| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/24/1998 | US5721156 Method of manufacturing a semiconductor device with a planarized integrated circuit |
| 02/24/1998 | US5721150 Use of silicon for integrated circuit device interconnection by direct writing of patterns therein |
| 02/24/1998 | US5721044 Multiple substrate |
| 02/24/1998 | US5720342 Integrated converter for extending the life span of electronic components |
| 02/24/1998 | US5720338 Two-phase thermal bag component cooler |
| 02/24/1998 | US5720100 Assembly having a frame embedded in a polymeric encapsulant and method for forming same |
| 02/19/1998 | WO1998007306A1 Methods and apparatus for cooling systems for cryogenic power conversion electronics |
| 02/19/1998 | WO1998007305A1 Cooling system and method using impingement air-cooling |
| 02/19/1998 | WO1998007304A1 Heat sink |
| 02/19/1998 | WO1998007303A1 Heat sink |
| 02/19/1998 | WO1998007193A1 Multichip module |
| 02/19/1998 | WO1998007191A1 Combination chip module and process for production of a combination chip module |
| 02/19/1998 | WO1998006708A1 Crystalline form of 4-[5-methyl-3-phenylisoxazol-4-yl]benzenesulfonamide |
| 02/19/1998 | CA2264104A1 Crystalline form of 4-[5-methyl-3-phenylisoxazol-4-yl]benzenesulfonamide |
| 02/18/1998 | EP0824301A2 Printed circuit board, IC card, and manufacturing method thereof |
| 02/18/1998 | EP0823983A1 Precision clamp, and method for clamping thyristors and similar electronic power components |
| 02/18/1998 | CN1173883A Amorphous copolymers of tetrafluoethylene and hyxafluoropropylene |
| 02/18/1998 | CN1173737A Method of packaging fragile devices with gel medium confined by rim member |
| 02/18/1998 | CN1173736A Connter-fusing component and its mfg. method |
| 02/18/1998 | CN1173735A Method of wire bonding integrated circuit to ultraflexible substrate |
| 02/18/1998 | CN1173734A Contact mask for manufacturing semiconductor device |
| 02/18/1998 | CN1173546A Gold alloy wire and method for making bump |
| 02/17/1998 | US5719748 Semiconductor package with a bridge for chip area connection |
| 02/17/1998 | US5719530 High power bipolar transistor device |
| 02/17/1998 | US5719449 Flip-chip integrated circuit with improved testability |
| 02/17/1998 | US5719448 Bonding pad structures for semiconductor integrated circuits |
| 02/17/1998 | US5719447 Silver alloy; high performance, reliability |
| 02/17/1998 | US5719446 Multilayer interconnect structure for semiconductor device and method of manufacturing same |
| 02/17/1998 | US5719444 Packaging and cooling system for power semi-conductor |
| 02/17/1998 | US5719443 Adjustable spacer for flat plate cooling applications |
| 02/17/1998 | US5719442 Resin sealing type semiconductor device |
| 02/17/1998 | US5719441 For cooling high power heat generating semiconductor devices |
| 02/17/1998 | US5719440 Flip chip adaptor package for bare die |
| 02/17/1998 | US5719438 Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging |
| 02/17/1998 | US5719437 Smart cards having thin die |
| 02/17/1998 | US5719436 Package housing multiple semiconductor dies |
| 02/17/1998 | US5719433 Semiconductor component with integrated heat sink |
| 02/17/1998 | US5719090 Multilayer coating of thermosetting resin filling interstices between fibers, first coating cured beyond b stage and second coating cured to b stage |
| 02/17/1998 | US5719088 Method of fabricating semiconductor devices with a passivated surface |
| 02/17/1998 | US5719083 Method of forming a complex film over a substrate having a specifically selected work function |
| 02/17/1998 | US5719072 Forming conductive layer, forming insulating films, forming photosensitive film, exposing, developing, etching |
| 02/17/1998 | US5719071 Method of forming a landing pad sturcture in an integrated circuit |
| 02/17/1998 | US5719070 Used to connect solder contact to a semiconductor substrate |
| 02/17/1998 | US5719042 Nucleic acids encoding transcription factor APRF (acute phase response factor) |
| 02/17/1998 | US5718595 Socket apparatus |
| 02/12/1998 | WO1997045874A3 Microwave monolithic integrated circuit with coplaner waveguide having silicon-on-insulator composite substrate |
| 02/12/1998 | DE19734047A1 Parasitic metal-insulator-metal structures analysing method for silicon semiconductor device |
| 02/12/1998 | DE19632200A1 Multichipmodul Multi-chip module |
| 02/12/1998 | DE19632116A1 Semiconductor chip identification device |
| 02/11/1998 | EP0823833A2 Multilayer printed circuit boards |
