Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/03/2013US20130258792 Semiconductor device having compensation capacitor to stabilize power supply voltage
10/03/2013US20130258603 Semiconductor switch insulation protection device and power supply assembly
10/03/2013US20130258265 Array substrate structure and display panel and manufacturing method thereof
10/03/2013US20130257544 Wireless communication system
10/03/2013US20130257489 Apparatuses including scalable drivers and methods
10/03/2013US20130257462 Package structure with conformal shielding and inspection method using the same
10/03/2013US20130257329 Junction temperature measurement of a power mosfet
10/03/2013US20130256923 Semiconductor Device and Method of Forming Reconstituted Wafer With Larger Carrier to Achieve More EWLB Packages Per Wafer with Encapsulant Deposited Under Temperature and Pressure
10/03/2013US20130256922 Method for Fabricating a Semiconductor Device
10/03/2013US20130256921 Deformable Network Structure
10/03/2013US20130256920 Semiconductor device
10/03/2013US20130256917 Semiconductor packages
10/03/2013US20130256916 Semiconductor packages and methods of manufacturing semiconductor packages
10/03/2013US20130256913 Die stacking with coupled electrical interconnects to align proximity interconnects
10/03/2013US20130256912 Chip arrangement and a method for forming a chip arrangement
10/03/2013US20130256911 Semiconductor chip stack package and manufacturing method thereof
10/03/2013US20130256910 3d interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias
10/03/2013US20130256907 Bonded processed semiconductor structures and carriers
10/03/2013US20130256906 Semiconductor device and manufacturing method for the same
10/03/2013US20130256905 Monolithic Power Converter Package with Through Substrate Vias
10/03/2013US20130256904 Semiconductor device and method for manufacturing the same
10/03/2013US20130256903 Interconnect structure and method for forming the same
10/03/2013US20130256902 Interconnect structure having smaller transition layer via
10/03/2013US20130256901 Methods for fabricating integrated circuits having substrate contacts and integrated circuits having substrate contacts
10/03/2013US20130256900 Ultrathin buried die module and method of manufacturing thereof
10/03/2013US20130256899 Methods and apparatuses to form self-aligned caps
10/03/2013US20130256898 Optimizing Layout of Irregular Structures in Regular Layout Context
10/03/2013US20130256897 Substrate and semiconductor device
10/03/2013US20130256896 Vertical mount package and wafer level packaging therefor
10/03/2013US20130256895 Stacked semiconductor components with universal interconnect footprint
10/03/2013US20130256894 Porous Metallic Film as Die Attach and Interconnect
10/03/2013US20130256893 Bonding pad structure with dense via array
10/03/2013US20130256892 Display device and manufacturing method thereof
10/03/2013US20130256891 Semiconductor device with a copper line and method for manufacturing the same
10/03/2013US20130256890 Shallow via formation by oxidation
10/03/2013US20130256889 Substrate and semiconductor device
10/03/2013US20130256888 Interconnect structure and method for forming the same
10/03/2013US20130256887 Stacked semiconductor package and method for manufacturing the same
10/03/2013US20130256886 Semiconductor device
10/03/2013US20130256885 Copper Sphere Array Package
10/03/2013US20130256884 Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level package
10/03/2013US20130256883 Rotated semiconductor device fan-out wafer level packages and methods of manufacturing rotated semiconductor device fan-out wafer level packages
10/03/2013US20130256882 Method for manufacturing fine-pitch bumps and structure thereof
10/03/2013US20130256881 Semiconductor Device
10/03/2013US20130256880 Electrode body, wiring substrate, and semiconductor device
10/03/2013US20130256879 Wiring substrate and method of manufacturing the same, and semiconductor device and method of manufacturing the same
10/03/2013US20130256878 Semiconductor package
10/03/2013US20130256877 Semiconductor package
10/03/2013US20130256876 Semiconductor package
10/03/2013US20130256875 Semiconductor package, package structure and fabrication method thereof
