Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1998
05/07/1998DE19645709A1 Central processing unit cooling system adaptor
05/06/1998EP0840376A1 Alternating invertors for capacitive coupling reduction in transmission lines
05/06/1998EP0840375A2 Chip-lead interconnection structure in a semiconductor device
05/06/1998EP0840374A1 A semiconductor package having mechanically and electrically bonded supportive elements
05/06/1998EP0840373A1 Process for bonding a diamon substrate to at least one metallic substrate
05/06/1998EP0840372A2 Thermal dissipation system in 800 micrometer printed circuit
05/06/1998EP0840369A1 Electronic component and method of production thereof
05/06/1998EP0840366A2 Method of forming a phosphorus doped silica glass film
05/06/1998EP0840363A1 Method for fabricating a conductive diffusion barrier layer by PECVD
05/06/1998EP0840361A2 Method and apparatus for depositing a film over a substrate
05/06/1998EP0840129A2 Backing plate for IC test fixture
05/06/1998EP0839388A1 Integrated circuit chip card and the method and system for the manufacture of same
05/06/1998EP0839344A1 Microcircuit with memory that is protected by both hardware and software
05/06/1998EP0839323A1 Microelectronic spring contact elements
05/06/1998EP0839322A1 Microelectronic contact structure and method of making same
05/06/1998EP0839321A1 Contact tip structures for microelectronic interconnection elements and methods of making same
05/06/1998EP0839078A1 Silicon alloys for electronic packaging
05/06/1998CN2281002Y Surface-adhesive diode
05/06/1998CN1180990A Liquid cooling device for high-power semiconductor module
05/06/1998CN1180989A Electric component with lead terminals
05/06/1998CN1180957A Oscillator
05/06/1998CN1180933A Integrated circuit and fabricating method and evaluating method of integrated circuit
05/06/1998CN1180930A Decision method for semiconductor integrated circuit whether or not qualified and semiconductor integrated circuit
05/06/1998CN1180927A High performance, low cost multi-chip module package
05/06/1998CN1180925A Semiconductor device including insulation film and fabrication method thereof
05/06/1998CN1180856A Heat conductive substrate mounted in PC board hole for transferring heat from IC heat sink
05/06/1998CA2189733A1 Integrated circuit leadframe with reduced inductance pin connections
05/05/1998US5748550 Multiple power line arrangement for a semiconductor memory device
05/05/1998US5748523 Integrated circuit magnetic memory element having a magnetizable member and at least two conductive winding
05/05/1998US5748452 Multi-electronic device package
05/05/1998US5748446 Heat sink support
05/05/1998US5747881 Semiconductor device, method of fabricating the same and copper leads
05/05/1998US5747880 Interconnect structure with an integrated low density dielectric
05/05/1998US5747879 Interface between titanium and aluminum-alloy in metal stack for integrated circuit
05/05/1998US5747877 Semiconductor chip package with enhanced thermal conductivity
05/05/1998US5747876 Semiconductor device and semiconductor module
05/05/1998US5747874 Semiconductor device, base member for semiconductor device and semiconductor device unit
05/05/1998US5747873 Technique for fabricating hybrid high-temperature superconductor-semiconductor circuits
05/05/1998US5747869 Reduced pitch laser redundancy fuse bank structure
05/05/1998US5747868 Laser fusible link structure for semiconductor devices
05/05/1998US5747867 Integrated circuit structure with interconnect formed along walls of silicon island
05/05/1998US5747830 Semiconductor display device with a hydrogen supply and hydrogen diffusion barrier layers
05/05/1998US5747779 Method of fusing and programming fuse frame
05/05/1998US5747384 Process of forming a refractory metal thin film
05/05/1998US5747361 Titanium-based barrier layer in contact with the metal interconnect layer; reduces hillock, spike and notch formation in the semiconductor device
05/05/1998US5747360 Method of metalizing a semiconductor wafer
05/05/1998US5747222 Multi-layered circuit substrate and manufacturing method thereof
05/05/1998US5747101 Thermoplastic adhesive pastes on semiconductor wafer substrates
05/05/1998US5747095 Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages
05/05/1998US5746927 Forming around holes of second circuit board a photosensitive polymer, etching
05/05/1998US5746884 Fluted via formation for superior metal step coverage
