Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1998
03/17/1998US5728972 Multiple chip module for packaging integrated circuits
03/17/1998US5728763 Thermosetting resin composition for semiconductor devices
03/17/1998US5728635 Aluminum nitride sintered bodies
03/17/1998US5728630 Method of making a semiconductor device
03/17/1998US5728628 Two-step metal etch process for selective gap fill of submicron inter-connects and structure for same
03/17/1998US5728626 Spin-on conductor process for integrated circuits
03/17/1998US5728606 Electronic Package
03/17/1998US5728601 Process for manufacturing a single in-line package for surface mounting
03/17/1998US5728599 Printable superconductive leadframes for semiconductor device assembly
03/17/1998US5728596 Method for forming a semiconductor buried contact with a removable spacer
03/17/1998US5728453 Method of fabricating topside structure of a semiconductor device
03/17/1998US5728285 Protective coating combination for lead frames
03/17/1998US5728248 Method for making a multi-tier laminate substrate with internal heat spreader
03/17/1998US5727955 Socket for electronic components and electronic component with socket for connection
03/17/1998US5727727 Flowing solder in a gap
03/17/1998US5727624 CPU heat dissipating device with airguiding units
03/17/1998US5727622 For dissipating heat generated by electric/electronic components
03/17/1998US5727619 Honeycomb sandwich panel with built in heat pipes
03/17/1998US5727618 Modular microchannel heat exchanger
03/12/1998WO1998010632A1 Highly heat-conductive composite magnetic material
03/12/1998WO1998010631A1 Adjustable-pressure mount heatsink system
03/12/1998WO1998010630A1 An integrated circuit package
03/12/1998WO1998010628A1 Carrier element(1) for a semi-conductor chip
03/12/1998WO1998010627A1 Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components
03/12/1998WO1998010625A1 An integrated circuit package
03/12/1998WO1998010466A1 An integrated circuit package
03/12/1998WO1998010105A1 Copper alloy for electronic devices
03/12/1998WO1997043656A3 Wafer-level burn-in and test
03/12/1998DE19738118A1 Semiconductor device mounting on circuit board
03/12/1998DE19736896A1 Gehäuse für Halbleiterbauteile Enclosure for semiconductor devices
03/12/1998DE19736139A1 Circuit board carrying plastic-encapsulated semiconductor chip and conductive tracks
03/12/1998DE19724472A1 Wiring layout for semiconductor component, e.g. bit-line of DRAM
03/12/1998DE19723085A1 Hochleistungskupferwärmesenke mit großem Seitenverhältnis zur Luftkühlung High performance copper heat sink with a large aspect ratio for air cooling
03/12/1998DE19721448A1 Semiconductor module, e.g. MMIC gallium arsenide integrated circuit
03/12/1998DE19719179A1 Semiconductor module, e.g. LSI circuit, with air bridge wiring
03/12/1998DE19715001A1 Cooler apparatus for e.g. semiconductor assembly module of personal computer
03/12/1998DE19710688A1 Conductive plug manufacture
03/12/1998DE19645636C1 Power module for operating electric motor with speed and power control
03/12/1998DE19636756A1 Multilayer technology inductance components mfr
03/12/1998DE19636112A1 Carrier element for semiconductor chip
03/11/1998EP0828346A2 Lid wafer bond packaging and micromachining
03/11/1998EP0828341A2 Modular type power semiconductor apparatus
03/11/1998EP0828293A1 Reflow soldering method for surface mounted semiconductor device
03/11/1998EP0828291A2 Fine pitch via formation using diffusion patterning techniques
03/11/1998EP0828288A2 Energy relieving crack stop
03/11/1998EP0827993A2 Electrical components and method for the fabrication thereof
03/11/1998EP0827633A1 Semiconductor assembly
03/11/1998EP0827632A1 Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
03/11/1998CN2276200Y Fully spotlight high efficiency luminous diode
03/11/1998CN1175805A Clock skew minimization system and method for integrated circuits
03/11/1998CN1175795A Non-breakdown triggered electrostatic discharge protection circuit for integrated circuit and method therefor
