Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1998
05/14/1998WO1998020555A1 Method for minimizing warp in the production of electronic assemblies
05/14/1998WO1998020554A1 Apparatus for applying adhesive tape for semiconductor packages
05/14/1998WO1998020553A1 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
05/14/1998WO1998020552A1 Improved leadframe structure and process for packaging integrated circuits
05/14/1998WO1998020551A1 Method for minimizing warp and die stress in the production of an electronic assembly
05/14/1998WO1998020550A1 Method for controlling warp of electronic assemblies by use of package stiffener
05/14/1998WO1998020549A1 Use of variable perforation density in copper layer to control cte
05/14/1998WO1998020548A1 Package for mounting an integrated circuit chip
05/14/1998WO1998020547A1 Constraining ring for use in electronic packaging
05/14/1998WO1998020546A1 High tolerance cavities in chip packages
05/14/1998WO1998020545A1 Method for manufacturing high tolerance cavities in chip packages
05/14/1998WO1998020544A1 Method of increasing package reliability using package lids with plane cte gradients
05/14/1998WO1998020542A1 Electronic parts device
05/14/1998WO1998020540A1 Method and apparatus for improving wireability in chip modules
05/14/1998WO1998020539A1 Method for preparing vias for subsequent metallization
05/14/1998WO1998020538A1 Multiple pulse space processing to enhance via entrance formation at 355 nm
05/14/1998WO1998020535A2 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
05/14/1998WO1998020534A1 Method for using fiducial schemes to increase nominal registration
05/14/1998WO1998020531A2 Method for forming a through-via in a laminated substrate
05/14/1998WO1998020528A1 METHOD FOR IMPROVING RELIABILITY OF THIN CIRCUIT SUBSTRATES BY INCREASING THE Tg OF THE SUBSTRATE
05/14/1998WO1998019863A1 Method and apparatus for aligning and laminating substrates to stiffeners in electrical circuits
05/14/1998WO1998019859A1 Super conducting heat transfer medium
05/14/1998DE4143494C2 Semiconductor device with reduced housing thickness and wt.
05/14/1998DE19736685A1 Bonding appliance for chip and lead frame
05/14/1998DE19728461A1 Distortion resistant lead frame for semiconductor chip
05/14/1998DE19710471A1 Test instrument for evaluating reliability of connecting wires in semiconductors
05/14/1998DE19646693A1 Microelectronic component esp. semiconductor memory component
05/14/1998DE19646476A1 Structure forming thermal connection for several components
05/14/1998DE19646396A1 Power semiconductor module, especially power converter
05/14/1998DE19646369A1 Manufacturing ceramic multilayer circuit of green ceramic foils
05/14/1998DE19646195A1 Modular, extruded, liquid-cooling body with adjustable characteristic
05/13/1998EP0841843A1 Power module for electrical motor drive
05/13/1998EP0841705A2 Bipolar transistor and a method of manufacturing the same
05/13/1998EP0841703A2 Ultrafine particle structure and production method thereof
05/13/1998EP0841701A1 Component characteristics measurement circuit in an integrated semiconductor circuit system
05/13/1998EP0841699A2 Film capacitor and semiconductor package or device with it
05/13/1998EP0841698A2 Wafer level contact sheet and method of assembly
05/13/1998EP0841697A2 Method of using a permanent z-axis material
05/13/1998EP0841696A1 Method to encapsulate connection wires for semiconductor power wafers
05/13/1998EP0841695A2 High planarity, low CTE base and method of making the same
05/13/1998EP0841694A1 Semiconductor package with multilayered circuit and semiconductor device
05/13/1998EP0841407A1 Copper-nickel-beryllium alloy
05/13/1998EP0840660A1 Fluxless contacting of components
05/13/1998EP0840654A1 Manufacturing particles and articles having engineered properties
05/13/1998EP0687383B1 Heat sink assembly for solid state devices
05/13/1998EP0619935B1 Multi-layer circuit construction methods and structures with customization features and components for use therein
05/13/1998CN2281585Y Heat radiator for semiconductor devices in use of electric power industry
05/13/1998CN1181841A Solder bump fabrication methods and structure including a titanium barrier layer
05/13/1998CN1181630A Method and apparatus for heat sink
