Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1998
06/18/1998DE19651632A1 Power semiconductor module with pressure contacted power semiconductor element for current rectifiers
06/18/1998DE19651566A1 Chip-Modul sowie Verfahren zu dessen Herstellung -Chip module and method of producing the
06/18/1998DE19651528A1 Chip bonding to chip or substrate
06/17/1998EP0848427A2 Semiconductor integrated citcuit and method for producing the same
06/17/1998EP0848426A1 Integrated circuit device and method of manufacturing same
06/17/1998EP0848424A2 Improved wiring structure for high performance chips
06/17/1998EP0848423A1 Resin-encapsulated semiconductor device and method of manufacturing the same
06/17/1998EP0848420A2 Fabricating plug and near-zero overlap interconnect line
06/17/1998EP0848419A1 Method of making an aluminum contact
06/17/1998EP0848244A2 Method and apparatus for the automatic checking of J-lead configuration
06/17/1998EP0847828A1 Solder material and electronic part using the same
06/17/1998EP0847595A1 Cooling element for electronic components
06/17/1998EP0847594A1 Deformable substrate assembly for adhesively bonded electronic device
06/17/1998EP0605677B1 Silicon or silica substrate with a modified surface and process for producing the same
06/17/1998EP0526468B1 Diamond-on-a-substrate for electronic applications
06/17/1998EP0504411B1 Semiconductor device having many lead pins
06/17/1998CN1185232A Semiconductor assembly
06/17/1998CN1185231A Semiconductor unit package, method and encapsulant for the packaging
06/17/1998CN1185221A Card-like data substrate and lead frame use therein
06/17/1998CN1185166A Epoxy resin moulding materials fire-proofed without halogens
06/17/1998CN1185087A Sheet for heat transfer substrate and method for mfg. the sheet, and heat transfer substrate using same and mfg. method therefor
06/17/1998CN1185047A IC socket for BGA package
06/17/1998CN1185037A 集成电路布线 IC wiring
06/17/1998CN1185036A Connecting material for electronic elements, and the connection and semiconductor device using same
06/17/1998CN1185034A Method of making aluminum contact
06/17/1998CN1185031A Semiconductor device and method of mfg. same
06/17/1998CN1184955A Photosensitive film laminating machine for mfg. lead frame
06/17/1998CN1038780C Heat insulation plate and heat insulation method using same
06/16/1998US5768290 Semiconductor integrated circuit device incorporating fuse-programmable pass/fail identification circuit and pass/fail determination method thereof
06/16/1998US5768109 Multi-layer circuit board and semiconductor flip chip connection
06/16/1998US5768108 Multi-layer wiring structure
06/16/1998US5768105 Flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board
06/16/1998US5768103 Circuit board apparatus and apparatus and method for spray-cooling an electronic component
06/16/1998US5768102 CPU heat dissipating device
06/16/1998US5767583 Semiconductor chip I/O and power pin arrangement
06/16/1998US5767582 Surface conditioning insulating layer for fine line conductive pattern
06/16/1998US5767580 Systems having shaped, self-aligning micro-bump structures
06/16/1998US5767578 Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation
06/16/1998US5767577 Method of solder bonding and power semiconductor device manufactured by the method
06/16/1998US5767576 Snap lines localize cracks and cleavages formed by bending stress to the snap line
06/16/1998US5767575 Ball grid array structure and method for packaging an integrated circuit chip
06/16/1998US5767574 Semiconductor lead frame
06/16/1998US5767573 Semiconductor device
06/16/1998US5767572 Semiconductor integrated circuit device assembly
06/16/1998US5767571 Semiconductor device and display unit using the semiconductor device and notebook-size personal computer
06/16/1998US5767570 Semiconductor packages for high I/O semiconductor dies
06/16/1998US5767569 Tab tape and semiconductor chip mounted on tab tape
06/16/1998US5767568 Semiconductor device
06/16/1998US5767567 In a semiconductor chip
06/16/1998US5767566 Plastic mold type semiconductor device
06/16/1998US5767564 Semiconductor device with a decoupling capacitor mounted thereon having a thermal expansion coefficient matched to the device
06/16/1998US5767546 Laternal power mosfet having metal strap layer to reduce distributed resistance
