| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/15/1998 | EP0835287A1 Use of silicone-modified epoxy resins as sealing compound |
| 04/15/1998 | EP0835275A1 Improved poly(arylene ether) compositions and the method for their manufacture |
| 04/15/1998 | EP0835274A1 Hydroxy-substituted ethynylated biphenyls |
| 04/15/1998 | EP0682812A4 Thermally conductive integrated circuit package with radio frequency shielding. |
| 04/15/1998 | CN2278998Y Heat pipe radiator for 2 in thyristor |
| 04/15/1998 | CN1179028A Power source change-over device |
| 04/15/1998 | CN1179013A Semiconductor device and method for producing semiconductor device |
| 04/15/1998 | CN1179012A Semiconductor device and its producing method |
| 04/15/1998 | CN1179011A Package of semiconductor device |
| 04/15/1998 | CN1179010A Package of semiconductor device with grooved intraconnection |
| 04/15/1998 | CN1179009A Semiconductor packaging and its socket |
| 04/14/1998 | US5740017 Engagement assembly for connecting a heat dissipation device to an integrated circuits |
| 04/14/1998 | US5740014 CPU heat sink |
| 04/14/1998 | US5740013 Electronic device enclosure having electromagnetic energy containment and heat removal characteristics |
| 04/14/1998 | US5740010 Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors |
| 04/14/1998 | US5739877 Enhanced throughput and yield |
| 04/14/1998 | US5739591 Semiconductor device with a carrier body on which a substrate with a semiconductor element is fastened by means of a glue layer and on which a pattern of conductor tracks is fastened |
| 04/14/1998 | US5739589 Semiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the same |
| 04/14/1998 | US5739588 Semiconductor device |
| 04/14/1998 | US5739587 Semiconductor device having a multi-latered wiring structure |
| 04/14/1998 | US5739586 Heat sink assembly including a printed wiring board and a metal case |
| 04/14/1998 | US5739585 Single piece package for semiconductor die |
| 04/14/1998 | US5739584 Multiple pin die package |
| 04/14/1998 | US5739582 Method of packaging a high voltage device array in a multi-chip module |
| 04/14/1998 | US5739579 Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections |
| 04/14/1998 | US5739573 Semiconductor device with improved salicide structure and a method of manufacturing the same |
| 04/14/1998 | US5739560 High frequency masterslice monolithic integrated circuit |
| 04/14/1998 | US5739556 Pressure contact housing for semiconductor components |
| 04/14/1998 | US5739546 Semiconductor wafer |
| 04/14/1998 | US5739217 Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone |
| 04/14/1998 | US5739187 Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith |
| 04/14/1998 | US5739186 Curable mixture of a bisphenol f diglycidyl ether and an epoxidized novolak or a bisphenol diglycidyl ether type of compound; low viscosity; heat and stress resistance; low moisture absorption; noncracking soldering |
| 04/14/1998 | US5739068 Semiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric material |
| 04/14/1998 | US5739055 Method for preparing a substrate for a semiconductor package |
| 04/14/1998 | US5739045 Semiconductor device with increased on chip decoupling capacitance |
| 04/14/1998 | US5738936 Matrix, thermoconductve particles, expanded hollow polymeric particles and an elastomer interpenetrating matrix; compressible |
| 04/14/1998 | US5738931 Electronic device and magnetic device |
| 04/14/1998 | US5738928 Tape automated bonding tape comprising metal plate support, conductor pattern, insulating adhesive layer; nondeforming |
| 04/14/1998 | US5738531 Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer |
| 04/14/1998 | US5738528 IC carrier |
| 04/14/1998 | US5738269 Method for forming a solder bump |
| 04/14/1998 | US5737833 Selective forming electroconductive metal bumps by photolithography |
| 04/14/1998 | CA2010662C Lensless multifiber output coupler |
| 04/14/1998 | CA1339817C Curing and passivation of spin-on-glasses by a plasma process, and product produced thereby |
| 04/09/1998 | WO1998015065A1 Slotline-mounted flip chip structures |
| 04/09/1998 | WO1998015064A1 Slotline-mounted flip chip |
| 04/09/1998 | WO1998015004A1 Chip module especially for implantation in chip card body |
| 04/09/1998 | WO1998014998A1 Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication |
| 04/09/1998 | WO1998014997A1 Method and apparatus useful for the preparation of lead-on-chip assemblies |
