Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2013
10/09/2013CN102723283B Etching-first and packaging-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
10/09/2013CN102723282B Etching-first and packaging-later manufacturing method for chip formal double-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit
10/09/2013CN102543963B Electronic static discharge (ESD) detection clamping circuit based on multi-stage current mirrors
10/09/2013CN102446893B Metal-oxide-metal capacitor
10/09/2013CN102244069B Semiconductor structure having concave part and manufacturing thereof
10/09/2013CN102222655B Chip adapter plate
10/09/2013CN102159058B Liquid-cooled radiation structure
10/09/2013CN101645436B Semiconductor device packages with electromagnetic interference shielding and forming method thereof
10/08/2013USRE44524 Bump-on-lead flip chip interconnection
10/08/2013US8554390 Free cooling solution for a containerized data center
10/08/2013US8554166 Methods of operating electronic devices, and methods of providing electronic devices
10/08/2013US8553409 System and method for portable information handling system parallel-wall thermal shield
10/08/2013US8552572 Resin composition for encapsulating semiconductor and semiconductor device using the same
10/08/2013US8552571 Electronic device and method for production
10/08/2013US8552568 Methods for forming three-dimensional memory devices, and related structures
10/08/2013US8552567 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
10/08/2013US8552566 Integrated circuit package having surface-mount blocking elements
10/08/2013US8552565 Chip package and method for forming the same
10/08/2013US8552564 Hybrid-core through holes and vias
10/08/2013US8552563 Three-dimensional semiconductor architecture
10/08/2013US8552562 Profiled contact for semiconductor device
10/08/2013US8552561 Semiconductor device with output circuit arrangement
10/08/2013US8552559 Very thick metal interconnection scheme in IC chips
10/08/2013US8552557 Electronic component package fabrication method and structure
10/08/2013US8552556 Wafer level fan out package
10/08/2013US8552555 Semiconductor device and a method of manufacturing the same
10/08/2013US8552554 Heat dissipation structure for electronic device and fabrication method thereof
10/08/2013US8552553 Semiconductor device
10/08/2013US8552552 Semiconductor device and a method of manufacturing the same
10/08/2013US8552551 Adhesive/spacer island structure for stacking over wire bonded die
10/08/2013US8552550 Semiconductor device
10/08/2013US8552549 Semiconductor device, and inspection method thereof
10/08/2013US8552548 Conductive pad on protruding through electrode semiconductor device
10/08/2013US8552547 Electronic device package and method for forming the same
10/08/2013US8552546 Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure
10/08/2013US8552545 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
10/08/2013US8552544 Package structure
10/08/2013US8552543 Semiconductor package
10/08/2013US8552542 Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device
10/08/2013US8552541 Power device packages having thermal electric modules using peltier effect and methods of fabricating the same
10/08/2013US8552540 Wafer level package with thermal pad for higher power dissipation
10/08/2013US8552539 Shielded package having shield lid
10/08/2013US8552538 Methods of eliminating pattern collapse on photoresist patterns
10/08/2013US8552537 Semiconductor device and method for fabricating the same
10/08/2013US8552536 Flexible integrated circuit device layers and processes
10/08/2013US8552534 Laminated semiconductor substrate, semiconductor substrate, laminated chip package and method of manufacturing the same
10/08/2013US8552528 Diode-less array for one-time programmable memory
10/08/2013US8552464 CMOS-compatible movable microstructure based devices
10/08/2013US8552436 Light emitting diode structure
10/08/2013US8552428 Power semiconductor device
10/08/2013US8552283 Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems
10/08/2013US8551892 Method for reducing dielectric constant of film using direct plasma of hydrogen
10/08/2013US8551877 Sidewall and chamfer protection during hard mask removal for interconnect patterning
10/08/2013US8551820 Routable single layer substrate and semiconductor package including same
