H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1997
12/03/1997	EP0810660A1 Surface mount semiconductor diode device
12/03/1997	EP0810659A2 Semiconductor packaging apparatus and method
12/03/1997	EP0810658A2 Semiconductor device comprising a via-hole
12/03/1997	EP0810657A2 Heat sink with coolant accelerator
12/03/1997	EP0810656A2 Semiconductor device substrate and method of manufacturing the same
12/03/1997	EP0810655A2 A package for a semiconductor device
12/03/1997	EP0810654A1 Ball grid array package with substrate having no through holes or via interconnections
12/03/1997	EP0810651A2 Fabrication process for a connection between multilayer wirings in a semiconductor device
12/03/1997	EP0810649A2 Method for coupling substrates and structure
12/03/1997	EP0810300A1 Process for producing an aluminium film
12/03/1997	EP0810293A1 Gold alloy wire and method for making a bump
12/03/1997	EP0809924A1 Multiple chip module mounting assembly and computer using same
12/03/1997	EP0809862A2 Organic chip carriers for wire bond-type chips
12/03/1997	EP0809861A1 Method of manufacturing a semiconductor device for surface mounting suitable for comparatively high voltages, and such a semiconductor device
12/03/1997	EP0809860A1 Layered structure with a silicide layer, and process for producing such a layered structure
12/03/1997	EP0809779A1 Heat sink assemblies
12/03/1997	CN2269639Y Cooling device for high power semiconductor device
12/03/1997	CN1166912A A low cost, high performance package for microwave circuits in the up to 90 GHZ frequency range
12/02/1997	USH1699 Thermal bond system
12/02/1997	US5694300 Electromagnetically channelized microwave integrated circuit
12/02/1997	US5694297 Integrated circuit mounting structure including a switching power supply
12/02/1997	US5694071 Electronic device comprising means for compensating an undesired capacitance
12/02/1997	US5693984 Semiconductor device having a heat radiator
12/02/1997	US5693983 Thin-film structure with conductive molybdenum-chromium line
12/02/1997	US5693982 Semiconductor device socket
12/02/1997	US5693981 Semiconductor device
12/02/1997	US5693980 Ball-grid-array-type semiconductor device
12/02/1997	US5693966 Power MOS transistor
12/02/1997	US5693928 Method for producing a diffusion barrier and polymeric article having a diffusion barrier
12/02/1997	US5693701 Tamper-proof electronic coatings
12/02/1997	US5693573 Weakening the adhesion by plating a thin film over, removing the plated thin film, plurality connectors by wet etching
12/02/1997	US5693572 Using heat conductive slug
12/02/1997	US5693571 Method for mounting a semiconductor device by which deformation of leads is prevented
12/02/1997	US5693566 Layered low dielectric constant technology
12/02/1997	US5693565 Providing semiconductor chip comprising substrate with surface containing integrated circuits, bond pad, passivation layer, applying resin, heating, applying silicon carbide coating, depositing and patterning barrier layers
12/02/1997	US5693178 Depositing conductive film on substrate, depositing photoresist, exposing to radiation through mask, removing photoresist, plasma dry etching conductive film, removing photoresist to form two bonding pads, conductive patterns
12/02/1997	US5692558 Microchannel cooling using aviation fuels for airborne electronics
12/02/1997	US5692298 Method of making ceramic microwave electronic package
12/02/1997	US5692296 Method for encapsulating an integrated circuit package
11/1997
11/30/1997	CA2203213A1 Heat sink with coolant accelerator
11/27/1997	WO1997044991A1 Apparatus and method for mounting an electronic component to a substrate
11/27/1997	WO1997044859A1 Connectors for microelectronic elements
11/27/1997	WO1997044824A1 High-density, integrated circuit chip package
11/27/1997	WO1997044823A1 Substrate for a semiconductor chip
11/27/1997	WO1997044822A1 Ultra thin ball grid array package using a flex tape or printed wiring board substrate and method
11/27/1997	WO1997044821A1 Metal electronic package with peripherally attached leads
11/27/1997	WO1997044676A1 Microelectronic contact structure and method of making same
11/27/1997	WO1997044155A1 Method employing uv laser pulses of varied energy density to form blind vias in multilayered targets
11/27/1997	WO1997037373A3 Method for connecting area grid arrays to printed wire board
