| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/27/1998 | US5711848 Non-product patterned particle test wafer and testing method therefor |
| 01/27/1998 | US5711069 Method of making an integrated circuit package with flat-topped heat sink |
| 01/27/1998 | CA2061949C Electronic circuit package |
| 01/22/1998 | WO1998002921A1 Transferred flexible integrated circuit |
| 01/22/1998 | WO1998002920A1 Semiconductor module |
| 01/22/1998 | WO1998002919A1 Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device |
| 01/22/1998 | DE19628548A1 Heat sink profile for air cooling device for semiconductor components |
| 01/22/1998 | DE19628546A1 Heat pipe manufacturing method |
| 01/22/1998 | DE19628545A1 Intensive cooling device for air-cooled current regulator |
| 01/21/1998 | EP0820099A2 Packaged semiconductor device and method of manufacturing the same |
| 01/21/1998 | EP0820098A2 Switched management of thermal impedance to reduce temperature excursions |
| 01/21/1998 | EP0820097A1 Semiconductor chips with bond pads suitable for improved die testing |
| 01/21/1998 | EP0819727A1 Method for producing a diffusion barrier and polymeric article having a diffusion barrier |
| 01/21/1998 | EP0819318A1 A solder bump structure for a microelectronic substrate |
| 01/21/1998 | CN1171168A Ballast monitoring for radio frequency power transistors |
| 01/21/1998 | CN1171167A Composite intermediate connecting element of microelectronic device and its production method |
| 01/21/1998 | CN1171166A Forming a planar surface over a substrate by modification topography of the substrate |
| 01/21/1998 | CN1171165A Thermally and electrically enhanced plastic pin grid array (PPGA) package |
| 01/21/1998 | CN1170962A Metal contact structure of semiconductor device and method of fabricating the same |
| 01/21/1998 | CN1170961A Lid air bridge line |
| 01/21/1998 | CN1170960A Substrate for semiconductor device, method of manufacturing the same, semiconductor device, card type module, and information storage device |
| 01/20/1998 | US5710695 Leadframe ball grid array package |
| 01/20/1998 | US5710694 Adjustable radiation fin fastening device for an integrated circuit chip |
| 01/20/1998 | US5710538 Circuit having trim pads formed in scribe channel |
| 01/20/1998 | US5710515 Non-volatile memory in power and linear integrated circuits |
| 01/20/1998 | US5710462 Semiconductor integrated circuit device having multi-level wiring structure without dot pattern |
| 01/20/1998 | US5710460 Structure for reducing microelectronic short circuits using spin-on glass as part of the interlayer dielectric |
| 01/20/1998 | US5710459 Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability |
| 01/20/1998 | US5710458 Card like semiconductor device |
| 01/20/1998 | US5710457 Semiconductor integrated circuit |
| 01/20/1998 | US5710456 Semiconductors, bonding strength |
| 01/20/1998 | US5710203 Electronic coating compositions |
| 01/20/1998 | US5710082 Glass composition having a low dielectric constant for high-frequency circuits |
| 01/20/1998 | US5710068 Low thermal impedance integrated circuit |
| 01/20/1998 | US5710067 Antireflective layer during photolithograghic processing of semiconductors, plasma enhanced vapor deposition |
| 01/20/1998 | US5710064 Method for manufacturing a semiconductor package |
| 01/20/1998 | US5710062 Plastic molded semiconductor package and method of manufacturing the same |
| 01/20/1998 | US5710060 Method of forming wiring using sputtered insulating mask |
| 01/20/1998 | US5709960 Filler mixture, dielectrics, thermoconductivity, semiconductors |
| 01/20/1998 | US5709958 Integrated circuits |
| 01/20/1998 | US5709715 Silicon or silica substrate with a modified surface, process for producing the same, new orthoesters and process for producing the same |
| 01/20/1998 | US5709336 Method of forming a solderless electrical connection with a wirebond chip |
| 01/20/1998 | US5709263 High performance sinusoidal heat sink for heat removal from electronic equipment |
| 01/15/1998 | WO1998002025A1 Low-emi circuit board and low-emi cable connector |
| 01/15/1998 | WO1998001907A1 Resin-encapsulated semiconductor device and method of manufacturing the same |
| 01/15/1998 | WO1998001906A1 Floating lateral support for ends of elongate interconnection elements |
| 01/15/1998 | DE19654828C1 Microchip manufacturing method for photoelectronic microchip with opaque film |