10/08/2013US8551816 Direct edge connection for multi-chip integrated circuits
10/08/2013US8551814 Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing
10/08/2013US8551799 Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer
10/08/2013US8550639 Cover device for a micro-optomechanical component, and manufacturing method for such a cover device
10/08/2013CA2577681C Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material
10/03/2013WO2013148929A1 Interposer-based damping resistor
10/03/2013WO2013148102A1 Conduction cooling of multi-channel flip chip based panel array circuits
10/03/2013WO2013147884A1 INTEGRATED PACKAGE INSERTION AND LOADING MECHANISM (iPILM)
10/03/2013WO2013147856A1 Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (tsvs)
10/03/2013WO2013147808A1 Functional material systems and processes for package-level interconnects
10/03/2013WO2013147706A1 Multi-layer substrate for semiconductor packaging
10/03/2013WO2013147694A1 Method of providing a via hole and routing structure
10/03/2013WO2013147359A1 Semiconductor package and method for manufacturing same
10/03/2013WO2013147358A1 Semiconductor package and method for manufacturing same
10/03/2013WO2013147313A1 Method for preventing mutual adhesion of pellets for solar cell sealing materials
10/03/2013WO2013147240A1 Flow path member, and heat exchanger and semiconductor device using same
10/03/2013WO2013147229A1 Method for manufacturing thermally conductive sheet
10/03/2013WO2013147144A1 Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module
10/03/2013WO2013147142A1 Power module substrate, power module substrate with heat sink, and power module
10/03/2013WO2013147124A1 Power module substrate with heat sink, power module substrate with cooler, and power module
10/03/2013WO2013147121A1 Power module substrate with heat sink, and method for producing power module substrate with heat sink
10/03/2013WO2013147086A1 Curable resin composition, method for producing same, highly thermally conductive resin composition, and highly thermally conductive multilayer substrate
10/03/2013WO2013147044A1 Method for manufacturing hollow molded article, hollow molded article and manufacturing device
10/03/2013WO2013146881A1 Substrate for power module and manufacturing method therefor
10/03/2013WO2013146789A1 Sintered silicon nitride substrate and process for producing same
10/03/2013WO2013146646A1 Semiconductor laser device
10/03/2013WO2013146607A1 Sealing agent for semiconductor light emitting elements, cured film using same, and semiconductor light emitting device
10/03/2013WO2013146527A1 Curable epoxy resin composition
10/03/2013WO2013146404A1 White curable composition for optical semiconductor device, molded article for optical semiconductor device and optical semiconductor device
10/03/2013WO2013146334A1 Curable silicone composition, cured product thereof, and optical semiconductor device
10/03/2013WO2013146222A1 Composite metal hydroxide particles and resin composition containing same
10/03/2013WO2013145961A1 Curable heat radiation composition
10/03/2013WO2013145918A1 Power semiconductor module and power conversion device using same
10/03/2013WO2013145693A1 Cooling system, interior evaporation unit, and cartridge, and solid-state laser oscillatior equipped with all of same
10/03/2013WO2013145609A1 Epoxy resin composition for semiconductor sealing, cured body thereof, and semiconductor device
10/03/2013WO2013145608A1 Resin composition and semiconductor device
10/03/2013WO2013145532A1 Resin package
10/03/2013WO2013145390A1 Flexible printed circuit board and fabrication process for same
10/03/2013WO2013145260A1 Electronic device and method for manufacturing same
10/03/2013WO2013145139A1 Method for manufacturing electronic device
10/03/2013WO2013145043A1 Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package
10/03/2013WO2013144862A1 Electronic package for millimeter wave semiconductor dies
10/03/2013WO2013144801A1 Sealed semiconductor light emitting device.
10/03/2013WO2013144750A1 Photovoltaic module cooling devices
10/03/2013WO2013143724A1 Method for producing at least one contacting surface of an element and sensor for recording a directional component of a directed measured value
10/03/2013WO2013106050A3 Ultra-thin power transistor and synchronous buck converter having customized footprint
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