Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1998
06/02/1998US5761037 For cooling a body
06/02/1998US5761036 Socket assembly for electrical component
06/02/1998US5761035 Circuit board apparatus and method for spray-cooling a circuit board
06/02/1998US5760674 Fusible links with improved interconnect structure
06/02/1998US5760650 Coplanar waveguide amplifier
06/02/1998US5760484 Alignment mark pattern for semiconductor process
06/02/1998US5760483 Method for improving visibility of alignment targets in semiconductor processing
06/02/1998US5760482 Semiconductor device of the type sealed in glass comprising a semiconductor body connected to slugs by means of a silver-aluminum bonding layer
06/02/1998US5760480 Low RC interconnection
06/02/1998US5760478 Clock skew minimization system and method for integrated circuits
06/02/1998US5760477 Integrated circuit contacts having resistive electromigration characteristics
06/02/1998US5760476 Interconnect run between a first point and a second point in a semiconductor device for reducing electromigration failure
06/02/1998US5760475 Refractory metal-titanium nitride conductive structures
06/02/1998US5760473 Semiconductor package having a eutectic bonding layer
06/02/1998US5760472 Surface mount semiconductor package
06/02/1998US5760471 Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package
06/02/1998US5760469 Semiconductor device and semiconductor device mounting board
06/02/1998US5760468 Adhesion enhanced semiconductor die for mold compound packaging
06/02/1998US5760467 Semiconductor device lead frame having sunk die pad portions
06/02/1998US5760466 Semiconductor device having improved heat resistance
06/02/1998US5760465 Electronic package with strain relief means
06/02/1998US5760464 Semiconductor device
06/02/1998US5760463 Superconducting layer in contact with group III-V semiconductor layer for wiring structure
06/02/1998US5760462 Reduced leakage across gate for speed and efficiency; chalcogenide component
06/02/1998US5760453 Moisture barrier layers for integrated circuit applications
06/02/1998US5760450 Semiconductor resistor using back-to-back zener diodes
06/02/1998US5760429 Multi-layer wiring structure having varying-sized cutouts
06/02/1998US5760425 Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance
06/02/1998US5760421 Semiconductor device including indices for identifying positions of elements in the device.
06/02/1998US5760337 Binder consists of crosslinked resin produced by reacting atleast one dienophile having functionality greater than one and atleast one polymer formed by reacting cabon monoxide and aliphatic alpha-olefin and a filler
06/02/1998US5760333 Heat-generating element cooling device
06/02/1998US5760146 Epoxy resin modified with phosphorus compounds and amines for printed circuits
06/02/1998US5759915 Method of forming semiconductor device having an improved buried electrode formed by selective CVD
06/02/1998US5759914 Multiple layering and patterning to ensure connection
06/02/1998US5759912 Method of manufacturing a semiconductor device having multi-layered wiring without hillocks at the insulating layers
06/02/1998US5759910 Process for fabricating a solder bump for a flip chip integrated circuit
06/02/1998US5759906 Planarization method for intermetal dielectrics between multilevel interconnections on integrated circuits
06/02/1998US5759877 Intersection of polysilicon pad and metal
06/02/1998US5759876 Method of making an antifuse structure using a metal cap layer
06/02/1998US5759875 Reduced filler particle size encapsulant for reduction in die surface damage in LOC packages and method of use
06/02/1998US5759874 Method for producing semiconductor element and adhesive sheet for adhering wafer
06/02/1998US5759873 Method of manufacturing chip-size package-type semiconductor device
06/02/1998US5759871 Structure for testing junction leakage of salicided devices fabricated using shallow trench and refill techniques
06/02/1998US5759868 Fabricating a semiconductor device
06/02/1998US5759737 Multilayer elements with carriers, bonding and applying photoresist patterns, exposure to radiation, screening and connecting pads, development and removal of photoresists
06/02/1998US5759690 Phosphorus modified, fire retardant, circuit boards
