Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/1998
07/02/1998WO1998028962A1 Method and apparatus for arranging heat transport in connection with electrical components
07/02/1998WO1998028955A2 Microelectric assembly fabrication with terminal formation
07/02/1998WO1998028954A2 Semiconductor packages interconnectably mounted on underlying substrates and methods of producing same
07/02/1998WO1998028794A1 Direct contact die attach
07/02/1998WO1998028793A1 Interface structures for electronic devices
07/02/1998WO1998028791A1 Method and device for connecting a semiconductor component on a substrate provided with conductors
07/02/1998WO1998028790A1 Mounting arrangement for a semiconductor component on a printed circuit board
07/02/1998WO1998028788A1 Manufacture of semiconductor device
07/02/1998WO1998028787A1 Method and device for connecting electrical components to circuit boards
07/02/1998WO1998028786A2 Method of manufacturing a glass-covered semiconductor device and a glass-covered semiconductor device
07/02/1998WO1998028785A1 Methods for improving photoresist selectivity and reducing etch rate loading
07/02/1998WO1998028784A1 Integrated circuit electrode structure and process for fabricating same
07/02/1998DE19757850A1 Light emitting display element e.g. LED chip
07/02/1998DE19756234A1 Coolant enclosing arrangement for solar cell
07/02/1998DE19756179A1 Semiconductor chip lead frame
07/02/1998DE19755676A1 Guard ring production in IC device
07/02/1998DE19752637A1 Metallic wiring production for semiconductor device
07/02/1998DE19747105A1 Component with stacked semiconductor chips
07/02/1998DE19743767A1 Surface mountable semiconductor chip housing
07/02/1998DE19743766A1 Semiconductor chip housing
07/02/1998DE19743765A1 Semiconductor component mfg. with pattern preventing cracks
07/02/1998DE19733702A1 Semiconductor housing with two interconnected coolers for high power chips
07/02/1998DE19728183A1 Chip-size package production
07/02/1998DE19653782A1 Lead-on-chip type semiconductor component
07/02/1998DE19653053A1 Temperature stabilising circuit for bipolar switching transistor for current supply
07/02/1998CA2275724A1 Direct contact die attach
07/02/1998CA2275653A1 Method and device for connecting electrical components to circuit boards
07/02/1998CA2275648A1 Method and apparatus for arranging heat transport in connection with electrical components
07/02/1998CA2246989A1 Interface structures for electronic devices
07/02/1998CA2209709A1 Apparatus for heat removal using a flexible backplane
07/01/1998EP0851724A2 Printed circuit board and electric components
07/01/1998EP0851494A2 Semiconductor device having a protection circuit
07/01/1998EP0851492A2 Surface-mounted substrate structure and method
07/01/1998EP0851491A2 Semiconductor device having multilevel interconnection structure and manufacturing method thereof
07/01/1998EP0851490A2 Semiconductor device and process for production thereof
07/01/1998EP0851489A2 Improvements in or relating to integrated circuit devices
07/01/1998EP0851483A2 Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminium plug
07/01/1998EP0851482A2 In-situ capped aluminium plug (cap) process using selective CVD al for integrated plug/interconnect metallization
07/01/1998EP0851481A2 Method of making an encapsulated metal lead for multi-level interconnect
07/01/1998EP0851480A2 Stress-adjusted insulating film forming method, semiconductor device and method of manufacturing the same
07/01/1998EP0851476A2 Double mask hermetic passivation method providing enhanced resistance to moisture
07/01/1998EP0851471A2 Semiconductor device with two insulators of different dielectric constant and fabrication process thereof
07/01/1998EP0851463A1 Process for realizing an intermediate dielectric layer for enhancing the planarity in semiconductor electronic devices
07/01/1998EP0850489A1 Solder deposit support
07/01/1998EP0850440A1 Secure module with microprocessor and co-processor
07/01/1998EP0755619B1 An arrangement for shielding and/or cooling electronic components mounted on a circuit board
07/01/1998CN2285514Y Flow-guiding extrated ventilation type radiation cooling device for large power semiconductor device
07/01/1998CN1186588A Ground plane routing
