Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1998
05/26/1998US5757067 Resin-sealed type semiconductor device
05/26/1998US5757066 Resin-molded type semiconductor device and method of manufacturing the same
05/26/1998US5757064 Multlayer interconnection structure for semiconductor device
05/26/1998US5757062 Ceramic substrate for semiconductor device
05/26/1998US5757060 Contamination guard ring for semiconductor integrated circuit applications
05/26/1998US5757058 Pad for providing electrical connection to a liquid crystal display device
05/26/1998US5757041 Adaptable MMIC array
05/26/1998US5756932 Signal distribution structure having lossy insulator
05/26/1998US5756931 Heat-generating element cooling device
05/26/1998US5756564 Waterproofing coating
05/26/1998US5756405 Technique for forming resin-impregnated fiberglass sheets
05/26/1998US5756395 Process for forming metal interconnect structures for use with integrated circuit devices to form integrated circuit structures
05/26/1998US5756393 Covering layer of electroconductive material(which forms both a capacitor storage node and an inner antifuse plate) with a dielectric material which acts as both intervening dielectric and antifuse elements, controlled breakdown voltage
05/26/1998US5756380 Method for making a moisture resistant semiconductor device having an organic substrate
05/26/1998US5756379 Method and apparatus for making an electronic module for cards
05/26/1998US5756377 Lead frame and manufacturing method thereof
05/26/1998US5756376 Using a plasma asher, solving problem of contact resistance
05/26/1998US5756369 Rapid thermal processing using a narrowband infrared source and feedback
05/26/1998US5756368 Integrated circuit packaging method and the package
05/26/1998US5756367 Method of making a spacer based antifuse structure for low capacitance and high reliability
05/26/1998US5756259 With polymer having bound photoabsorber
05/26/1998US5756007 From electrostatic discharges
05/26/1998US5755903 Forming stress relief pads on substrate surface in vicinity of selected vias during sintering
05/26/1998US5755278 Heat sink attached to a heat plate
05/26/1998US5755276 CPU heat sink fastener
05/26/1998CA2150219C Micropin array and production method thereof
05/22/1998WO1998021755A2 Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
05/22/1998WO1998021752A1 Memory module
05/22/1998WO1998021751A2 Optimizing the power connection between chip and circuit board for a power switch
05/22/1998WO1998021745A1 Process for the production of semiconductor device
05/22/1998WO1998021165A1 Method of preparing coated nitride powder and the coated powder produced thereby
05/21/1998CA2219831A1 Multi-level assembly of electronic modules
05/20/1998EP0843508A2 Coating circuits to dissipate heat
05/20/1998EP0843358A2 Electronic flat-pack module and chipcard
05/20/1998EP0843357A1 Method of manufacturing a grid array semiconductor package
05/20/1998EP0843356A2 Lead-on-chip semiconductor device
05/20/1998EP0842995A1 Thermoplastic adhesive
05/20/1998EP0842966A2 Polymaleimide resin composition and laminate plate for semiconductor substrate using it
05/20/1998EP0842535A1 Reduced electromigration interconnection line
05/20/1998EP0842534A1 Wire bond tape ball grid array package
05/20/1998EP0842533A1 Ultra thin ball grid array package using a flex tape or printed wiring board substrate and method
05/20/1998EP0720768A4 A horizontally twisted-pair planar conductor line structure
05/20/1998EP0654176B1 Securing device for semiconductor circuit components
05/20/1998EP0649893B1 Adhesive tape for electronic parts and liquid adhesive
05/20/1998EP0582694B1 Semiconductor device with a semiconductor substrate and a ceramic plate as lid
05/20/1998DE19750415A1 Mfg. cooler unit with heat-transfer tubes
05/20/1998DE19647618A1 Low stress contact metallisation for FET
05/20/1998DE19647590A1 High power semiconductor multi-chip module e.g. for power electronics
05/20/1998CN1182526A Precision clamp, and method for clamping thyristors and similar electronic power components
05/20/1998CN1182499A 芯片罩盖 Chip cover
05/20/1998CN1182447A Epoxy resin composition
05/20/1998CN1182345A Multilayer printed circuit board
