Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/1998
04/07/1998US5736770 Semiconductor device with conductive connecting layer and abutting insulator section made of oxide of same material
04/07/1998US5736749 Semiconductor device
04/07/1998US5736607 Hermetically sealed dies and die attach materials
04/07/1998US5736461 Preventing oxidation by overcoating titanium nitride layer, heating to react with silicon substrate
04/07/1998US5736460 Forming insulation layer on semiconductor substrate, forming metal layer, forming photoresist, forming gold interconnectors, removing photoresist, removing metal layer, coating insulation layer over interconnectors
04/07/1998US5736456 Method of forming conductive bumps on die for flip chip applications
04/07/1998US5736448 Fabrication method for thin film capacitors
04/07/1998US5736434 Forming gate electrode, applying voltage between electrode and cathode, maintaining voltage, forming anodic oxide film, forming channel
04/07/1998US5736433 Double mask hermetic passivation method providing enhanced resistance to moisture
04/07/1998US5736432 Lead frame with lead finger locking feature and method for making same
04/07/1998US5736428 Process for manufacturing a semiconductor device having a stepped encapsulated package
04/07/1998US5736426 Process for arranging printed conductors on the surface of semiconductor components
04/07/1998US5736192 Embedded electroconductive layer and method for formation thereof
04/07/1998US5736074 Drops of two materials are merged in flight forming coating of lower melting temperature material on drop of higher melting temperature material; high density electronics
04/07/1998US5736002 Methods and equipment for anisotropic, patterned conversion of copper into selectively removable compounds and for removal of same
04/07/1998US5735452 Ball grid array by partitioned lamination process
04/07/1998US5735340 Heat sink with integral attachment mechanism
04/07/1998US5735332 Method for making a ceramic metal composite
04/07/1998US5735040 Method of making IC card
04/07/1998US5735030 In a microelectronic device
04/07/1998CA2081529C Electrical and electronic parts formed of polybutylene naphthalenedicarboxylate
04/02/1998WO1998013893A1 Device with circuit element and transmission line
04/02/1998WO1998013876A1 Hybrid microwave-frequency integrated circuit
04/02/1998WO1998013875A1 Hybrid microwave-frequency integrated circuit
04/02/1998WO1998013874A1 Hybrid high-power microwave-frequency integrated circuit
04/02/1998WO1998013873A1 Integrated emitter drain bypass capacitor for microwave/rf power device applications
04/02/1998WO1998013872A1 System for protecting semiconductor chips against analysis
04/02/1998WO1998013871A1 Array of solder pads on an integrated circuit
04/02/1998WO1998013870A1 Chip module and manufacturing process
04/02/1998WO1998013869A1 Integrated circuit with an inductive component
04/02/1998WO1998013868A1 Leadframe for a microelectronic component
04/02/1998WO1998013867A1 Connecting frame for a microelectronic component, manufacturing process and microelectronic component encompassing same
04/02/1998WO1998013866A1 Connecting frame of microelectronic component, manufacturing process, and the microelectronic component encompassing same
04/02/1998WO1998013862A1 Semiconductor device and production method thereof
04/02/1998WO1998013858A2 Lead finger immobilization apparatus
04/02/1998DE19743537A1 Halbleitergehäuse für Oberflächenmontage sowie Verfahren zu seiner Herstellung Semiconductor package for surface mounting as well as method for its preparation
04/02/1998DE19743013A1 Ceramic circuit substrate arrangement
04/02/1998DE19742120A1 Semiconductor component wiring for DRAM cell with capacitor over-under bit line
04/02/1998DE19640488A1 Ceramic cooler for power semiconductor component
04/02/1998DE19640304A1 Chipmodul insbesondere zur Implantation in einen Chipkartenkörper Chip module in particular for implantation in a chip card body
04/02/1998DE19640192A1 Verfahren zur Flip-Chip-Montage A method for flip-chip mounting
04/02/1998DE19640006A1 Production of directly printed circuit board-mounted, wire-bonded optical diodes with encapsulation
04/02/1998DE19639938A1 Hybrid integrated circuit with heat sink, for power IGBT
04/02/1998DE19639650A1 Integrierte Schaltung mit einem induktiven Bauelement und Verfahren zur Herstellung hierzu An integrated circuit comprising an inductive component and methods for making this,
04/02/1998DE19639646A1 Carrier element for semiconductor chip
04/02/1998DE19639438A1 Halbleiterkörper mit Lotmaterialschicht Semiconductor body having solder layer