| 04/09/1998 | WO1998014995A1 Flip chip assembly method |
| 04/09/1998 | WO1998014826A1 Method for switching optical signals and a thermo-optical switch |
| 04/09/1998 | DE4345305C2 Semiconductor device with lead-on-chip-structure |
| 04/09/1998 | DE19743737A1 Thick layer circuit board, e.g. for IC ignition, motor control |
| 04/09/1998 | DE19728617A1 Semiconductor component with chip fastened or bond island |
| 04/09/1998 | DE19701165C1 Chip card module |
| 04/09/1998 | DE19640959A1 Multilayer circuit or sensor substrate of glass-ceramic |
| 04/09/1998 | CA2267387A1 Method for switching optical signals and a thermo-optical switch |
| 04/08/1998 | EP0835047A2 RF-driven semiconductor device |
| 04/08/1998 | EP0834924A2 SRAM memory structure and manufacturing method thereof |
| 04/08/1998 | EP0834922A2 Improved multi-layer packaging |
| 04/08/1998 | EP0834921A2 Multi-layer circuit construction method and structures with customization features and components for use therein |
| 04/08/1998 | EP0834920A1 Improvements in or relating to semiconductor device metallization and interconnects |
| 04/08/1998 | EP0834919A2 Semiconductor element having a bump electrode |
| 04/08/1998 | EP0834918A1 Multilayer tamperproof electronic coating |
| 04/08/1998 | EP0834917A1 Film carrier and semiconductor device using the same |
| 04/08/1998 | EP0834916A2 Method for manufacturing a semiconductor structure comprising regions formed with low dielectric constant material |
| 04/08/1998 | EP0834915A1 Fabrication method of multi-layered wiring |
| 04/08/1998 | EP0834914A2 Electronic coatings |
| 04/08/1998 | EP0834911A2 Opaque ceramic coatings |
| 04/08/1998 | EP0834886A1 A reusable, selectively conductive, Z-axis, elastomeric composite substrate |
| 04/08/1998 | EP0834604A1 An electroplating process |
| 04/08/1998 | EP0834489A1 Thick opaque ceramic coatings |
| 04/08/1998 | EP0834376A1 Solder, and soldered electronic component and electronic circuit board |
| 04/08/1998 | EP0834243A1 Photolithographically patterned spring contact |
| 04/08/1998 | EP0834242A1 Connection substrate |
| 04/08/1998 | EP0834196A1 Integrated circuit comprising a substrate and a wiring layer with a buffer layer between the substrate and the wiring layer |
| 04/08/1998 | EP0834195A1 Flexible leads for tape ball grid array circuit |
| 04/08/1998 | EP0833578A1 Fan attachment clip for heat sink |
| 04/08/1998 | CN1178605A Array of electrical components with leads attached |
| 04/08/1998 | CN1178602A High performance integrated circuit package |
| 04/07/1998 | USRE35765 Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices |
| 04/07/1998 | US5737693 Method and system for generating arbitrary analog waveforms |
| 04/07/1998 | US5737272 Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus |
| 04/07/1998 | US5737191 Structure and process for mounting semiconductor chip |
| 04/07/1998 | US5737187 Apparatus, method and system for thermal management of an unpackaged semiconductor device |
| 04/07/1998 | US5737186 Arrangement of plural micro-cooling devices with electronic components |
| 04/07/1998 | US5737171 Switched management of thermal impedence to reduce temperature excursions |
| 04/07/1998 | US5737052 Liquid crystal display and manufacturing process thereof with drive circuit and active matrix connected via through hole |
| 04/07/1998 | US5736863 Abatement of electron beam charging distortion during dimensional measurements of integrated circuit patterns with scanning electron microscopy by the utilization of specially designed test structures |
| 04/07/1998 | US5736792 Semiconductor device |
| 04/07/1998 | US5736791 Semiconductor device and bonding pad structure therefor |
| 04/07/1998 | US5736790 Semiconductor chip, package and semiconductor device |
| 04/07/1998 | US5736789 Ball grid array casing for integrated circuits |
| 04/07/1998 | US5736787 Package for high power heat generating semiconductor devices |
| 04/07/1998 | US5736786 Power module with silicon dice oriented for improved reliability |
| 04/07/1998 | US5736785 Semiconductor package for improving the capability of spreading heat |
| 04/07/1998 | US5736784 Variable-width lead interconnection structure and method |
| 04/07/1998 | US5736783 High frequency microelectronics package |
| 04/07/1998 | US5736780 Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes |
| 04/07/1998 | US5736775 Semiconductor device having a concentration peak position coinciding with a channel stopper |