H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1997
12/17/1997	EP0813238A2 Flip-Chip Semiconductor device with test structure and method of manufacturing the same
12/17/1997	EP0813236A1 Method for encapsulating an integrated semi-conductor circuit
12/17/1997	EP0813166A2 Card type memory device and a method for manufacturing the same
12/17/1997	EP0812883A1 Epoxy resin composition
12/17/1997	EP0812477A1 An improved laser ablateable material
12/17/1997	EP0812473A1 Arrangement of electronic components on a carrier strip
12/17/1997	EP0812258A1 Electrical feedthroughs for ceramic circuit board support substrates
12/17/1997	EP0597055B1 Electronic tag
12/17/1997	EP0503072B1 Semiconductor device and its manufacturing process
12/17/1997	CN2271026Y Radiating structure of semiconductor circuit assembly
12/17/1997	CN1168081A Noiseproof electronic elements and devices
12/17/1997	CN1168004A IC mounting/demounting system and mounting/demounting head therefor
12/17/1997	CN1167934A Surface complemental heat dissipation device
12/16/1997	US5699260 Technique for optimizing the number of IC chips obtainable from a wafer
12/16/1997	US5699234 Stacking of three dimensional high density interconnect modules with metal edge contacts
12/16/1997	US5699232 Power semiconductor module having a plastic housing a metal/ceramic multilayer substrate and terminals in a soft encapsulation
12/16/1997	US5699229 Electronic assembly
12/16/1997	US5699227 Integrated circuit package
12/16/1997	US5698904 Packaging material for electronic components
12/16/1997	US5698903 Bond pad option for integrated circuits
12/16/1997	US5698902 Semiconductor device having finely configured gate electrodes
12/16/1997	US5698901 Semiconductor device with amorphous carbon layer for reducing wiring delay
12/16/1997	US5698899 Semiconductor device with first and second sealing resins
12/16/1997	US5698898 Semiconductor apparatus with a multiple element electrode structure
12/16/1997	US5698897 Semiconductor device having a plated heat sink
12/16/1997	US5698896 High thermal conductive silicon nitride structural member, semiconductor package, heater and thermal head
12/16/1997	US5698895 Silicon segment programming method and apparatus
12/16/1997	US5698894 Integrated circuit
12/16/1997	US5698631 Room-temperature curable composition of hydroxy-functional compound, 1,2-epoxy-functional compound, and curative catalyst
12/16/1997	US5698496 Filling micro-channels of a non-conducting matrix with a liquid precursor of conductive material, heating and decomposing the dried precursor to form hollow tubular or porous conductive pathways
12/16/1997	US5698469 Method of making a hybrid circuit with a chip having active devices with extra-chip interconnections
12/16/1997	US5698466 For integrated circuits
12/16/1997	US5698465 Process for manufacturing an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating
12/16/1997	US5698462 Method for fabricating microwave semiconductor integrated circuit
12/16/1997	US5698456 Double mask hermetic passivation structure
12/16/1997	US5698015 Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste
12/16/1997	US5697795 IC socket
12/16/1997	US5697501 For use with a semiconductor chip package
12/16/1997	US5697434 Thermal energy delivery system
12/16/1997	US5697149 Method of coating an electronic component
12/11/1997	WO1997047165A1 Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device
12/11/1997	WO1997047040A1 I.c. device with concealed conductor lines
12/11/1997	WO1997047039A1 An integrated circuit which uses a recessed local conductor for producing staggered interconnect lines
12/11/1997	WO1997047038A1 An integrated circuit having horizontally and vertically offset interconnect lines
12/11/1997	WO1997047037A1 Semiconductor arrangement with plastic housing and heat spreader
12/11/1997	WO1997047036A1 An integrated circuit which uses a damascene process for producing staggered interconnect lines
12/11/1997	WO1997047031A1 Method for mounting semiconductor chip
12/11/1997	DE19723590A1 Cooling body for e.g. electric vehicle motor, control circuit, or internal combustion engine
12/11/1997	DE19714470A1 Multichip interconnection for multichip module containing programmable logic component
12/11/1997	DE19632115C1 Combination chip module for smart cards allowing both contacting- and contactless communication with external data station
12/10/1997	EP0812016A1 Integrated circuit air bridge structures and methods of fabricating same
12/10/1997	EP0812015A1 A heat dissipator for integrated circuits
12/10/1997	EP0812014A2 Power rectifier assembly
12/10/1997	EP0812013A2 Multilayer coating for microelectronic devices
12/10/1997	EP0811868A1 Liquid crystal display apparatus and fabrication process thereof
12/10/1997	EP0811706A1 Conformable nickel coating and process for coating an article with a conformable nickel coating
12/10/1997	EP0811262A1 Diode laser component with cooling element and diode laser module
12/10/1997	EP0811248A1 Method of forming a dram bit line contact
12/10/1997	EP0811247A1 Semiconductor processing method of forming an electrically conductive contact plug
12/10/1997	EP0811246A1 Tunneling technology for reducing intra-conductive layer capacitance
12/10/1997	EP0811245A1 Microelectronic assemblies including z-axis conductive films
12/10/1997	EP0810910A1 Heat-sinking structures and electrical sockets for use therewith
12/10/1997	EP0641485A4 Membrane dielectric isolation ic fabrication.
