Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1998
03/05/1998DE19732837A1 Copper@ based alloy for electronic circuits
03/05/1998DE19714687A1 Semiconductor component with conductive film on semiconductor substrate
03/05/1998DE19700672A1 Semiconductor component with substrate with two main surfaces
03/05/1998DE19652254C1 Marking device for identifying integrated electronic component connections
03/05/1998DE19635732A1 Carrier substrate for semiconductor chip of e.g. chip card
03/05/1998DE19635468A1 Element cooler with basic profile coupled to cooling fins
03/05/1998DE19634498A1 Elektro-keramisches Bauelement und Verfahren zu seiner Herstellung Electro-ceramic device and process for its preparation
03/05/1998CA2264129A1 Electroceramic component and method for its manufacture
03/04/1998EP0827252A2 Non-breakdown triggered electrostatic discharge protection circuit for an integrated circuit and method therefor
03/04/1998EP0827207A2 Gate array LSI
03/04/1998EP0827203A2 Clock skew minimisation system and method for integrated circuits
03/04/1998EP0827200A1 Arrangement for shielding a microelectronic circuit of an integrated circuit
03/04/1998EP0827199A2 A semiconductor device with a passivation film
03/04/1998EP0827198A2 Metal ceramic substrates for semiconductors of high reliability
03/04/1998EP0827196A2 Laser ablation improvement for energy coupling to a film stack
03/04/1998EP0827195A1 Improvements in or relating to semiconductor devices
03/04/1998EP0827190A2 Bump structure and methods for forming this structure
03/04/1998EP0827159A2 Epoxy resin composition and semiconductor device encupsulated therewith
03/04/1998EP0826240A1 A heatsink and a method and an assembly for forming the same
03/04/1998EP0826239A1 A heatsink and a method and an assembly for forming the same
03/04/1998EP0826238A2 Semiconductor body with a substrate glued to a support body
03/04/1998EP0826165A1 Alignment device and lithographic apparatus provided with such a device
03/04/1998EP0826152A1 Method and apparatus for testing semiconductor dice
03/04/1998CN1175307A Top load socket for ball grid array devices
03/04/1998CN1175093A Semiconductor device and making method
03/04/1998CN1175090A 半导体器件 Semiconductor devices
03/03/1998US5724502 Test mode matrix circuit for an embedded microprocessor core
03/03/1998US5724376 Transparent substrate vertical cavity surface emitting lasers fabricated by semiconductor wafer bonding
03/03/1998US5724233 Semiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packag
03/03/1998US5724232 Chip carrier having an organic photopatternable material and a metal substrate
03/03/1998US5724230 Flexible laminate module including spacers embedded in an adhesive
03/03/1998US5724229 Electromechanical assembly having a lid which protects IC chips and holds contact springs
03/03/1998US5724228 CPU heat dissipator
03/03/1998US5724219 Electrostatic protection circuit comprising plurality of protective elements
03/03/1998US5723910 Semiconductor device having a MOS structure
03/03/1998US5723909 Semiconductor device and associated fabrication method
03/03/1998US5723908 Multilayer wiring structure
03/03/1998US5723907 Loc simm
03/03/1998US5723906 High-density wirebond chip interconnect for multi-chip modules
03/03/1998US5723905 Semiconductor package with low strain seal
03/03/1998US5723904 Packaged semiconductor device suitable to be mounted and connected to microstrip line structure board
03/03/1998US5723903 Thin type semiconductor device, module structure using the device and method of mounting the device on board
03/03/1998US5723902 Surface mounting type electronic component
03/03/1998US5723901 Stacked semiconductor device having peripheral through holes
03/03/1998US5723900 Resin mold type semiconductor device
03/03/1998US5723899 Semiconductor lead frame having connection bar and guide rings
03/03/1998US5723898 Array protection devices and method
03/03/1998US5723893 Method for fabricating double silicide gate electrode structures on CMOS-field effect transistors
03/03/1998US5723875 Chip damage detecting circuit for semiconductor IC
03/03/1998US5723874 For characterizing the dishing occurring in a planarization process
03/03/1998US5723822 Integrated circuit structure
03/03/1998US5723535 Pastes for the coating of substrates, methods for manufacturing them and their use