11/27/1997	DE19721310A1 Semiconductor memory chip repair on wafer
11/27/1997	DE19721141A1 Microwave range circuit assembly for MMIC
11/27/1997	DE19721061A1 Semiconductor module for power IGBT module
11/27/1997	DE19720707A1 Compound material for e.g. heatsink of semiconductor component of CPU
11/27/1997	DE19720439A1 Bipolar semiconductor device especially IGBT
11/27/1997	DE19709541A1 Resin encapsulated high frequency semiconductor component, e.g. FET, HEMT or MMIC
11/27/1997	DE19620517A1 Forcibly ventilated cooler device for power semiconductor of electrical machine
11/26/1997	EP0809292A2 Power transistor module
11/26/1997	EP0809291A2 Semiconductor device with intermetal dielectric and method of making
11/26/1997	EP0809290A2 Multi-layer interconnect for integrated circuit
11/26/1997	EP0809289A2 Lid air bridge for integrated circuit
11/26/1997	EP0809288A2 Integrated circuit with airbridge above a cavity between two bonded semiconductor wafers
11/26/1997	EP0809287A1 Heat dissipation device for an integrated circuit
11/26/1997	EP0809285A1 Method of metallizing an electronic microcircuit
11/26/1997	EP0808508A1 Methods of mechanical and electrical substrate connection
11/26/1997	EP0808459A1 Top load socket for ball grid array devices
11/26/1997	EP0808336A2 Amorphous copolymers of tetrafluoroethylene and hexafluoropropylene
11/26/1997	EP0525087B1 Crosslinkable fluorinated aromatic ether compositions
11/26/1997	CN1166235A Function-differentiated temp. compensated crystal oscillator and method of producing the same
11/26/1997	CN1166060A Lead frame structure for semiconductor package
11/26/1997	CN1166059A Radio frequency power amplification module
11/26/1997	CN1166058A Substrate for semiconductor package, fabrication method thereof, and stacked type semiconductor package using substrate
11/26/1997	CN1166057A Bottom lead semiconductor chip stack package
11/26/1997	CN1166053A Semiconductor device and method of its fabrication
11/26/1997	CN1166052A Lead frame and chip-size semiconductor package fabrication method applied thereto
11/26/1997	CN1166050A Metal layer patterns of semiconductor device and method for forming the same
11/25/1997	US5691884 Semiconductor device with removably fixed lead frame
11/25/1997	US5691812 Calibration standard for calibrating a defect inspection system and a method of forming same
11/25/1997	US5691673 Semiconductor integrated circuit apparatus having input/output portions impedance-matched for transmission lines
11/25/1997	US5691649 Carrier having slide connectors for testing unpackaged semiconductor dice
11/25/1997	US5691574 Semiconductor device capable of high speed operation and being integrated with high density
11/25/1997	US5691573 Composite insulation with a dielectric constant of less than 3 in a narrow space separating conductive lines
11/25/1997	US5691572 Interconnect structures for integrated circuits
11/25/1997	US5691571 Semiconductor device having fine contact hole with high aspect ratio
11/25/1997	US5691570 Semiconductor device
11/25/1997	US5691569 Integrated circuit package that has a plurality of staggered pins
11/25/1997	US5691568 Wire bondable package design with maxium electrical performance and minimum number of layers
11/25/1997	US5691567 Structure for attaching a lead frame to a heat spreader/heat slug structure
11/25/1997	US5691566 Tapered three-wire line vertical connections
11/25/1997	US5691565 Integrated circuitry having a pair of adjacent conductive lines
11/25/1997	US5691549 Sidewall strap
11/25/1997	US5691242 Method for making an electronic component having an organic substrate
11/25/1997	US5691241 Method for making plurality of leadframes having grooves containing island and inner leads
11/25/1997	US5691238 Integrated circuits
11/25/1997	US5691229 Process of fabricating dynamic random access memory cell having inter-level insulating structure without silicon nitride layer between access transistor and storage node
11/25/1997	US5691211 Method for gettering noble metals from mineral acid solution
11/25/1997	US5691209 Lattice interconnect method and apparatus for manufacturing multi-chip modules
11/25/1997	US5690877 Method of processing a semiconductor chip package
11/25/1997	US5690468 Fan assembly for an integrated circuit
11/25/1997	US5690281 For mounting an electric part
11/25/1997	CA2080814C Wiring board

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