| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/05/1998 | WO1998005045A1 Conductor paste and multilayer ceramic part using the same |
| 02/05/1998 | WO1998004925A2 Structure for testing junction leakage of salicided devices fabricated using shallow trench and refill techniques |
| 02/05/1998 | WO1998004602A1 Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor |
| 02/05/1998 | DE19733416A1 Packaging for semiconductor chip |
| 02/05/1998 | DE19732625A1 Bipolar transistor packaging for HF device, e.g. DBS converter |
| 02/05/1998 | DE19732500A1 Resin composition for embedding semiconductor parts |
| 02/05/1998 | DE19732432A1 Titanium nitride film formation by CVD |
| 02/05/1998 | DE19723202A1 Crack resistant semiconductor component production |
| 02/05/1998 | DE19703223A1 Electrode manufacturing method for semiconductor device |
| 02/05/1998 | DE19631046A1 Chip surface bond structure |
| 02/05/1998 | DE19630902A1 Temperature monitoring device for power semiconductor IGBT |
| 02/04/1998 | EP0822738A2 Column array connections |
| 02/04/1998 | EP0822737A2 Unit type clip lead terminal, connecting method, connecting board and method of producing such board |
| 02/04/1998 | EP0822596A2 Improvements in or relating to integrated circuits |
| 02/04/1998 | EP0822595A2 Hybrid module |
| 02/04/1998 | EP0822592A2 A method of forming conductive lines on a semiconductor wafer |
| 02/04/1998 | EP0822586A2 Improvements in or relating to integrated circuits |
| 02/04/1998 | EP0822397A1 Method for packaging semiconductor devices |
| 02/04/1998 | EP0822264A1 Gold alloy wire for wedge bonding and use thereof for wedge bonding |
| 02/04/1998 | CN1172552A Thermally enhanced leadframe |
| 02/04/1998 | CN1172350A Semiconductor equipment and its manufacturing method |
| 02/04/1998 | CN1172349A Gold alloy wire for wedge bonding and use thereof in wedge bonding |
| 02/04/1998 | CN1172348A Package for mounting semiconductor package |
| 02/04/1998 | CN1172345A Crack-resistant semiconductor package and fabrication method thereof and fabrication apparatus thereof |
| 02/04/1998 | CN1172343A Method for forming gate having polyside structure |
| 02/04/1998 | CN1037301C Electrode for semiconductor element |
| 02/03/1998 | USRE35721 Cooling device of semiconductor chips |
| 02/03/1998 | US5715147 Semiconductor device having an interconnecting circuit board |
| 02/03/1998 | US5715142 Electronic power module |
| 02/03/1998 | US5715127 Method for preventing electrostatic discharge failure in an integrated circuit package |
| 02/03/1998 | US5714804 Semiconductor contact structure in integrated semiconductor devices |
| 02/03/1998 | US5714803 Low-profile removable ball-grid-array integrated circuit package |
| 02/03/1998 | US5714801 Semiconductor package |
| 02/03/1998 | US5714800 Integrated circuit assembly having a stepped interposer and method |
| 02/03/1998 | US5714799 Resin-sealed type semiconductor device having an unoccupied second die pad |
| 02/03/1998 | US5714795 Capable of high-speed writing and reading and having extreemly high reliability |
| 02/03/1998 | US5714792 Semiconductor device having a reduced die support area and method for making the same |
| 02/03/1998 | US5714789 Circuit board-mounted IC package cooling apparatus |
| 02/03/1998 | US5714782 Composite integrated circuit device |
| 02/03/1998 | US5714771 Projection type color display device, liquid crystal device, active matrix assembly and electric view finder |
| 02/03/1998 | US5714416 Semiconductor memory device and write-once, read-only semiconductor memory array using amorphous-silicon and method therefor |
| 02/03/1998 | US5714405 Semiconductor device |
| 02/03/1998 | US5714252 Highly reliable flip-chip connections |
| 02/03/1998 | US5714246 Unfired green tape consists of a binder, silver and solid glass portion; can be used as heat sink in a multi-chip module or multilayer circuit |
| 02/03/1998 | US5714241 Rganic binder, solvent, and inorganic component containing powdery gold, vanadium pentaoxide, and copper(ii) oxide |
| 02/03/1998 | US5714238 Conductive adhesive and circuit using the same |
| 02/03/1998 | US5714086 Composition for protecting solder interconnection between semiconductor and substrate comprising curable thermosetting propargyl ether-based binder including transition metal curing catalyst, accelerator, filler |
| 02/03/1998 | US5714038 Method for forming contact hole of semiconductor device |
| 02/03/1998 | US5713997 Solution for selectively imparting tackiness to a metallic surface |