| 02/11/1998 | EP0823733A2 Antifuse element and method for manufacturing the same |
| 02/11/1998 | EP0823732A1 Film carrier and semiconductor device using same |
| 02/11/1998 | EP0823731A2 Method of forming a semiconductor metallization system and structure therefor |
| 02/11/1998 | EP0823730A1 Method of making an isolation layer serving as intermetal dielectric |
| 02/11/1998 | EP0823729A1 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device |
| 02/11/1998 | EP0823451A1 Thermally conductive silicone composition, thermally conductive materials and thermally conductive silicone grease |
| 02/11/1998 | EP0823196A1 Cooling body for cooling power gates |
| 02/11/1998 | EP0823130A1 Encapsulation of transmitter and receiver modules |
| 02/11/1998 | EP0823129A1 Chip cover |
| 02/11/1998 | EP0822894A1 Anodized aluminum substrate having increased breakdown voltage |
| 02/11/1998 | CN1173108A Multilayer printed circuit boards |
| 02/11/1998 | CN1173057A Laser dioder pumped solid-state laser apparatus |
| 02/11/1998 | CN1173042A Direct chip attach for low alpha emission interconnect system |
| 02/11/1998 | CN1173041A Method for manufacturing for semiconductor device |
| 02/10/1998 | US5717712 Laser communication system with temperature controlled |
| 02/10/1998 | US5717573 Interconnection card and methods for manufacturing and connecting the card |
| 02/10/1998 | US5717559 Input/output protection device for use in semiconductor device |
| 02/10/1998 | US5717255 Semiconductor device |
| 02/10/1998 | US5717253 Structure for forming an improved quality silicidation layer |
| 02/10/1998 | US5717252 Solder-ball connected semiconductor device with a recessed chip mounting area |
| 02/10/1998 | US5717251 Semiconductor integrated circuit device having minature multi-level wiring structure low in parasitic capacitance |
| 02/10/1998 | US5717250 Sputter and CVD deposited titanium nitride barrier layer between a platinum layer and a polysilicon plug |
| 02/10/1998 | US5717249 RF power amplifying circuit device |
| 02/10/1998 | US5717248 Cooling and screening device having contact pins for an integrated circuit |
| 02/10/1998 | US5717247 Microcircuit via interconnect |
| 02/10/1998 | US5717246 Hybrid frame with lead-lock tape |
| 02/10/1998 | US5717245 Ball grid array arrangement |
| 02/10/1998 | US5717243 Integrated circuit with an improved inductor structure and method of fabrication |
| 02/10/1998 | US5717242 Integrated circuit having local interconnect for reduing signal cross coupled noise |
| 02/10/1998 | US5717232 Semiconductor device sealed with molded resin |
| 02/10/1998 | US5717231 Antenna having elements with improved thermal impedance |
| 02/10/1998 | US5717230 Field programmable gate array having reproducible metal-to-metal amorphous silicon antifuses |
| 02/10/1998 | US5717162 IC carrier having a movable and stationary corner rulers |
| 02/10/1998 | US5717054 Quick-setting |
| 02/10/1998 | US5717034 Polymerizable monomers, perfluorinated hydrocarbon polymer, curing catalyst; dielectrics |
| 02/10/1998 | US5716891 Heating, low pressure vapor depositing a dielectric silica layer |
| 02/10/1998 | US5716890 Structure and method for fabricating an interlayer insulating film |
| 02/10/1998 | US5716889 Method of arranging alignment marks |
| 02/10/1998 | US5716888 An intermetal dielectric layer is vapor deposited overlying first patterned metal layer having openings between metal lines over semiconductor structure in and on the substrate, the thickness of dielectrics cause void formation |
| 02/10/1998 | US5716872 Method of manufacturing multilayer interconnection structure having a dielectric film with improved flatness |
| 02/10/1998 | US5716869 Method of forming a wiring layer of a semiconductor device using reflow process |
| 02/10/1998 | US5716663 Multilayer printed circuit |
| 02/10/1998 | US5716552 Paste; reducing leaching and solder diffusion; accuracy; bonding strength |
| 02/10/1998 | US5716218 Process for manufacturing an interconnect for testing a semiconductor die |
| 02/10/1998 | US5715872 Process and device for the shaping of leads of integrated circuits |
| 02/10/1998 | US5715595 Method of forming a pinned module |
| 02/10/1998 | US5715593 Method of making plastic-packaged semiconductor integrated circuit |
| 02/10/1998 | CA2119325C Molded plastic packaging of electronic devices |
| 02/05/1998 | WO1998005068A1 Method of manufacturing and transferring metallic droplets |
| 02/05/1998 | WO1998005067A1 Electronic packages containing microsphere spacers |