06/16/1998US5767528 Semiconductor device including pad portion for testing
06/16/1998US5767527 Semiconductor device suitable for testing
06/16/1998US5767503 Method for the manufacture of contact-free cards
06/16/1998US5767480 Hole generation and lead forming for integrated circuit lead frames using laser machining
06/16/1998US5767447 Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
06/16/1998US5767446 Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package
06/16/1998US5767028 Aluminum nitride sintered body and method for manufacturing the same
06/16/1998US5767015 Metal plug with adhesion layer
06/16/1998US5767014 Dielectric material is the reaction product of a hyperbranced polymer and a polysilsesquioxane
06/16/1998US5767012 Forming conductors on substrate, forming dielectric, forming trench, planarizing conductive material, etching, forming second dielectric layer
06/16/1998US5767011 Fabrication method for integrated circuits
06/16/1998US5767010 Solder bump fabrication methods and structure including a titanium barrier layer
06/16/1998US5767009 Structure of chip on chip mounting preventing from crosstalk noise
06/16/1998US5767008 Method for forming a gold plating electrode, a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method
06/16/1998US5767002 Method of manufacturing a multi-layer film each layer having single-layer area
06/16/1998US5767001 Process for producing semiconductor components between which contact is made vertically
06/16/1998US5766986 Method of transfer molding electronic packages and packages produced thereby
06/16/1998US5766985 Process for encapsulating a semiconductor device having a heat sink
06/16/1998US5766983 Tape automated bonding circuit with interior sprocket holes
06/16/1998US5766979 Wafer level contact sheet and method of assembly
06/16/1998US5766975 Packaged integrated circuit having thermal enhancement and reduced footprint size
06/16/1998US5766974 Silicon oxynitride layer
06/16/1998US5766972 Method of making resin encapsulated semiconductor device with bump electrodes
06/16/1998US5766809 Method for testing overlay in a semiconductor device utilizing inclined measuring mark
06/16/1998US5766741 Insulating paste and thick-film multi-layered printed circuit using the paste
06/16/1998US5766740 Circuit
06/16/1998US5766691 Process for manufacturing a high heat density transfer device
06/16/1998US5766516 Silver-based conductive paste and multilayer ceramic circuit substrate using the same
06/16/1998US5766379 Forming metal layer on face of microelectronic substrate, forming copper layer on the metal layer, annealing to form oxide of metal on copper layer by heating to diffuse some of metal layer through copper layer
06/16/1998US5766022 Electrical assembly
06/16/1998US5765280 Method for making a carrier based IC packaging arrangement
06/16/1998US5765279 For microelectronic devices
06/16/1998CA2193003A1 Integrated solid state cooling system
06/12/1998CA2192734A1 High density integrated circuits and method of packaging the same
06/11/1998WO1998025306A1 High-power microwave-frequency hybrid integrated circuit
06/11/1998WO1998025305A1 Method for manufacturing semiconductor device
06/11/1998WO1998025304A1 Semiconductor device
06/11/1998WO1998025303A1 Chip scale ball grid array for integrated circuit package
06/11/1998WO1998025302A1 Semiconductor device sealed with resin, and its manufacture
06/11/1998WO1998025301A1 Tab tape ball grid array package with vias laterally offset from solder ball bond sites
06/11/1998WO1998025298A1 Semiconductor device, method for manufacture thereof, circuit board, and electronic equipment
06/11/1998WO1998025297A1 Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
06/11/1998WO1998024558A1 Grafted thermoplastic elastomer barrier layer
06/11/1998CA2272436A1 Tab tape ball grid array package with vias laterally offset from solder ball bond sites
06/11/1998CA2272434A1 Chip scale ball grid array for integrated circuit package
06/10/1998EP0847125A1 An assembled structure having an enlarged heat transfer area for heat radiation therefrom
06/10/1998EP0847088A2 Semiconductor device, method for manufacturing the same, and method for mounting the same
06/10/1998EP0847087A2 A leadframe
1 ... 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 ... 2262