| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/13/1998 | US5706995 Apparatus for the treatment of cloth strip with metal-surface rollers |
| 01/13/1998 | US5706579 Method of assembling integrated circuit package |
| 01/13/1998 | US5706577 No fixture method to cure die attach for bonding IC dies to substrates |
| 01/08/1998 | WO1998001015A1 Spray-cooling circuit board apparatus |
| 01/08/1998 | WO1998000869A1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 01/08/1998 | WO1998000867A1 Integrated semiconductor circuit |
| 01/08/1998 | WO1998000866A1 Reduced parasitic capacitance semiconductor devices |
| 01/08/1998 | WO1998000864A1 Component housing for surface mounting a semiconductor component |
| 01/08/1998 | WO1998000259A1 Fabrication methods for boron carbide-aluminum alloy metal matrix composites |
| 01/08/1998 | DE19727972A1 Semiconductor substrate with temperature stabilised electronic circuit |
| 01/08/1998 | DE19654703A1 Lead forming and bending mechanism |
| 01/08/1998 | DE19624316A1 Etching alignment marks in silicon layer |
| 01/08/1998 | CA2209620A1 Fet input/output pad layout |
| 01/07/1998 | EP0817553A1 Heat exchanger |
| 01/07/1998 | EP0817550A1 Circuit board with improved positioning means |
| 01/07/1998 | EP0817276A1 Semiconductor device and production method therefor |
| 01/07/1998 | EP0817269A2 Wordline layout for semiconductor memory device |
| 01/07/1998 | EP0817267A1 Semiconductor package having pins connected to inner layers of multilayer structure |
| 01/07/1998 | EP0817266A2 Mounting structure for an integrated circuit |
| 01/07/1998 | EP0817265A1 Lead frame for an integrated circuit and package comprising such a lead frame and a heat slug |
| 01/07/1998 | EP0817264A2 Semiconductor device |
| 01/07/1998 | EP0817263A2 Liquid cooling system for LSI packages |
| 01/07/1998 | EP0817262A2 Composite leadframe |
| 01/07/1998 | EP0817261A1 Method for manufacturing plastic package for electronic device having a fully insulated dissipator |
| 01/07/1998 | EP0817260A2 IC package, IC prober and connector and method of forming the same |
| 01/07/1998 | EP0817258A2 Method for manufacturing an interconnection structure in a semiconductor device |
| 01/07/1998 | EP0817255A2 Dummy wafer |
| 01/07/1998 | EP0817254A2 Semiconductor device and methods for producing and mounting the semiconductor device |
| 01/07/1998 | EP0817253A2 Attaching heat sinks directly to flip chips and ceramic chip carriers |
| 01/07/1998 | EP0817251A1 Method of forming a doped silicon oxide film |
| 01/07/1998 | EP0817197A2 Improvements in or relating to integrated circuits |
| 01/07/1998 | EP0816423A1 Thermally conductive polytetrafluoroethylene article |
| 01/07/1998 | EP0816111A2 Image processing equipment |
| 01/07/1998 | EP0815615A1 A package housing multiple semiconductor dies |
| 01/07/1998 | EP0815593A2 Solder bump fabrication methods and structure including a titanium barrier layer |
| 01/07/1998 | EP0815591A2 Microcircuit via interconnect |
| 01/07/1998 | EP0815403A1 Cooling system for electronics |
| 01/07/1998 | EP0746884A4 Spring biased tapered contact element |
| 01/07/1998 | EP0591414B1 Lead frame for integrated circuits or the like |
| 01/07/1998 | CN1169593A Semiconductor device and electronic device using same |
| 01/07/1998 | CN1169592A 半导体器件 Semiconductor devices |
| 01/06/1998 | US5706178 Ball grid array integrated circuit package that has vias located within the solder pads of a package |
| 01/06/1998 | US5706177 Multi-terminal surface-mounted electronic device |
| 01/06/1998 | US5706175 Resin-sealed semiconductor device |
| 01/06/1998 | US5706174 Compliant microelectrionic mounting device |
| 01/06/1998 | US5706172 Stacked semiconductor package having supporting bars and a socket therefor |
| 01/06/1998 | US5706171 Flat plate cooling using a thermal paste retainer |
| 01/06/1998 | US5706169 Cooling apparatus for a computer central processing unit |
| 01/06/1998 | US5706156 Semiconductor device having an ESD protective circuitry |
| 01/06/1998 | US5705935 Method of managing mapping data indicative of excellent/defective chips on semiconductor wafer |
| 01/06/1998 | US5705858 Packaging structure for a hermetically sealed flip chip semiconductor device |
