotropic electrical interconnection and substrate utilized for the package
10/01/2013US8546941 Multi-direction design for bump pad structures
10/01/2013US8546940 Manufacturing method of lead frame substrate and semiconductor apparatus
10/01/2013US8546939 RF module including control IC without the aid of a relay pad
10/01/2013US8546938 Stacked package including spacers and method of manufacturing the same
10/01/2013US8546937 Semiconductor device
10/01/2013US8546936 Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package
10/01/2013US8546935 Semiconductor packages
10/01/2013US8546934 Method for manufacturing semiconductor devices having a glass substrate
10/01/2013US8546933 Semiconductor apparatus including resin case
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