05/20/1998CN1182284A Lead-frame and semiconductor device using the same thereof
05/20/1998CN1182283A Semiconductor element-mounting board, manufacturing method for board, semiconductor device and manufacturing method for device
05/20/1998CN1182282A Lead-on-chip type semiconductor chip package using adhesive deposited on chip active surfaces in wafer level and method for manufacturing the same
05/20/1998CN1182280A Pattern drawing method using charged particle beams and apparatus therefor
05/20/1998CN1038465C Metal base board and elecronic equipment using the same
05/20/1998CN1038433C Gold alloy wire for bonding semiconductor device
05/19/1998US5754879 Integrated circuit for external bus interface having programmable mode select by selectively bonding one of the bond pads to a reset terminal via a conductive wire
05/19/1998US5754410 Multi-chip module with accessible test pads
05/19/1998US5754408 Stackable double-density integrated circuit assemblies
05/19/1998US5754403 Containing layer of elemental aluminum and layer having high thermoconductivity and low coefficient of thermal expansion
05/19/1998US5754402 Power amplifying module
05/19/1998US5754401 Pressure compliantly protected heatsink for an electronic device
05/19/1998US5754400 Demountable heat sink
05/19/1998US5754244 Image display apparatus with line number conversion
05/19/1998US5754171 Display device having integrated circuit chips thereon
05/19/1998US5754158 Liquid crystal device
05/19/1998US5754089 Fuse structure and method for manufacturing it
05/19/1998US5753977 Semiconductor device and lead frame therefor
05/19/1998US5753976 Multi-layer circuit having a via matrix interlayer connection
05/19/1998US5753975 Semiconductor device with improved adhesion between titanium-based metal wiring layer and insulation film
05/19/1998US5753974 Electronic device assembly
05/19/1998US5753973 Resin seal semiconductor package
05/19/1998US5753972 Microelectronics package
05/19/1998US5753971 Power semiconductor module with terminal pins
05/19/1998US5753970 System having semiconductor die mounted in die-receiving area having different shape than die
05/19/1998US5753969 Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
05/19/1998US5753968 Low loss ridged microstrip line for monolithic microwave integrated circuit (MMIC) applications
05/19/1998US5753967 Damascene process for reduced feature size
05/19/1998US5753944 Layout of butting contacts of a semiconductor device
05/19/1998US5753901 Chip for an electronic card coated with a layer of insulating material, and an electronic card including such a chip
05/19/1998US5753857 Charge coupled device (CCD) semiconductor chip package
05/19/1998US5753540 Apparatus and method for programming antifuse structures
05/19/1998US5753539 Method of making an integrated circuit with windowed fuse element and contact pad
05/19/1998US5753537 Photolithography, etching, and sudivision of slice into indivisual slices with package leads
05/19/1998US5753535 Leadframe and resin-sealed semiconductor device
05/19/1998US5753534 Semiconductor connecting device and method for making the same
05/19/1998US5753532 Method of manufacturing semiconductor chip package
05/19/1998US5753529 Surface mount and flip chip technology for total integrated circuit isolation
05/19/1998US5753528 Method of fabricating metal-to-metal antifuse with improved diffusion barrier layer
05/19/1998US5753376 Multilayer glass ceramic substrate and process for producing the same
05/19/1998US5753374 Protective electronic coating
05/19/1998US5753372 Wiring structures and method of manufacturing the same
05/19/1998US5752846 IC socket
05/14/1998WO1998020718A1 Heat sink-lead frame structure
05/14/1998WO1998020559A1 Dimensionally stable core for use in high density chip packages and a method of fabricating same
05/14/1998WO1998020558A1 Electronic package having reduced radius of curvature
05/14/1998WO1998020557A1 Method for reducing via inductance in an electronic assembly and device
05/14/1998WO1998020556A1 Method of increasing package reliability by designing in plane cte gradients
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