| 01/06/1998 | US5705857 Capped copper electrical interconnects |
| 01/06/1998 | US5705856 Semiconductor device |
| 01/06/1998 | US5705855 For displaying information to a user |
| 01/06/1998 | US5705854 Cooling apparatus for electronic device |
| 01/06/1998 | US5705853 Power semiconductor module |
| 01/06/1998 | US5705851 Thermal ball lead integrated package |
| 01/06/1998 | US5705850 Semiconductor module |
| 01/06/1998 | US5705849 Antifuse structure and method for manufacturing it |
| 01/06/1998 | US5705570 Acrylate polymers |
| 01/06/1998 | US5705431 Production method for insulated semiconductor device |
| 01/06/1998 | US5705427 Method of forming a landing pad structure in an integrated circuit |
| 01/06/1998 | US5705426 Method of forming semiconductor device having planarized wiring with good thermal resistance |
| 01/06/1998 | US5705425 Process for manufacturing semiconductor devices separated by an air-bridge |
| 01/06/1998 | US5705407 Method of forming high performance bipolar devices with improved wiring options |
| 01/06/1998 | US5705404 Method of implant verification in semiconductor device using reticle specific indicator |
| 01/06/1998 | US5704593 Film carrier tape for semiconductor package and semiconductor device employing the same |
| 01/06/1998 | US5704419 Heat removal apparatus for an electronic component |
| 01/06/1998 | US5704416 For cooling a heat dissipating component |
| 01/06/1998 | CA2109761C Electronic module of extra-thin construction |
| 01/06/1998 | CA2019026C Electrode structure for iii-v compound semiconductor element and method of manufacturing the same |
| 01/02/1998 | DE19725625A1 Semiconductor casing with bottom leads |
| 01/02/1998 | DE19723203A1 Chip size semiconductor component |
| 01/02/1998 | DE19626227A1 Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere Multichipmodule Arrangement for heat dissipation in chip modules on multi-layered ceramic carriers, particularly multi-chip modules |
| 01/02/1998 | DE19626087A1 Integrierte Halbleiterschaltung A semiconductor integrated circuit |
| 01/02/1998 | DE19626082A1 Package for surface-mounted semiconductor device |
| 01/02/1998 | DE19625764A1 Nitrogen cooler for electronic assemblies, especially sensors |
| 01/02/1998 | DE19625748A1 Cooler for electronic assembly |
| 01/02/1998 | DE19625228A1 Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse System carrier for mounting an integrated circuit in an injection molding housing |
| 01/02/1998 | DE19624631A1 Integrated circuit chip card e.g for interfacing between host computer and expansion card in note book and PC |
| 12/31/1997 | WO1997050281A1 Filter chip |
| 12/31/1997 | WO1997050128A1 Interconnect design with controlled inductance |
| 12/31/1997 | WO1997050127A1 Stacked semiconductor device package |
| 12/31/1997 | WO1997050126A1 A c4 substrate contact pad which has a layer of ni-b plating |
| 12/31/1997 | WO1997050125A1 Plate fin heat exchanger |
| 12/31/1997 | WO1997050124A1 Thermal grease insertion and retention |
| 12/31/1997 | WO1997050123A1 A power-ground plane for a c4 flip-chip substrate |
| 12/31/1997 | WO1997050121A1 Method for transferring conductor pattern to film carrier, mask used for the method and film carrier |
| 12/31/1997 | WO1997050111A1 Semiconducteur chip and reticle for manufacturing semiconductor |
| 12/31/1997 | WO1997050056A1 Leadframe for the assembly of an integrated circuit in an injection mounded housing |
| 12/31/1997 | CN1169235A Printed circuit board and heat sink arrangement |
| 12/31/1997 | CN1169035A Integrated circuit with gate-array interconnections rounted over memory area |
| 12/31/1997 | CN1169034A Charge coupled device (CCD) semiconductor chip package |
| 12/31/1997 | CN1169033A Improved semiconductor package |
| 12/31/1997 | CN1169032A 引线框架和半导体封装 Lead frame and semiconductor package |
| 12/31/1997 | CN1169028A Semiconductor device testing apparatus |
| 12/31/1997 | CN1169027A Semiconductor package lead deflash method |
| 12/31/1997 | CA2258896A1 Plate fin heat exchanger |
| 12/30/1997 | US5703761 Shielding for flat modules |
| 12/30/1997 | US5703755 Flexible electronic card and method |