Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1998
03/26/1998WO1998012747A1 Integrated circuit with housing accommodating the latter
03/26/1998WO1998012746A1 Semiconductor component and its production method
03/26/1998WO1998012745A1 Power connection for power semiconductor component
03/26/1998WO1998012744A1 Passive electronic parts, ic parts, and wafer
03/26/1998WO1998012743A1 Electronic control module having fluid-tight seals
03/26/1998WO1998012706A1 Device and method for testing integrated circuit dice in an integrated circuit module
03/26/1998WO1998012597A1 Liquid crystal display device, production method thereof and mobile telephone
03/26/1998WO1998012568A1 Process for producing semiconductor device and semiconductor device
03/26/1998DE19702532A1 Embedded integrated circuit chip smart card, e.g. for bank, identification card
03/26/1998DE19638175A1 Integrierte Schaltung mit einem diese in sich aufnehmenden Gehäuse An integrated circuit comprising a housing accommodating the latter within itself
03/26/1998DE19638090A1 Stromanschluß für Leistungshalbleiterbauelement Power supply for power semiconductor component
03/25/1998EP0831591A1 Oscillator
03/25/1998EP0831564A2 Fabrication method of plasticmolded lead component
03/25/1998EP0831534A2 Semiconductor device with a passivation layer
03/25/1998EP0831530A2 Integrated dielectric substrate
03/25/1998EP0831529A2 Semiconductor device and method of manufacturing the same
03/25/1998EP0831528A2 Multilayer wiring board for mounting semiconductor device and method of producing the same
03/25/1998EP0831417A2 Chipcards contacting device
03/25/1998EP0793903B1 Coating for the structured production of conductors on the surface of electrically insulating substrates
03/25/1998CN1177210A Leadframe structure
03/25/1998CN1177209A Electronic component assembly and method of assembling
03/25/1998CN1177206A Semiconductor device and mounting method therefor
03/25/1998CN1177205A Method of forming interlayer insulating film of semiconductor device
03/25/1998CN1177203A Method for fabricating metal wire of semiconductor device
03/25/1998CN1177202A Method of forming plug in semiconductor device
03/24/1998US5732037 Semiconductor memory
03/24/1998US5731970 Power conversion device and semiconductor module suitable for use in the device
03/24/1998US5731962 Semiconductor device free from short-circuit due to resin pressure in mold
03/24/1998US5731955 Spring clip for electronics assembly
03/24/1998US5731945 Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes
03/24/1998US5731747 Electronic component having a thin-film structure with passive elements
03/24/1998US5731636 Semiconductor bonding package
03/24/1998US5731635 Semiconductor device having a carrier and a multilayer metallization
03/24/1998US5731634 Semiconductor device having a metal film formed in a groove in an insulating film
03/24/1998US5731633 Thin multichip module
03/24/1998US5731632 Semiconductor device having a plastic package
03/24/1998US5731631 Semiconductor device with tape automated bonding element
03/24/1998US5731630 Tape carrier for increasing the number of terminals between the tape carrier and a substrate
03/24/1998US5731628 Semiconductor device having element with high breakdown voltage
03/24/1998US5731624 Integrated pad and fuse structure for planar copper metallurgy
03/24/1998US5731620 Semiconductor device with reduced parasitic substrate capacitance
03/24/1998US5731614 Electrostatic protective device having elongate gate electrodes in a ladder structure
03/24/1998US5731610 Semiconductor device having improved contacts to a thin conductive layer
03/24/1998US5731547 Circuitized substrate with material containment means and method of making same
03/24/1998US5731542 Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
03/24/1998US5731370 Semiconductor encapsulating epoxy resin compositions with 2-phenyl-4,5-dihydroxymethylimidazole curing accelerator
03/24/1998US5731245 High aspect ratio low resistivity lines/vias with a tungsten-germanium alloy hard cap
03/24/1998US5731244 Laser wire bonding for wire embedded dielectrics to integrated circuits