| 01/15/1998 | DE19632389C1 Clamping arrangement for component |
| 01/15/1998 | DE19627426A1 Light-triggered power thyristor using free-floating technology |
| 01/14/1998 | EP0818828A1 Power field effect transistor |
| 01/14/1998 | EP0818824A2 High-frequency semiconductor device |
| 01/14/1998 | EP0818823A2 Radio frequency module and method for fabricating the radio frequency module |
| 01/14/1998 | EP0818822A2 Package structure for multichip modules |
| 01/14/1998 | EP0818821A2 Al/Ti layered interconnection and method of forming the same |
| 01/14/1998 | EP0818820A1 Full open P-N junction glass passivated silicon semiconductor diode chip and preparation method thereof |
| 01/14/1998 | EP0818817A2 Aluminium hole filling using ionized metal adhesion layer |
| 01/14/1998 | EP0818816A1 Method of forming airbridged metallization for integrated circuit fabrication |
| 01/14/1998 | EP0818814A2 Overlay alignment measurement of semiconductor wafers |
| 01/14/1998 | EP0818813A1 Component system for bonding and method of bonding enabling thermal dilatations |
| 01/14/1998 | EP0818812A1 Connection construction and method of manufacturing the same |
| 01/14/1998 | EP0818563A1 Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath |
| 01/14/1998 | EP0818511A2 Curable liquid-form composition, cured product of the same, and electronic part |
| 01/14/1998 | EP0818132A1 A method to prevent intrusions into electronic circuitry |
| 01/14/1998 | EP0818024A1 Card-like data substrate and lead frame for use therein |
| 01/14/1998 | EP0818023A2 Support module |
| 01/14/1998 | CN1170474A Forming polyimide coatings by screen printing |
| 01/14/1998 | CN1170277A Electronic component |
| 01/14/1998 | CN1170235A Lead-on-chip lead frame and semiconductor package using the same |
| 01/14/1998 | CN1170234A Semiconductor apparatus |
| 01/14/1998 | CN1170233A Lead member for electronic part, and process of producing the same |
| 01/14/1998 | CN1170145A Liquid crystal displaying element |
| 01/13/1998 | USRE35713 Disc recording and/or reproducing apparatus |
| 01/13/1998 | US5708959 Substrate for semiconductor apparatus |
| 01/13/1998 | US5708621 Semiconductor memory with improved word line structure |
| 01/13/1998 | US5708570 Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures |
| 01/13/1998 | US5708567 Ball grid array semiconductor package with ring-type heat sink |
| 01/13/1998 | US5708564 Heat sink mounting structure |
| 01/13/1998 | US5708419 Method of wire bonding an integrated circuit to an ultraflexible substrate |
| 01/13/1998 | US5708372 Semiconductor device with electromagnetic radiation reduced |
| 01/13/1998 | US5708304 Semiconductor device |
| 01/13/1998 | US5708303 Semiconductor device having damascene interconnects |
| 01/13/1998 | US5708300 Semiconductor device having contoured package body profile |
| 01/13/1998 | US5708299 Multichip press-contact type semiconductor device |
| 01/13/1998 | US5708298 Semiconductor memory module having double-sided stacked memory chip layout |
| 01/13/1998 | US5708297 Thin multichip module |
| 01/13/1998 | US5708296 Electronic package |
| 01/13/1998 | US5708295 Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same |
| 01/13/1998 | US5708294 Lead frame having oblique slits on a die pad |
| 01/13/1998 | US5708293 Lead frame and method of mounting semiconductor chip |
| 01/13/1998 | US5708291 Silicide agglomeration fuse device |
| 01/13/1998 | US5708283 Flip chip high power monolithic integrated circuit thermal bumps |
| 01/13/1998 | US5707902 Polymer, metal |
| 01/13/1998 | US5707901 Method utilizing an etch stop layer |
| 01/13/1998 | US5707898 Method of forming a programmable non-volatile memory cell by providing a shielding layer over the gate sidewalls |
| 01/13/1998 | US5707894 Bonding pad structure and method thereof |
| 01/13/1998 | US5707782 Photoimageable, dielectric, crosslinkable copolyesters |
| 01/13/1998 | US5707730 Adhesive for semiconductor device and reinforcing material using the same |
| 01/13/1998 | US5707715 Metal ceramic composites with improved interfacial properties and methods to make such composites |
| 01/13/1998 | US5707686 Method for preventing moisture from being absorbed into impurity-contained insulating layer |
| 01/13/1998 | US5707683 Electronic coating composition method of coating an electronic substrate, composition and article |