Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/1998
04/28/1998US5744848 Hermetically sealed package holding an optical fiber to receive optical signals
04/28/1998US5744843 CMOS power device and method of construction and layout
04/28/1998US5744840 Electrostatic protection devices for protecting semiconductor integrated circuitry
04/28/1998US5744827 Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements
04/28/1998US5744758 Multilayer circuit board and process of production thereof
04/28/1998US5744752 Hermetic thin film metallized sealband for SCM and MCM-D modules
04/28/1998US5744411 Aluminum nitride sintered body with high thermal conductivity and its preparation
04/28/1998US5744410 High thermal conductive silicon nitride sintered body, method of producing the same and press-contacted body
04/28/1998US5744398 Method of forming electrode of semiconductor device
04/28/1998US5744394 Method for fabricating a semiconductor device having copper layer
04/28/1998US5744383 Integrated circuit package fabrication method
04/28/1998US5744382 Method of packaging electronic chip component and method of bonding of electrode thereof
04/28/1998US5744379 Semiconductor device composed of plural semiconductor chips and coupling means which couple the semiconductor chips together
04/28/1998US5744378 Method for fabricating a semiconductor device having multilevel interconnections
04/28/1998US5744376 Method of manufacturing copper interconnect with top barrier layer
04/28/1998US5744284 Method for fabricating resilient z-axis contacts for electrically interconnecting integrated circuits on a plurality of stacked carriers
04/28/1998US5744244 Tamper-proof electronic coatings
04/28/1998US5744232 Low loss, thick film metallizations for multilayer microwave packaging
04/28/1998US5744225 Heat insulating board and method for heat insulation by using the same
04/28/1998US5744224 Plastic
04/28/1998US5744171 System for fabricating conductive epoxy grid array semiconductor packages
04/28/1998US5744084 Method of improving molding of an overmolded package body on a substrate
04/28/1998US5743459 Method for fabricating semiconductor device with step of bonding lead frame leads to chip pads
04/28/1998US5743004 Method of forming electronic multilayer printed circuit boards or cards
04/28/1998CA2215559A1 Lean, high conductivity, relaxation-resistant beryllium-copper alloys
04/23/1998WO1998017089A1 Cold plate having uniform pressure drop and uniform flow rate
04/23/1998WO1998016953A1 Chip module and method for producing the same
04/23/1998WO1998016952A1 Electronic power module, and electronic power system comprising a plurality of same
04/23/1998WO1998016383A1 Method to control cavity dimensions of fired multilayer circuit boards on a support
04/23/1998CA2239252A1 Electronic power module, and electronic power system comprising a plurality of same
04/22/1998EP0837505A1 Semiconductor device and method of producing the same
04/22/1998EP0837503A2 Reference plane metallization on an integrated circuit
04/22/1998EP0837502A2 Improvements in or relating to hydrogen gettering
04/22/1998EP0837499A1 Semiconductor DRAM device having monitor element for monitoring capacitance
04/22/1998EP0837498A1 Semiconductor device and its manufacture
04/22/1998EP0837496A2 Reduction of undesired moisture retention in dielectric films to avoid subsequent H2 out-diffusion
04/22/1998EP0836748A1 Insulating film for use in semiconductor device
04/22/1998EP0753101A4 Engine components including ceramic-metal composites
04/22/1998CN1179626A Improved surface-mount high power semiconductor package and method of manufacture
04/22/1998CN1179625A Semiconductor element, semiconductor element fabricating methd, semiconductor device, and semiconductor device fabricating method
04/22/1998CN1179444A Epoxy resin composition and semiconductor device encapsulated therewith
04/21/1998US5742627 Laser oscillator using a plate-type heat exchanger
04/21/1998US5742555 Integrated circuit
04/21/1998US5742487 IC carrier
04/21/1998US5742171 Test device for multi-contact integrated circuit
04/21/1998US5742101 Semiconductor device
04/21/1998US5742100 Electronic component
04/21/1998US5742099 Power bus for an integrated circuit including end-to-end arranged segments providing power and ground