12/10/1997	CN1167422A Radiator
12/10/1997	CN1167342A Silicon semiconductor diode chip of all tangent plane junction glass passivation and making method
12/10/1997	CN1167340A Air-bridge structure of integrated circuit and making method thereof
12/10/1997	CN1167339A Semiconductor device, making method and composition type semiconductor device
12/10/1997	CN1167338A Method for making semiconductor device
12/09/1997	US5696666 Low profile exposed die chip carrier package
12/09/1997	US5696665 Integrated circuit package with diamond heat sink
12/09/1997	US5696466 Heterolithic microwave integrated impedance matching circuitry and method of manufacture
12/09/1997	US5696406 Semiconductor device and method for fabricating the same
12/09/1997	US5696405 Microelectronic package with device cooling
12/09/1997	US5696404 Semiconductor wafers with device protection means and with interconnect lines on scribing lines
12/09/1997	US5696403 System having input-output drive reduction
12/09/1997	US5696033 Method for packaging a semiconductor die
12/09/1997	US5696032 Tape application platform and processes therefor
12/09/1997	US5696031 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
12/09/1997	US5696030 Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor
12/09/1997	US5696029 Process for manufacturing a lead frame
12/09/1997	US5696027 Method of manufacturing a semiconductor chip carrier affording a high-density external interface
12/09/1997	US5695872 Thermally conductive, electrically insulating glued connection, method for the production thereof and employment thereof
12/09/1997	US5695847 Plurality of fibers dispersing in polymeric matrix uniformly oriented; heat transfer joints
12/09/1997	CA2115732C Integrated circuit devices with solderable lead frame
12/09/1997	CA2089435C Semiconductor device
12/04/1997	WO1997045955A1 Electronic component, in particular a component using acoustical surface acoustic waves
12/04/1997	WO1997045874A2 Microwave monolithic integrated circuit with coplaner waveguide having silicon-on-insulator composite substrate
12/04/1997	WO1997045873A1 Conductors for integrated circuits
12/04/1997	WO1997045872A1 Method and apparatus for programming anti-fuses using internally generated programming voltage
12/04/1997	WO1997045869A1 Semiconductor package and device socket
12/04/1997	WO1997045868A1 Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them
12/04/1997	WO1997045499A1 Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith
12/04/1997	DE19711683A1 IC mounting/demounting device and mounting/demounting head
12/04/1997	DE19647179A1 Thermoelectric device for heat removal from semiconductor component
12/04/1997	DE19621766A1 Halbleiteranordnung mit Kunststoffgehäuse und Wärmeverteiler A semiconductor device with plastic housing and heat spreader
12/04/1997	CA2256763A1 Conductors for integrated circuits
12/04/1997	CA2255961A1 Electronic component, in particular a component using acoustical surface acoustic waves
12/03/1997	EP0810708A2 Semiconductor device having individual power supply lines shared between function blocks for discharging surge without propagation of noise
12/03/1997	EP0810663A1 Layout structure of capacitive element(s) and interconnections in a semiconductor
12/03/1997	EP0810661A2 Microelectronic packaging using arched solder columns

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