04/02/1998DE19639183A1 Anschlußrahmen für ein mikroelektronisches Bauteil, Verfahren zu dessen Herstellung und den Anschlußrahmen umfassendes mikroelektronisches Bauteil Lead frame for a microelectronic component, a process for its preparation and the lead frame comprehensive microelectronic component
04/02/1998DE19639182A1 Anschlußrahmen für ein mikroelektronisches Bauteil, Verfahren zu dessen Herstellung und den Anschlußrahmen umfassendes mikroelektronisches Bauteil Lead frame for a microelectronic component, a process for its preparation and the lead frame comprehensive microelectronic component
04/02/1998DE19639181A1 Zuleitungsrahmen für ein mikroelektronisches Bauelement Lead frame for a microelectronic component
04/02/1998DE19639025A1 Chipmodul und Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module,
04/02/1998DE19638786A1 Halbleiter-Bauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
04/02/1998DE19638669A1 Packaging frame-mounted chip in plastic housing
04/02/1998DE19638668A1 Release method for lead-on-chip mounted semiconductor chips
04/02/1998DE19638667A1 Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement Mixing Colored light radiating semiconductor component having luminescence
04/02/1998DE19638496A1 Electronic surface wave component housing
04/02/1998DE19638371A1 One-side electroplating of chip module tape
04/01/1998EP0833551A1 Socket for connecting an integrated circuit to a printed wiring board
04/01/1998EP0833384A2 Semiconductor body having a solder layer
04/01/1998EP0833383A2 Power module circuit board and a process for the manufacture thereof
04/01/1998EP0833382A1 Plastic package for electronic devices
04/01/1998EP0833381A2 Method of forming electrical connections for a semiconductor
04/01/1998EP0833378A2 Polishing system
04/01/1998EP0832858A2 Sealing glass, and a method for manufacturing the same
04/01/1998EP0832546A1 Ground plane routing
04/01/1998EP0832499A1 Smart card chip coated with a layer of insulating material, and smart card comprising same
04/01/1998EP0832438A1 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
04/01/1998EP0723703A4 Edge connectable metal package
04/01/1998CN1177903A Printed circuit board fitted with electronic device
03/1998
03/31/1998US5734560 Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap
03/31/1998US5734559 Staggered bond finger design for fine pitch integrated circuit packages
03/31/1998US5734556 Integrated circuit package assembly
03/31/1998US5734554 Heat sink and fan for cooling CPU chip
03/31/1998US5734553 Fan/pins seat assembly for an intergrated circuit
03/31/1998US5734552 Airfoil deflector for cooling components
03/31/1998US5734201 Low profile semiconductor device with like-sized chip and mounting substrate
03/31/1998US5734200 Polycide bonding pad structure
03/31/1998US5734199 Semiconductor device having improved test electrodes
03/31/1998US5734198 Multi-layer lead frame for a semiconductor device
03/31/1998US5734197 Deformable leadframe for overcurrent protection
03/31/1998US5734196 Electronic packaging shaped beam lead fabrication
03/31/1998US5734193 Termal shunt stabilization of multiple part heterojunction bipolar transistors
03/31/1998US5734192 Semiconductor structure
03/31/1998US5734175 Insulated-gate semiconductor device having a position recognizing pattern directly on the gate contact area
03/31/1998US5734106 Integrated electronic sensor for characterizing physical quantities and process for producing such a sensor
03/31/1998US5733827 Method of fabricating semiconductor devices with a passivated surface
03/31/1998US5733814 Using bendable semiconductor wafer
03/31/1998US5733802 Semiconductor device and method of manufacturing the same
03/31/1998US5733801 Method of making a semiconductor device with alignment marks
03/31/1998US5733800 Underfill coating for LOC package
03/31/1998US5733798 Mask generation technique for producing an integrated circuit with optimal polysilicon interconnect layout for achieving global planarization
03/31/1998US5733797 Method of making a semiconductor device with moisture impervious film
03/31/1998US5733661 Metal oxide containing ions of an organic carboxylic acid salt and/or ions of an inorganic oxoacid salt
03/31/1998US5733640 Thin film wiring
03/31/1998US5733606 Polyfluorinated polyallylether-polymethylhydrogensiloxane polymer
03/31/1998US5733499 Thin, no defects, circuits, filtering slurry
03/31/1998US5733132 Socket for connecting an integrataed circuit to a printed wiring board
03/31/1998US5732465 Method of manufacturing one side resin sealing type semiconductor devices
03/26/1998WO1998012906A1 Cable repeater
03/26/1998WO1998012757A1 Sealing material with wavelength converting effect, application and production process
03/26/1998WO1998012751A1 High-frequency integrated circuit device and its manufacture
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