03/11/1998CN1175794A Semiconductor device packaged in plastic package and metal mold employable for production thereof
03/10/1998US5726904 Power bus having power slits embodied therein and method for making the same
03/10/1998US5726860 Electronic package
03/10/1998US5726580 Universal wafer carrier for wafer level die burn-in
03/10/1998US5726502 Bumped semiconductor device with alignment features and method for making the same
03/10/1998US5726499 Semiconductor device having a minute contact hole
03/10/1998US5726498 Wire shape conferring reduced crosstalk and formation methods
03/10/1998US5726497 Upward plug filled via hole device
03/10/1998US5726495 Heat sink having good heat dissipating characteristics
03/10/1998US5726494 Semiconductor device having a plated heat sink
03/10/1998US5726493 Semiconductor device and semiconductor device unit having ball-grid-array type package structure
03/10/1998US5726491 Tape carrier package
03/10/1998US5726490 Semiconductor device
03/10/1998US5726489 Film carrier semiconductor device
03/10/1998US5726485 Capacitor for a semiconductor device
03/10/1998US5726484 Multilayer amorphous silicon antifuse
03/10/1998US5726483 Method of jointly forming stacked capacitors and antifuses, method of blowing antifuses, and antifuses and stacked capacitors constituting a part of integrated circuitry
03/10/1998US5726482 Device-under-test card for a burn-in board
03/10/1998US5726479 Semiconductor device having polysilicon electrode minimization resulting in a small resistance value
03/10/1998US5726472 Semiconductor device
03/10/1998US5726471 Programmable non-volatile memory cell and method of forming a programmable non-volatile memory cell
03/10/1998US5726468 Compound semiconductor bipolar transistor
03/10/1998US5726466 Press pack power semiconductor device incorporating a plurality of semiconductor elements
03/10/1998US5726461 Active matrix substrate and switching element
03/10/1998US5726458 Hot carrier injection test structure and technique for statistical evaluation
03/10/1998US5726391 Furan polymer
03/10/1998US5726257 Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith
03/10/1998US5726098 Method of manufacturing semiconductor device having multilevel interconnection
03/10/1998US5726097 Method of forming multilevel interconnections using high density plasma metal clean
03/10/1998US5726079 Thermally enhanced flip chip package and method of forming
03/10/1998US5726074 Method and apparatus for manufacturing semiconductor device
03/10/1998US5725948 Polyimide from a bismaleimide and a diamine
03/10/1998US5725819 Injection molding method for board for IC card
03/10/1998US5725808 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board
03/10/1998US5725740 Eliminating free exposed titanium from an edge of a substrate having sequentially sputtered layers of titanium and titanium nitride thereon
03/10/1998US5725050 For transferring heat between a surface and a heat pipe
03/10/1998US5724818 Thermoelectric cooling module and method for manufacturing the same
03/10/1998US5724729 Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials
03/10/1998US5724728 Method of mounting an integrated circuit to a mounting surface
03/10/1998US5724726 Method of making leadframe for lead-on-chip (LOC) semiconductor device
03/05/1998WO1998009332A1 Semiconductor device provided with low melting point metal bumps and process for producing same
03/05/1998WO1998009331A1 Heat sink assembly and method of transferring heat
03/05/1998WO1998009330A1 Process for optimizing the adhesion between moldable material and a passivation layer
03/05/1998WO1998009329A1 Resin-sealed semiconductor device and method of manufacturing the same
03/05/1998WO1998009328A1 Method of partially plating electronic component board
03/05/1998WO1998009324A1 A glass/metal package and method for producing the same
03/05/1998WO1998009299A1 Electroceramic component and method for its manufacture
03/05/1998WO1998009129A1 Spray-cooling an electronic component
03/05/1998WO1998008672A1 Metal ceramic composites with improved interfacial properties
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