10/03/2013US20130256874 Elongated Bumps in Integrated Circuit Devices
10/03/2013US20130256873 System, method, and computer program product for preparing a substrate post
10/03/2013US20130256872 Thermal management of stacked semiconductor chips with electrically non-functional interconnects
10/03/2013US20130256871 Semiconductor chip device with fragmented solder structure pads
10/03/2013US20130256870 Packaging device and method of making the same
10/03/2013US20130256869 Chip package and manufacturing method thereof
10/03/2013US20130256868 Thermal interface material for semiconductor chip and method for forming the same
10/03/2013US20130256867 Semiconductor device
10/03/2013US20130256866 Semiconductor Device and Method of Forming Prefabricated Heat Spreader Frame with Embedded Semiconductor Die
10/03/2013US20130256865 Semiconductor module
10/03/2013US20130256864 Semiconductor package and method of manufacturing the same
10/03/2013US20130256863 Epoxy resin composition for semiconductor encapsulation and semiconductor device
10/03/2013US20130256862 Support Device for a Semiconductor Chip and Optoelectronic Component with a Carrier Device and Electronic Component with a Carrier Device
10/03/2013US20130256861 Integrated circuit packaging system with routable circuitry and method of manufacture thereof
10/03/2013US20130256860 Semiconductor device and a manufacturing method thereof
10/03/2013US20130256859 Dual Power Converter Package Using External Driver IC
10/03/2013US20130256858 PCB Based RF-Power Package Window Frame
10/03/2013US20130256857 Semiconductor Packages and Methods of Formation Thereof
10/03/2013US20130256856 Multichip Power Semiconductor Device
10/03/2013US20130256855 Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package
10/03/2013US20130256854 Lead frame, semiconductor device, and method for manufacturing lead frame
10/03/2013US20130256853 Stacked packaged integrated circuit devices, and methods of making same
10/03/2013US20130256852 Stacked Semiconductor Package
10/03/2013US20130256851 Method for manufacturing semiconductor device using mold having resin dam and semiconductor device
10/03/2013US20130256850 Electronic package for millimeter wave semiconductor dies
10/03/2013US20130256849 High frequency transition matching in an electronic package for millimeter wave semiconductor dies
10/03/2013US20130256848 Electronic component module and method of manufacturing the same
10/03/2013US20130256847 Semiconductor devices including electromagnetic interference shield
10/03/2013US20130256842 Semiconductor device packaging structure and packaging method
10/03/2013US20130256841 Via plugs
10/03/2013US20130256840 Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue
10/03/2013US20130256839 Semiconductor wafer and semiconductor device
10/03/2013US20130256830 Semiconductor-on-oxide structure and method of forming
10/03/2013US20130256813 Semiconductor device and method of manufacturing the same
10/03/2013US20130256811 Electrically Conductive Lines And Integrated Circuitry Comprising A Line Of Recessed Access Devices
10/03/2013US20130256807 Integrated Dual Power Converter Package Having Internal Driver IC
10/03/2013US20130256773 Electrically erasable programmable non-volatile memory
10/03/2013US20130256767 Source/drain contacts for non-planar transistors
10/03/2013US20130256733 Metallic frame structure and led device having the same
10/03/2013US20130256680 Vertical Semiconductor Device and Manufacturing Method Thereof
10/03/2013US20130256659 Reduction of ocd measurement noise by way of metal via slots
10/03/2013US20130256246 Racking system for supporting a plurality of solar panels
10/03/2013US20130255534 Method of Preparing Liquid Chemical for Forming Protective Film
10/02/2013EP2645827A1 Joining sheet, electronic component, and producing method thereof
10/02/2013EP2645416A1 Stacked module
10/02/2013EP2645415A2 Lead frame, semiconductor device, and method for manufacturing lead frame
10/02/2013EP2645414A2 Dual power converter package using external driver IC
10/02/2013EP2645413A2 Integrated dual power converter package having internal driver IC
10/02/2013EP2645412A1 Stacked cooler
10/02/2013EP2645411A2 Semiconductor device
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