03/03/1998US5723386 Method of manufacturing a semiconductor device capable of rapidly forming minute wirings without etching of the minute wirings
03/03/1998US5723385 Wafer edge seal ring structure
03/03/1998US5723380 Method of approach to improve metal lithography and via-plug integration
03/03/1998US5723374 Method for forming dielectric spacer to prevent poly stringer in stacked capacitor DRAM technology
03/03/1998US5723369 Method of flip chip assembly
03/03/1998US5723368 Fluorination
03/03/1998US5723364 Method for wire-bonding a covered wire
03/03/1998US5723358 Method of manufacturing amorphous silicon antifuse structures
03/03/1998US5723171 Integrated circuit electrode structure and process for fabricating same
03/03/1998US5723073 Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same
03/03/1998US5722162 Fabrication procedure for a stable post
03/03/1998US5722161 Method of making a packaged semiconductor die including heat sink with locking feature
03/03/1998US5722159 Method for retention of a fragile conductive trace with a protective clamp
02/1998
02/26/1998WO1998008256A1 Silicon nitride circuit board and semiconductor module
02/26/1998WO1998008251A1 Semiconductor and method for manufacturing the same
02/26/1998WO1998008250A1 Improved integrated circuit structures and methods to facilitate accurate measurement of the ic devices
02/26/1998WO1998008234A1 Emi preventive part and active device with the same
02/26/1998WO1998008154A1 Semiconductor circuit secure against outside accesses
02/26/1998WO1997040532A3 Molded flex circuit ball grid array and method of making
02/26/1998DE19735990A1 CVD of thin stable zirconium nitride film
02/26/1998DE19729602A1 Short circuit prevention semiconductor component, e.g. for DRAM
02/26/1998DE19711716A1 Millimetre waveband arrangement for signal attenuation
02/26/1998DE19634845C1 Verfahren zur Optimierung der Adhäsion zwischen Preßmasse und Passivierungsschicht in einem Kunststoffchipgehäuse A method of optimizing the adhesion between the molding compound and passivation layer in a plastic chip package
02/26/1998DE19634135A1 Halbleiterschaltung, insbesondere zur Verwendung in einem integrierten Baustein Semiconductor circuit, in particular for use in an integrated module
02/26/1998DE19633449A1 Spatial grid structure of functional elements for communications MHz and GHz range signals
02/25/1998EP0825653A2 Optoelectronic device package
02/25/1998EP0825649A2 Method of protecting during transportation or packaging the lead pins and guide pins of semiconductor devices
02/25/1998EP0825648A2 Electronic component package with decoupling capacitors completely within die receiving cavity of substrate
02/25/1998EP0825647A2 Chip size package
02/25/1998EP0825646A2 Semiconductor device and method of manufacturing the same
02/25/1998EP0825641A1 Method of manufacturing a transistor with self aligned contacts
02/25/1998EP0792573A4 Compliant thermal connectors, methods and assemblies
02/25/1998EP0771519A4 Integrally bumped electronic package components
02/25/1998EP0674814A4 Method of forming interface between die and chip carrier.
02/25/1998CN2275284Y Fixing structure for power crystal radiator
02/25/1998CN1174410A 半导体器件 Semiconductor devices
02/25/1998CN1174409A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/25/1998CN1174408A Method of forming semiconductor metallization system and structure therefor
02/25/1998CN1174403A Chip-Size semiconductor package and fabrication method thereof
02/24/1998US5722033 Mixing dry powder of boron carbide and aluminum alloy matrix to form homogenous mixture, compacting into solid ingot, melting the ingots, stirring to remove slag, impelling melt, flowing dry argon, removing froth, cooling to form cast
02/24/1998US5721741 Memory test system
02/24/1998US5721455 Semiconductor device having a thermal resistance detector in the heat radiating path
02/24/1998US5721454 Integrated circuit package with a plurality of vias that are electrically connected to an internal ground plane and thermally connected to an external heat slug
02/24/1998US5721453 Integrated circuit package
02/24/1998US5721450 Moisture relief for chip carriers
02/24/1998US5721299 Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof
02/24/1998US5721292 Acylphosphine oxides
02/24/1998US5721157 Method for manufacturing a semiconductor device having interconnection layers
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