Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1998
06/10/1998EP0847086A2 Improvements in or relating to semiconductor devices
06/10/1998EP0847084A2 Electronic modules manufacturing
06/10/1998EP0846785A2 A method of metalizing ceramic members
06/10/1998EP0846728A2 Liquid epoxy resin potting material
06/10/1998DE19754125A1 Integrated circuit with active area for chip card
06/10/1998DE19735430A1 MOS transistor with number of source regions in active semiconductor region
06/10/1998DE19721967A1 Memory component with base platelet and several types of applied unit platelets
06/10/1998DE19640381A1 Heatsink for Pentium (RTM) processor chip
06/10/1998CN1184558A A heatsink and a method and an assembly for forming the same
06/10/1998CN1184379A Sealing structure and sealing method for of sealing electronic component
06/10/1998CN1184335A Semiconductor device and method for forming metal interconnection in semiconductor device
06/10/1998CN1184334A Semi-conductor apparatus and its producing method
06/10/1998CN1184333A Memory device module
06/10/1998CN1184332A Semiconductor device, method for manufacturing the same, and method for mounting the same
06/10/1998CN1184331A Integrated circuit assembling and disassembling device and its assembling and disassembling head
06/10/1998CN1184329A Lead frame manufacturing method
06/10/1998CN1184260A Tape carrier package and display device using the same
06/10/1998CN1184021A Integrated circuit assembling and disassembling device and its assembling and disassembling head
06/09/1998US5764486 Cost effective structure and method for interconnecting a flip chip with a substrate
06/09/1998US5764484 Ground ring for a metal electronic package
06/09/1998US5764483 Cooling unit for electronic equipment
06/09/1998US5764482 Integrated circuit heat seat
06/09/1998US5763955 Patterned filled layers for integrated circuit manufacturing
06/09/1998US5763954 Semiconductor device having multilayered metal interconnection structure and manufacturing method thereof
06/09/1998US5763953 Silver-containing layer; wiring; noncracking
06/09/1998US5763952 Multi-layer tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
06/09/1998US5763951 Non-mechanical magnetic pump for liquid cooling
06/09/1998US5763950 Semiconductor element cooling apparatus
06/09/1998US5763949 Surface-mount semiconductor package
06/09/1998US5763948 Semiconductor apparatus including a tin barrier layer having a (III) crystal lattice direction
06/09/1998US5763947 Integrated circuit chip package having configurable contacts and a removable connector
06/09/1998US5763946 Semiconductor device with bent electrode terminal
06/09/1998US5763945 Integrated circuit package electrical enhancement with improved lead frame design
06/09/1998US5763944 Semiconductor device having a reduced wiring area in and out of data path zone
06/09/1998US5763943 Electronic modules with integral sensor arrays
06/09/1998US5763942 Lead frame free of irregular deformation
06/09/1998US5763941 For making a semiconductor assembly
06/09/1998US5763940 Tape mounted semiconductor apparatus
06/09/1998US5763939 Semiconductor device having a perforated base film sheet
06/09/1998US5763937 Device reliability of MOS devices using silicon rich plasma oxide films
06/09/1998US5763936 Semiconductor chip capable of supressing cracks in insulating layer
06/09/1998US5763908 Semiconductor memory device having an interconnect structure which improves yield
06/09/1998US5763898 Electrically programmable antifuse disposed on an integrated circuit
06/09/1998US5763885 Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays
06/09/1998US5763829 Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe
06/09/1998US5763824 Lid assembly for shielding electronic components from EMI/RFI interferences
06/09/1998US5763540 A flexibility-imparting agent comprising a polysiloxane-polycarbosilane copolymer based on divinylsilanediol and a 1,4-bis/dialkylhydroxysilyl/benzene; curing; elasticity; stress relieving for packaging of miniature silicon chips
06/09/1998US5763329 Stabilizing the vapor deposition
06/09/1998US5763321 Method of manufacturing semiconductor device utilizing selective CVD method
06/09/1998US5763299 Reduced leakage antifuse fabrication method
06/09/1998US5763298 Bond pad option for integrated circuits