05/13/1998CN1181629A Semiconductor chip-mounting board and mounting method for semiconductor chip
05/13/1998CN1181624A Pre-bond cavity air bridge
05/13/1998CN1181620A Method for wire bonding
05/13/1998CN1181619A Flip chip attach on flexible circuit carrier using chip with metallic cap on solder
05/13/1998CN1181618A External terminal fabrication method for ball grid array package
05/13/1998CN1181290A Process for manufacturing contacts for electronics devices, manufacturing apparatus for carrying out same process and continuous strip material for stamping used for the same process
05/12/1998US5752182 Hybrid IC
05/12/1998US5751607 Method of sputter deposition simulation by inverse trajectory calculation
05/12/1998US5751554 Testable chip carrier
05/12/1998US5751553 Thin multichip module including a connector frame socket having first and second apertures
05/12/1998US5751552 Semiconductor device balancing thermal expansion coefficient mismatch
05/12/1998US5751067 Nitrogen compound conductor layer
05/12/1998US5751066 Structure with selective gap fill of submicron interconnects
05/12/1998US5751065 Integrated circuit with active devices under bond pads
05/12/1998US5751063 Multi-chip module
05/12/1998US5751062 Cooling device of multi-chip module
05/12/1998US5751061 Semiconductor diode device with non-planar heatsink and method of manufacture
05/12/1998US5751060 Electronic package
05/12/1998US5751057 Lead on chip lead frame design without jumpover wiring
05/12/1998US5751056 Reliable metal leads in high speed LSI semiconductors using dummy leads
05/12/1998US5751051 Semiconductor device equipped with electrostatic breakdown protection circuit
05/12/1998US5751048 Semiconductor device having a contact window structure
05/12/1998US5751038 Electrically erasable and programmable read only memory (EEPROM) having multiple overlapping metallization layers
05/12/1998US5751016 Device having a switch comprising a chromium layer
05/12/1998US5751015 Semiconductor reliability test chip
05/12/1998US5750926 Hermetically sealed electrical feedthrough for use with implantable electronic devices
05/12/1998US5750439 Method of making aluminum alloy wiring with less silicon nodule
05/12/1998US5750423 Method for encapsulation of semiconductor devices with resin and leadframe therefor
05/12/1998US5750422 Method for making integrated circuit packaging with reinforced leads
05/12/1998US5750421 Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
05/12/1998US5750417 Method of manufacturing a device having a support bar with conductor tracks for electrically contacting a semiconductor element
05/12/1998US5750415 Low dielectric constant layers via immiscible sol-gel processing
05/12/1998US5750403 Method of forming multi-layer wiring utilizing hydrogen silsesquioxane resin
05/12/1998US5750271 Applying tacky solution to powdered solder; heating to melt
05/12/1998US5750194 Process for producing a metal paste
05/12/1998US5750016 Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
05/12/1998US5749988 Integrated circuits
05/12/1998US5749698 Substrate transport apparatus and substrate transport path adjustment method
05/12/1998US5749413 Heat exchanger for high power electrical component and package incorporating same
05/12/1998US5749226 Microminiature stirling cycle cryocoolers and engines
05/07/1998WO1998019339A1 Integrated electronic circuit
05/07/1998WO1998019338A1 Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them
05/07/1998WO1998019337A1 Integrated circuits and methods for their fabrication
05/07/1998WO1998019218A1 Improved process for 3d chip stacking
05/07/1998WO1998018615A1 Conductive elastomers and methods for fabricating the same
05/07/1998DE19748847A1 Semiconductor component with multilayer composite structure
05/07/1998DE19737261A1 Lead frame for encapsulated integrated circuit
05/07/1998DE19735904A1 Lead frame for discrete component or integrated circuit mounting
05/07/1998DE19723096A1 Connecting line formation method for integrated circuit
05/07/1998DE19715926A1 Ball grid array component external connection production
05/07/1998DE19652325C1 Integrated semiconductor circuit with redundant capacitors
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