05/05/1998US5746832 Apparatus for depositing particles onto a wafer
05/05/1998US5746621 Electrostatic discharge protection device
05/05/1998US5746608 Surface mount socket for an electronic package, and contact for use therewith
05/05/1998US5746267 Monolithic metal matrix composite
05/05/1998US5745984 Method for making an electronic module
05/05/1998US5745981 Method for making magnetic and electromagnetic circuit components having embedded magnetic materials in a high density interconnect structure
05/05/1998CA2129336C Self-locking heat sinks for surface mount devices
05/05/1998CA1339852C Platinum and rhodium calalysis of low temperature formation multilayer ceramics
04/1998
04/30/1998WO1998018304A1 Method and device for positioning and retaining micro-building-blocks
04/30/1998WO1998018303A1 A system and method for packaging integrated circuits
04/30/1998WO1998018302A1 Means and method for mounting electronics
04/30/1998WO1998018164A1 Semiconductor device, method for manufacturing the same, circuit board, and flexible substrate
04/30/1998WO1998018163A1 Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, its manufacturing method, package substrate, and electronic appliance
04/30/1998WO1998018162A1 Film carrier tape and semiconductor device, method for manufacturing them, and circuit board
04/30/1998WO1998018161A1 Semiconductor device, method of its manufacture, circuit substrate, and film carrier tape
04/30/1998WO1998018102A1 Method and arrangement for protecting electronic computing units, in particular chip cards
04/30/1998WO1998017740A1 Superconducting heat transfer medium
04/30/1998DE19745575A1 Terminal electrode structure with substrate containing several terminal points
04/30/1998DE19723262A1 Halbleiterschaltungsvorrichtung, die eine sicherungsprogrammierbare Bestanden/Durchgefallen- Identifizierungsschaltung aufweist, und Bestanden/Durchgefallen-Bestimmungsverfahren für dieselbe A semiconductor circuit device having a fuse programmable pass / Durchgefallen- identification circuit, and pass / fail determination method for the same
04/30/1998DE19643612A1 Heat-sink element for IC module
04/30/1998CA2269523A1 Method and device for positioning and retaining micro-building-blocks
04/30/1998CA2217790A1 Process for bonding a diamond substrate to at least one metal substrate
04/29/1998EP0838988A2 Liquid cooling device for a high power semiconductor module
04/29/1998EP0838981A2 Laser machining of molded assemblies
04/29/1998EP0838862A1 Semiconductor device and method of producing the same
04/29/1998EP0838856A2 Integrated protection device against overloading
04/29/1998EP0838855A2 Semiconductor module
04/29/1998EP0838854A2 Wired board with improved bonding pads
04/29/1998EP0838853A2 Integrated circuit device and process for its manufacture
04/29/1998EP0838851A2 Dielectric for interconnect structure
04/29/1998EP0838091A1 Electronic package with improved thermal properties
04/29/1998EP0738424A4 Integrated circuit passivation process and structure
04/29/1998CN2280351Y Built-in heat pipe type shaped material heat radiator
04/29/1998CN1180241A External lead wire corrector and visual examinator for semiconductor device
04/28/1998US5745593 Method and system for inspecting integrated circuit lead burrs
04/28/1998US5745346 Connecting socket for a semiconductor package
04/28/1998US5745344 Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
04/28/1998US5745012 Voltage-controlled oscillator having a semiconductor integrated circuit, a piezoelectrics resonator and a diode and variable-capacitance diode
04/28/1998US5744870 Integrated circuit memory device
04/28/1998US5744869 Apparatus for mounting a flip-chip semiconductor device
04/28/1998US5744868 Encapsulated electronic component having a plurality of connection leads of martensitic structural-hardening conductive alloy
04/28/1998US5744866 Low resistance ground wiring in a semiconductor device
04/28/1998US5744865 Highly thermally conductive interconnect structure for intergrated circuits
04/28/1998US5744863 Chip carrier modules with heat sinks attached by flexible-epoxy
04/28/1998US5744860 Power semiconductor module
04/28/1998US5744859 Semiconductor device
04/28/1998US5744858 Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area
04/28/1998US5744857 Semiconductor device
04/28/1998US5744856 Electronic system
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