06/09/1998US5763297 Integrated circuit carrier having lead-socket array with various inner dimensions
06/09/1998US5763296 Method for fabricating an electronic device structure with studs locating lead frame on backing plate
06/09/1998US5763295 Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics
06/09/1998US5763093 Aluminum nitride body having graded metallurgy
06/09/1998US5763059 Circuit board
06/09/1998US5763057 Semiconductor chip having a dummy pattern
06/09/1998US5763005 Method for forming multilayer insulating film of semiconductor device
06/09/1998US5762131 For heat dissipation from high to low temperature sones
06/09/1998US5761811 Assembling method for cooling apparatus
06/09/1998US5761802 Multi-layer electrical interconnection method
06/04/1998WO1998024284A1 Base for an integrated circuit
06/04/1998WO1998024281A1 Electrical apparatus
06/04/1998WO1998024128A1 Semiconductor device
06/04/1998WO1998024127A1 Electrically erasable and programmable read only memory (eeprom) having multiple overlapping metallization layers
06/04/1998WO1998024126A1 Alumina multilayer wiring substrate provided with high dielectric material layer
06/04/1998WO1998024124A1 Base for integrated circuit
06/04/1998WO1998024122A1 Semiconductor device
06/04/1998WO1998024121A1 Semiconductor chip and wafer with a protective layer, especially made of ceramic
06/04/1998WO1998023568A1 Cyclopentylene compounds and intermediates therefor, epoxy resin composition, molding material, and resin-sealed electronic device
06/04/1998WO1998023406A1 Laser marking method and apparatus and liquid crystal element driving method
06/04/1998DE19743211A1 Integrated circuit mounting and dismounting system
06/04/1998DE19724533A1 Semiconductor component mfg. method with protruding electrodes for ball grid array
06/04/1998DE19649652A1 Halbleiterchip und Wafer mit Schutzschicht, insbesondere aus Keramik Semiconductor chip and wafer with a protective layer, in particular made of ceramic
06/04/1998DE19602943A1 Two-part metallic heat sink manufacturing method for semiconductor device
06/03/1998EP0845932A2 Lead bending machine for electronic components
06/03/1998EP0845847A1 Device for the protection of MOS integrated circuit terminals against electrostatic discharges
06/03/1998EP0845809A2 Semiconductor power module
06/03/1998EP0845808A2 Multilayer wiring structure including via holes
06/03/1998EP0845806A1 Improvements in or relating to integrated circuits
06/03/1998EP0845801A1 Process for manufacturing a plastic package for electronic devices having an heat dissipator
06/03/1998EP0845677A1 A method of using a temporary z-axis material
06/03/1998EP0845445A1 Photosensitive ceramic green sheet, ceramic package, and process for producing the same
06/03/1998EP0845157A2 Microwave monolithic integrated circuit with coplaner waveguide having silicon-on-insulator composite substrate
06/03/1998EP0844899A1 Hermetically sealed electrical feedthrough for use with implantable electronic devices
06/03/1998EP0796508A4 Multilayer solar cells with bypass diode protection
06/03/1998EP0598795B1 High performance passivation for semiconductor devices
06/03/1998CN1183645A Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same
06/03/1998CN1183644A Crushable bead on lead finger side surface to improve moldability
06/03/1998CN1183643A Semiconductor device and lead of frame used therefor
06/03/1998CN1183641A Method of fabricating semiconductor device with cavity interposed between wirings
06/03/1998CN1183640A Semiconductor device and method of testing the same
06/03/1998CN1183639A Test structure for estimating defects at isolation edge of semiconductor element and test method using the same
06/02/1998US5761697 Identifiable modules on a serial bus system and corresponding identification methods
06/02/1998US5761054 Integrated circuit assembly preventing intrusions into electronic circuitry
06/02/1998US5761053 Faraday cage
06/02/1998US5761048 Semiconductor die has a plurality of bond pads formed thereon which are electrically connected to conductive traces on package substrate
06/02/1998US5761044 Semiconductor module for microprocessor
06/02/1998US5761041 Mechanical heat sink attachment
06/02/1998US5761040 Semiconductor device
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