Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1998
06/30/1998US5772833 Plasma etching apparatus
06/30/1998US5772451 Sockets for electronic components and methods of connecting to electronic components
06/30/1998US5772106 Printhead for liquid metals and method of use
06/30/1998US5771966 For dissipating heat from a heat emitting component
06/30/1998US5771960 CPU heat sink fastener
06/30/1998US5771559 Removable heat sink assembly process for a chip package
06/30/1998US5771556 Acoustic wave device and manufacturing method
06/30/1998CA2162253C Glycidyl esters for use in electronics adhesives and process for their preparation
06/25/1998WO1998027794A1 A combined electrical and optical edge contact for compact connection of a part to another part, a use thereof and a method of manufacturing such an interconnection
06/25/1998WO1998027596A1 High density electrical connectors
06/25/1998WO1998027595A1 A silicide agglomeration fuse device with notches to enhance programmability
06/25/1998WO1998027592A1 Integrated semiconductor circuit with redundant capacitor
06/25/1998WO1998027589A1 Flip-chip type connection with elastic contacts
06/25/1998WO1998027588A1 A via structure
06/25/1998WO1998027585A1 Electroplated interconnection structures on integrated circuit chips
06/25/1998WO1998027177A1 Die attach adhesive compositions
06/25/1998WO1998027161A1 Thermosetting encapsulants for electronics packaging
06/25/1998WO1998027160A1 Thermally reworkable binders for flip-chip devices
06/25/1998DE19756227A1 Verfahren zum Bilden von Metall-Leitungen einer Halbleitervorrichtung A method for forming metal lines of a semiconductor device
06/25/1998DE19755675A1 Semiconductor housing with structure containing conductor parts for integrated circuit mfr.
06/25/1998DE19654504A1 Electrical testing of multiple ICs integrated esp. on semiconductor wafer
06/25/1998DE19654353A1 Montageanordnung eines Halbleiterbauelements auf einer Leiterplatte Device for mounting a semiconductor device on a circuit board
06/25/1998CA2275632A1 High density electrical connectors
06/25/1998CA2275523A1 Flip-chip type connection with elastic contacts
06/25/1998CA2275435A1 A via structure
06/25/1998CA2275366A1 Thermally reworkable binders for flip-chip devices
06/25/1998CA2275194A1 Die attach adhesive compositions
06/25/1998CA2274864A1 Thermosetting encapsulants for electronics packaging
06/24/1998EP0849983A1 Process to create metallic stand-offs on a circuit board
06/24/1998EP0849806A2 Improvements in or relating to semiconductor devices having tungsten nitride sidewalls
06/24/1998EP0849797A2 Improvements in or relating to intergrated circuits
06/24/1998EP0849796A2 Improvements in or relating to integrated circuits
06/24/1998EP0849795A2 Adhesive promotion of TAB/FLEX tape in a laminar electronic package contruction
06/24/1998EP0849794A1 Fine pitch lead frame
06/24/1998EP0849793A2 Improvements in or relating to integrated circuit device packages
06/24/1998EP0849786A2 Bonding pad structure for testing integrated circuits during manufacture
06/24/1998EP0849785A2 Method of making a self-aligned contact
06/24/1998EP0849784A2 A system for connecting a semiconductor device to a leadframe and a bonding support mechanism for a leadframe
06/24/1998EP0849675A2 Volatile memory chip with non-volatile memory locations for storing quality information
06/24/1998EP0849599A1 Apparatus for contacting semiconductor die
06/24/1998EP0849578A1 Evacuatable package and a method of producing the same
06/24/1998EP0792519A4 Interconnection elements for microelectronic components
06/24/1998EP0792517A4 Electrical contact structures from flexible wire
06/24/1998EP0792463A4 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
06/24/1998EP0729652A4 Contact structure for interconnections, interposer, semiconductor assembly and method
06/24/1998EP0705529A4 Method and apparatus for non-conductively interconnecting integrated circuits
06/24/1998CN1185892A Perimeter matrix ball grid array circuit package with a populated center
06/24/1998CN1185859A Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
06/24/1998CN1185661A Semi-conductor device with transistor to reduce leakage current and mfg. method thereof
06/24/1998CN1185656A Semi-conductor package structure and mfg. method thereof
06/24/1998CN1185655A Electronic package with compressible heat sink structure
06/24/1998CN1185654A Method for forming of semi-conductor device
06/24/1998CN1185652A Contacting structure in semiconductor integrated circuit and mfg. method thereof