03/24/1998US5731243 Method of cleaning residue on a semiconductor wafer bonding pad
03/24/1998US5731242 Self-aligned contact process in semiconductor fabrication
03/24/1998US5731231 Semiconductor apparatus, fabrication method therefor and board frame
03/24/1998US5731227 Chip on board package with top and bottom terminals
03/24/1998US5731225 Tungsten plug
03/24/1998US5731223 Array of solder pads on an integrated circuit
03/24/1998US5731222 Externally connected thin electronic circuit having recessed bonding pads
03/24/1998US5731073 Reusable, selectively conductive, Z-axis, elastomeric composite substrate
03/24/1998US5731067 Multi-layered substrate
03/24/1998US5731066 Electronic circuit device
03/24/1998US5730835 Sputtering from conductive layer
03/24/1998US5730792 Methylsilane triol condensate
03/24/1998US5730616 IC Socket
03/24/1998US5730217 Vacuum insulated converter for extending the life span of electronic components
03/24/1998US5730210 Heat sink having an assembling device
03/24/1998US5729995 Electronic component cooling unit
03/24/1998US5729896 Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder
03/24/1998US5729894 Method of assembling ball bump grid array semiconductor packages
03/24/1998US5729893 Process for producing a multilayer ceramic circuit substrate
03/19/1998WO1998011606A1 Adaptable mmic array
03/19/1998WO1998011605A1 Circuit board for mounting electronic parts
03/19/1998WO1998011445A1 Probe structure having a plurality of discrete insulated probe tips
03/19/1998DE19739994A1 Verfahren zur Bearbeitung eines Werkstückes A method for machining a workpiece
03/18/1998EP0829502A2 Photosensitive reworkable encapsulant
03/18/1998EP0829455A2 Inorganic filler, epoxy resin composition, and semiconductor device
03/18/1998EP0829187A2 Chip socket assembly and chip file assembly for semiconductor chips
03/18/1998EP0829098A2 Hermetically sealed microwave integrated circuit package with ground plane fused to package frame
03/18/1998EP0829097A1 Method of transfer molding electronic packages and packages produced thereby
03/18/1998EP0828774A1 Epoxy resin moulding materials fire-proofed without halogens
03/18/1998EP0828688A1 Aluminium nitride granules
03/18/1998EP0828582A1 Ribbon-like core interconnection elements
03/18/1998CN1176571A Multilayer metallized printing plate and its forming module
03/18/1998CN1176505A Self-aligning low profile socket for connecting ball grid array devices through dendritic interposer
03/18/1998CN1176492A Chip-size semiconductor package and fabrication method thereof
03/18/1998CN1176491A Semi-conductor element of non-resistance characteristic material for realizing electrostatic discharge protection
03/18/1998CN1176489A Lead-on-chip semiconductor device package having adhesive layer formed from liquid adhesive and method for manufacturing the same
03/18/1998CN1176276A Inorganic filler, epoxy resin composition, and semiconductor device
03/18/1998CN1176239A Large ceramic article and method of manufacturing
03/17/1998US5729561 Semiconductor laser device
03/17/1998US5729437 Electronic part including a thin body of molding resin
03/17/1998US5729435 Semiconductor device and assembly board having through-holes filled with filling core
03/17/1998US5729433 Assembly for mounting electronic components
03/17/1998US5729432 Ball grid array semiconductor package with improved heat dissipation and dehumidification effect
03/17/1998US5729053 Apparatus and method for flat circuit assembly
03/17/1998US5729052 Integrated ULSI heatsink
03/17/1998US5729051 Tape automated bonding type semiconductor device
03/17/1998US5729050 Semiconductor package substrate and ball grid array (BGA) semiconductor package using same
03/17/1998US5729049 Tape under frame for conventional-type IC package assembly
03/17/1998US5729048 Cmos ic device suppressing spike noise
03/17/1998US5729047 Method and structure for providing signal isolation and decoupling in an integrated circuit device
03/17/1998US5729042 Raised fuse structure for laser repair
03/17/1998US5729041 Protective film for fuse window passivation for semiconductor integrated circuit applications
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