04/21/1998US5742098 Semiconductor component with plastic sheath and method for producing the same
04/21/1998US5742097 Multilevel semiconductor integrated circuit device
04/21/1998US5742096 Lead on chip package
04/21/1998US5742095 Method of fabricating planar regions in an integrated circuit
04/21/1998US5742094 Sealed semiconductor chip
04/21/1998US5742091 Semiconductor device having a passive device formed over one or more deep trenches
04/21/1998US5742086 Hexagonal DRAM array
04/21/1998US5742079 Integrated circuit with variable pad pitch
04/21/1998US5741742 Formation of aluminum-alloy pattern
04/21/1998US5741734 Capacitor structure for semiconductor device and method of manufacturing the same
04/21/1998US5741732 Method for detecting implantation mask misalignment
04/21/1998US5741731 Semiconductor device wired with fuse
04/21/1998US5741729 Ball grid array package for an integrated circuit
04/21/1998US5741726 Semiconductor device assembly with minimized bond finger connections
04/21/1998US5741720 Method of programming an improved metal-to-metal via-type antifuse
04/21/1998US5741579 Heat-conductive sheet
04/21/1998US5741530 Molding die used for sealing semiconductor chips with good productivity and lead-frame used for mounting semiconductor chips
04/21/1998US5741410 Apparatus for forming spherical electrodes
04/21/1998US5741392 Card comprising at least one electronic element and method of manufacture of such a card
04/21/1998US5741141 Non-destructive interconnect system for semiconductor devices and a carrier assembly for use therewith
04/21/1998US5740956 Bonding method for semiconductor chips
04/21/1998US5740787 Electric circuit device having an excellent sealing construction
04/21/1998US5740606 Method of manufacturing a set of electronic modules for electronic memory cards
04/21/1998US5740603 Mixing lead, zinc, boron glass powders, casting to form sheet, heat sealing sheet, firing
04/16/1998WO1998016006A1 Coplanar waveguide amplifier
04/16/1998WO1998015981A1 Microwave-frequency hybrid integrated circuit
04/16/1998WO1998015980A1 Hybrid high-power integrated circuit
04/16/1998WO1998015978A1 Hybrid high-power microwave-frequency integrated circuit
04/16/1998WO1998015977A1 Hybrid high-power microwave-frequency integrated circuit
04/16/1998WO1998015975A1 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
04/16/1998WO1998015974A1 Method for mounting the crystal of semi-conductive device
04/16/1998WO1998015973A1 Thin film transistor and liquid crystal display and electronic equipment made using the same
04/16/1998DE19745243A1 Embedded integrated circuit package
04/16/1998DE19737294A1 Capacitor manufacturing method for integrated circuit
04/16/1998DE19736895A1 Semiconductor component casing for surface fastening
04/16/1998DE19702014A1 Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls Chip module and method of producing a chip module,
04/16/1998DE19648733A1 Word line production
04/16/1998DE19642488A1 Thin-layer circuit board for e.g. chip card
04/16/1998DE19633712C1 Adhesive band application device for lead-frame
04/15/1998EP0836369A2 Printed circuit board
04/15/1998EP0836229A2 Method and structure for integration of passive components on flexible film layers
04/15/1998EP0836228A2 Improvements in or relating to carrier tapes
04/15/1998EP0836227A2 Heat conductive substrate mounted in PC board hole for transferring heat from IC to heat sink
04/15/1998EP0836222A1 Interconnect structure comprising semiconductor material
04/15/1998EP0835892A1 Epoxy resin composition for printed wiring board and laminated board produced with the use of the same
04/15/1998EP0835600A1 Perimeter matrix ball grid array circuit package with a populated center
04/15/1998EP0835534A1 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement
04/15/1998EP0835526A2 Semiconductor device provided with a resistance element
04/15/1998EP0835525A1 Double half via antifuse
04/15/1998EP0835524A1 Cooling unit with pin elements
04/15/1998EP0835523A1 Process for packaging a pressure-sensitive electronic circuit in a protective housing sealed all around
04/15/1998EP0835522A1 Process for producing a ceramic multilayer substrate
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