07/01/1998CN1186570A Flexible leads for tape ball grid array circuit
07/01/1998CN1186342A Semiconductor device having protection circuit
07/01/1998CN1186340A Leading Frame and manufacture thereof, semiconductor device and manufacture thereof
07/01/1998CN1186339A Lead frame with pre-mold paddle for semiconductor chip package
07/01/1998CN1186338A Stacking type semiconductor chip package
07/01/1998CN1186127A Electrolytic silver stripping agent in lead frame manufacturing process
07/01/1998CN1186009A Soft solder and electronic component using the same
07/01/1998CN1038968C 高压截断半导体器件 High-voltage cut-off semiconductor devices
06/1998
06/30/1998US5774342 Electronic circuit with integrated terminal pins
06/30/1998US5774340 Planar redistribution structure and printed wiring device
06/30/1998US5774336 High-terminal conductivity circuit board
06/30/1998US5774335 Heat sink assembly with height adjustable mounting clip
06/30/1998US5774334 Low thermal resistant, fluid-cooled semiconductor module
06/30/1998US5774011 Antifuse circuit using standard MOSFET devices
06/30/1998US5773899 Bonding pad for a semiconductor chip
06/30/1998US5773898 Hybrid integrated circuit with a spacer between the radiator plate and loading portion of the IC
06/30/1998US5773897 Flip chip monolithic microwave integrated circuit with mushroom-shaped, solder-capped, plated metal bumps
06/30/1998US5773896 Semiconductor device having offsetchips
06/30/1998US5773895 Anchor provisions to prevent mold delamination in an overmolded plastic array package
06/30/1998US5773890 Overcoating with tungsten film
06/30/1998US5773889 Wire interconnect structures for connecting an integrated circuit to a substrate
06/30/1998US5773888 Semiconductor device having a bump electrode connected to an inner lead
06/30/1998US5773887 High frequency semiconductor component
06/30/1998US5773886 For semiconductor devices
06/30/1998US5773885 Thermally responsive compressive diode assembly
06/30/1998US5773884 Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
06/30/1998US5773882 Seminconductor package
06/30/1998US5773880 Non-contact IC card having insulated exposed leads
06/30/1998US5773879 Cu/Mo/Cu clad mounting for high frequency devices
06/30/1998US5773878 For a semiconductor die
06/30/1998US5773877 Plastic encapsulated IC package and method of designing same
06/30/1998US5773876 Lead frame with electrostatic discharge protection
06/30/1998US5773875 High performance, low thermal loss, bi-temperature superconductive device
06/30/1998US5773870 Membrane type integrated inductor and the process thereof
06/30/1998US5773869 Double density fuse bank for the laser break-link programming of an integrated circuit
06/30/1998US5773857 Semiconductor device having dummy wiring conductors for suppressing heat-treatment-induced shifting
06/30/1998US5773780 Method of severing bond wires and forming balls at their ends
06/30/1998US5773639 Layer forming material and wiring forming method
06/30/1998US5773533 Epoxy resin reacted with carboxy-functional phosphinic or phosphonic acid and hardener
06/30/1998US5773528 Photocurable, for electronics packaging
06/30/1998US5773371 Technique for forming resin-impregnated fiberglass sheets
06/30/1998US5773365 Fabrication process of semiconductor device
06/30/1998US5773362 Method of manufacturing an integrated ULSI heatsink
06/30/1998US5773344 Forming tungsten silicide
06/30/1998US5773323 Package for solid state image sensing device and method for manufacturing thereof
06/30/1998US5773322 Molded encapsulated electronic component
06/30/1998US5773321 Semiconductor integrated circuit devices having particular terminal geometry and mounting method
06/30/1998US5773320 Method for producing a power semiconductor module
06/30/1998US5773317 Test structure and method for determining metal-oxide-silicon field effect transistor fringing capacitance
06/30/1998US5773313 Semiconductor device and method of producing the same
06/30/1998US5773197 Positioning a substrate with dielectric layer on organic polysilane, heating, reacting and forming a lithographic patterned layer, coating with metal film and planarizing
06/30/1998US5773195 Printed circuits for electronic structures and circuit boards
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