06/24/1998CN1185635A Method for providing low-resistance electric interface to current-limiting polymer through plasma treatment
06/24/1998CN1185473A Liquid-state epoxy resin potting material
06/24/1998CN1038853C Alloy-gold thin wire for welding metal wire
06/23/1998US5771157 Chip-on-board printed circuit assembly using aluminum wire bonded to copper pads
06/23/1998US5771155 Spring clamp assembly for improving thermal contact between stacked electronic components
06/23/1998US5771153 CPU heat dissipating apparatus
06/23/1998US5770995 Semiconductor device
06/23/1998US5770981 Composite microwave circuit module having a pseudo-waveguide structure
06/23/1998US5770973 Semiconductor device for amplifying audio signals
06/23/1998US5770890 Using a thermal barrier to provide a hermetic seal surface on aluminum nitride substrate electronic packages
06/23/1998US5770889 Systems having advanced pre-formed planar structures
06/23/1998US5770888 Integrated chip package with reduced dimensions and leads exposed from the top and bottom of the package
06/23/1998US5770885 Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayers
06/23/1998US5770871 Sensor array with anticoupling layer between data lines and charge collection electrodes
06/23/1998US5770821 Submount
06/23/1998US5770816 Planar, hermetic metal matrix housing
06/23/1998US5770519 Copper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor device
06/23/1998US5770518 Forming one or more non-functional conductive lines, in the dielectric layer under the dense array of conductive lines
06/23/1998US5770517 Implanting inert species to amorphize surface of semiconductor substrate contact area exposed beneath via formed through interlevel dielectric prior to enhance bonding of subsequently deposited copper
06/23/1998US5770513 Method for producing semiconductor device with heat dissipation structure
06/23/1998US5770495 Refractory silicide film
06/23/1998US5770487 Method of manufacturing a device, by which method a substrate with semiconductor element and conductor tracks is glued to a support body with metallization
06/23/1998US5770483 Stacking transistors of doped polysilicon material separated by dielectric, interconnecting with conductors formed by etching short apertures between layers and filling with metal
06/23/1998US5770482 Multi-level transistor fabrication method with a patterned upper transistor substrate and interconnection thereto
06/23/1998US5770480 Method of leads between chips assembly
06/23/1998US5770479 Bonding support for leads-over-chip process
06/23/1998US5770478 Integral mesh flat plate cooling method
06/23/1998US5770476 Passive interposer including at least one passive electronic component
06/23/1998US5770469 Alternately vapor depositing heavily doped and lightly doped glass layers over wafer substrate while reflowing layers in heated chemical reactor
06/23/1998US5770468 Chemically reducing oxide layer found on uniformly electrodeposited solder film prior to positioning and soldering chip onto carrier without chip deformation
06/23/1998US5770467 Adhesion
06/23/1998US5770300 Multilayered metallic printed board and molded module
06/23/1998US5770096 Forming a plating film on a substrate, a photosensitive film covering the plating film, patternig the resists film by exposure of the film to light using a pattern of photo mask, developing, patterning plating film, etching the substrate
06/23/1998US5769521 Light source device and method of producing same
06/23/1998US5769158 For performing a heat transfer between external substances
06/23/1998US5768776 Method for forming a controlled impedance flex circuit
06/23/1998US5768774 For a solid state electronic component
06/23/1998US5768770 Electronic packaging shaped beam lead fabrication
06/19/1998CA2225212A1 Low resistance electrical interface for current limiting polymers by plasma processing
06/18/1998WO1998026476A1 Electrical connection with inwardly deformable contacts
06/18/1998WO1998026453A1 Chip module and manufacture of same
06/18/1998WO1998026452A1 High density integrated circuits and the method of packaging the same
06/18/1998DE19738151A1 IC assembly and dis-mounting system e.g. for burn-in procedure
06/18/1998DE19733627C1 Seal extruded by xyz robot for electromagnetic screening and physical sealing of electronics cabinets
06/18/1998DE19731944A1 Charge-carrier lifetimes determining circuit for semiconductor wafer
06/18/1998DE19702121C1 Vertical chip interconnection production
06/18/1998DE19652046A1 Temperature measuring method of semiconductor chip
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