| 02/03/1998 | US5713751 IC socket |
| 02/03/1998 | US5713690 Apparatus for attaching heatsinks |
| 02/03/1998 | US5713582 Seal retainer |
| 02/03/1998 | US5713413 Cooling apparatus using boiling and condensing refrigerant |
| 02/03/1998 | CA2083072C Method for manufacturing polyimide multilayer wiring substrate |
| 01/29/1998 | WO1998004109A1 Non-mechanical magnetic pump for liquid cooling |
| 01/29/1998 | WO1998004108A1 Microchannel cooling using aviation fuels for airborne electronics |
| 01/29/1998 | WO1998004107A1 Z-axis interconnect method and circuit |
| 01/29/1998 | WO1998003999A1 Rf power package with a dual ground |
| 01/29/1998 | WO1998003998A1 Semiconductor component with insulating housing |
| 01/29/1998 | WO1998003997A1 Closed loop liquid cooling within rf modules |
| 01/29/1998 | WO1998003996A1 Microchannel cooling of high power semiconductor devices |
| 01/29/1998 | WO1998003994A1 Integrated circuit which uses an etch stop for producing staggered interconnect lines |
| 01/29/1998 | DE19713186A1 Semiconductor device for high frequency circuit |
| 01/29/1998 | DE19630173A1 Semiconductor power module for current rectifier |
| 01/29/1998 | DE19629767A1 Lead frame with raised guidance surfaces for semiconductor chip esp. DRAM memory |
| 01/29/1998 | DE19628665A1 Halbleiter-Modul Semiconductor module |
| 01/29/1998 | CA2260823A1 Rf power package with a dual ground |
| 01/28/1998 | EP0821425A2 A semiconductor device having a semiconductor switch structure |
| 01/28/1998 | EP0821407A2 Semiconductor devices having protruding contacts and method for making the same |
| 01/28/1998 | EP0821406A2 Method of wire bonding an integrated circuit to an ultra-flexible substrate |
| 01/28/1998 | EP0821038A2 Curable silicone composition and method for manufacturing electrical parts |
| 01/28/1998 | EP0820639A1 Process for passivating a silicon carbide surface against oxygen |
| 01/28/1998 | CN1171627A Plastic molded type semiconductor device and method of manufacturing same |
| 01/28/1998 | CN1171624A Method of fabricating semiconductor device |
| 01/28/1998 | CN1171530A Heat radiation structure of closed type device |
| 01/28/1998 | CN1171457A Liquid and method to clean metal masks for surface mounting technology |
| 01/27/1998 | US5712767 Circuit elements mounting |
| 01/27/1998 | US5712762 Computer having a heat sink structure incorporated therein |
| 01/27/1998 | US5712752 Input/output protecting circuit and a protection element |
| 01/27/1998 | US5712576 Semiconductor integrated circuit device having input circuit without influence on reliability of diagnosis |
| 01/27/1998 | US5712571 Apparatus and method for detecting defects arising as a result of integrated circuit processing |
| 01/27/1998 | US5712510 Reduced electromigration interconnection line |
| 01/27/1998 | US5712509 Semiconductor integrated circuit interconnection structures |
| 01/27/1998 | US5712507 Semiconductor device mounted on die pad having central slit pattern and peripheral slit pattern for absorbing |
| 01/27/1998 | US5712506 Semiconductor device with passivation layer of benzocyclobutene polymer and silicon powder |
| 01/27/1998 | US5712500 Semiconductor memory device |
| 01/27/1998 | US5712493 Display device having driving circuits at the periphery of a substrate |
| 01/27/1998 | US5712492 Transistor for checking radiation-hardened transistor |
| 01/27/1998 | US5712321 Amine curable polyether-ene polymers |
| 01/27/1998 | US5712206 Method of forming moisture barrier layers for integrated circuit applications |
| 01/27/1998 | US5712197 Method of manufacturing a semiconductor device suitable for surface mounting |
| 01/27/1998 | US5712195 Method for making via structure with metallic spacer |
| 01/27/1998 | US5712194 Semiconductor device including interlayer dielectric film layers and conductive film layers |
| 01/27/1998 | US5712193 Method of treating metal nitride films to reduce silicon migration therein |
| 01/27/1998 | US5712192 Process for connecting an electrical device to a circuit substrate |
| 01/27/1998 | US5712190 Process for controlling distance between integrated circuit chips in an electronic module |
| 01/27/1998 | US5712181 Method for the formation of polycide gate in semiconductor device |
| 01/27/1998 | US5712140 Method of manufacturing interconnection structure of a semiconductor device |
| 01/27/1998 | US5711987 Electronic coatings |
| 01/27/1998 | US5711858 Process for depositing a conductive thin film upon an integrated circuit substrate |