06/02/1998US5759269 Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture
06/02/1998US5758823 Synthetic jet actuator and applications thereof
06/02/1998US5758418 Method of making an ultra high-density, high-performance heat sink
06/02/1998US5758413 Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias
06/02/1998US5758409 Conductive ball-placing apparatus
05/1998
05/28/1998WO1998022981A1 Semiconductor integrated circuit with inductor
05/28/1998WO1998022980A1 Semiconductor device and process for manufacturing the same
05/28/1998WO1998022979A1 Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures
05/28/1998WO1998022767A1 Thin, planar heat spreader
05/28/1998DE19728171A1 Semiconductor for evaluation of defects to isolation edge
05/28/1998DE19648090A1 Method of mounting electrical components
05/28/1998DE19648041A1 Integrated vertical semiconducting component
05/27/1998EP0844666A1 Electronic multi-level modules assembly
05/27/1998EP0844665A2 Wafer level packaging
05/27/1998EP0844664A2 A bond pad for an integrated circuit
05/27/1998EP0844663A1 Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them
05/27/1998EP0844660A1 Semiconductor device and method of manufacturing the same
05/27/1998EP0844658A2 Integrated circuit, method of fabrication and evaluation of the same
05/27/1998EP0844657A1 Method for mounting semiconductor chip
05/27/1998EP0844656A1 Electronic component structure
05/27/1998EP0843895A1 Metal interconnect structure for an integrated circuit with improved electromigration reliability
05/27/1998EP0843892A1 Top loading socket for ball grid arrays
05/27/1998EP0843621A1 Conductive via fill inks for ceramic multilayer circuit boards on support substrates
05/27/1998EP0796200A4 Method and apparatus for filling a ball grid array
05/27/1998EP0753204B1 Method of froming semiconductor component designed for vertical integration and use for testing purposes
05/27/1998EP0749500B1 Method of manufacturing a thin silicon-oxide layer
05/27/1998CN1183170A Encapsulation of transmitter and receiver modules
05/27/1998CN1183169A A solder bump structure for a microelectronic substrate
05/27/1998CN1182957A Structure reinforced spherical grid array semiconductor package and system
05/27/1998CN1182956A Fluorine barrier layer for preventing deterioration located between conductor and insulator
05/26/1998USRE35807 Power semiconductor packaging
05/26/1998US5757999 Optical device
05/26/1998US5757653 Method and apparatus for dynamically varying net rules
05/26/1998US5757623 Low-noise, high-Q stripline inductor
05/26/1998US5757621 Heat sink assembly employing spring-loaded standoffs
05/26/1998US5757620 Apparatus for cooling of chips using blind holes with customized depth
05/26/1998US5757619 Cooling apparatus for electronic components
05/26/1998US5757611 Electronic package having buried passive components
05/26/1998US5757252 Wide frequency band transition between via RF transmission lines and planar transmission lines
05/26/1998US5757089 Method of automatic wiring
05/26/1998US5757082 Semiconductor chips, devices incorporating same and method of making same
05/26/1998US5757081 Surface mount and flip chip technology for total integrated circuit isolation
05/26/1998US5757080 Resin-sealed semiconductor device
05/26/1998US5757079 Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure
05/26/1998US5757078 Semiconductor device with increased multi-bumps and adhered multilayered insulating films and method for installing same
05/26/1998US5757077 Integrated circuits with borderless vias
05/26/1998US5757075 Semiconductor heat sink apparatus
05/26/1998US5757074 Accuracy, efficiency
05/26/1998US5757073 Heatsink and package structure for wirebond chip rework and replacement
05/26/1998US5757072 Structure for protecting air bridges on semiconductor chips from damage
05/26/1998US5757071 Substrate surface having contact pads coated with layer of nickel-boron and reverse surface with projecting pins having layer of nickel-phosphorous and another of gold, for integrated circuits
05/26/1998US5757070 Integrated circuit package
05/26/1998US5757069 Semiconductor lead frame and packaging method
05/26/1998US5757068 Carrier film with peripheral slits
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