| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/14/1998 | US5780364 Method to cure mobile ion contamination in semiconductor processing |
| 07/14/1998 | US5780354 Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material glued on a support wafer |
| 07/14/1998 | US5780323 Fabrication method for metal-to-metal antifuses incorporating a tungsten via plug |
| 07/14/1998 | US5780316 Linewidth control apparatus and method |
| 07/14/1998 | US5780314 Depositing first high temperature superconductive layer on first region and a portion of second region of substrate, a dielectric layer covering it, then second low temperature superconductive layer on second regionsecond |
| 07/14/1998 | US5780164 Computer disk substrate, the process for making same, and the material made therefrom |
| 07/14/1998 | US5780163 A protective covering to prevent examination and analysis by competitors comprising silica ceramic, a silicon carbide coating, an opaque material-filled porous silica ceramic, a metal layer and another opaque silica ceramic |
| 07/14/1998 | US5780162 Aluminum nitride substrate and method of producing the same |
| 07/14/1998 | US5779929 Multilayer of titanium, palladium or palladium-titanium alloy, and copper |
| 07/14/1998 | US5779492 Connector employing liquid conductor for electrical contact |
| 07/14/1998 | US5779134 Method for surface mounting a heatsink to a printed circuit board |
| 07/14/1998 | US5779081 For a semiconductor package |
| 07/14/1998 | US5778970 Heat dissipation apparatus |
| 07/14/1998 | US5778529 Method of making a multichip module substrate |
| 07/14/1998 | US5778523 Method for controlling warp of electronic assemblies by use of package stiffener |
| 07/14/1998 | US5778520 Method of making an assembly package in an air tight cavity and a product made by the method |
| 07/14/1998 | CA2121772C Power supply structure for multichip package |
| 07/09/1998 | WO1998030075A2 Method and arrangement for heating a component |
| 07/09/1998 | WO1998030073A1 Method and device for mounting electronic component on circuit board |
| 07/09/1998 | WO1998030072A1 Ceramic composite wiring structures for semiconductor devices and method of manufacture |
| 07/09/1998 | WO1998029906A1 Module with integrated circuit comprising a shaping device |
| 07/09/1998 | WO1998029903A1 Resin-encapsulated semiconductor device and method for manufacturing the same |
| 07/09/1998 | WO1998029899A2 Improved leadframe structure with locked inner leads and process for manufacturing same |
| 07/09/1998 | WO1998029669A2 Cooling using a cryogenic liquid and a contacting gas |
| 07/09/1998 | WO1998029261A1 Semiconductor device and method of manufacturing the same |
| 07/09/1998 | WO1998021751A3 Optimizing the power connection between chip and circuit board for a power switch |
| 07/09/1998 | DE19800178A1 Fire=proof epoxy] resin material for semiconductor encapsulation |
| 07/09/1998 | CA2275972A1 Ceramic composite wiring structures for semiconductor devices and method of manufacture |
| 07/08/1998 | EP0852457A2 Apparatus for heat removal using a flexible backplane |
| 07/08/1998 | EP0852399A1 Semiconductor element cooling apparatus |
| 07/08/1998 | EP0852398A1 Apparatus for heating and cooling an electronic device |
| 07/08/1998 | EP0852397A1 Cantilevered ball connection for integrated circuit chip package |
| 07/08/1998 | EP0852395A2 Method of multiplexed joining of solder bumps to a substrate during assembly of an integrated circuit package |
| 07/08/1998 | EP0852394A2 Method for making very shallow junctions in silicon devices |
| 07/08/1998 | EP0852067A1 Low rc interconnection |
| 07/08/1998 | EP0852065A1 Interconnect scheme for integrated circuits |
| 07/08/1998 | EP0852032A1 Single chip microprocessor, math co-processor, random number generator, real-time clock and ram having a one-wire interface |
| 07/08/1998 | EP0851994A1 Absorbent pair refrigeration system |
| 07/08/1998 | EP0779906B1 Epoxy resin mixtures for prepregs and composites |
| 07/08/1998 | EP0676091B1 Tab testing of area array interconnected chips |
| 07/08/1998 | CN2285934Y Element and device protector |
| 07/08/1998 | CN1187109A Fan attchment clip for heat sink |
| 07/08/1998 | CN1187103A Apparatus for heating and cooling electronic device |
| 07/08/1998 | CN1187039A Bottom lead frame and bottom lead semiconductor package using the same |
| 07/08/1998 | CN1187038A Bottom lead semiconductor package and fabrication method thereof |
| 07/08/1998 | CN1187037A Semiconductor package and method for fabricating same |
| 07/08/1998 | CN1187036A Method for producing semiconductor radiating body and specific mould |
| 07/08/1998 | CN1187035A Semiconductor chip package and method for fabricating the same |
| 07/08/1998 | CN1187034A Semiconductive ceramic |
| 07/08/1998 | CN1187030A Method for packaging integrated circuit |
| 07/08/1998 | CN1187029A 栅阵列球半导体封装 Ball grid array semiconductor package |
| 07/07/1998 | US5777886 Programmable lead conditioner |
| 07/07/1998 | US5777847 Multichip module having a cover wtih support pillar |
| 07/07/1998 | US5777392 Semiconductor device having improved alignment marks |
| 07/07/1998 | US5777391 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof |
| 07/07/1998 | US5777389 Semiconductor device including ohmic contact to-n-type GaAs |
| 07/07/1998 | US5777388 Semiconductor device of the type sealed in glass having a silver-copper bonding layer between slugs and connection conductors |
| 07/07/1998 | US5777387 Semiconductor device constructed by mounting a semiconductor chip on a film carrier tape |
| 07/07/1998 | US5777386 Semiconductor device and mount structure thereof |
| 07/07/1998 | US5777385 Ceramic ball grid array (CBGA) package structure having a heat spreader for integrated-circuit chips |
| 07/07/1998 | US5777384 Electronic device |
| 07/07/1998 | US5777383 Semiconductor chip package with interconnect layers and routing and testing methods |
| 07/07/1998 | US5777382 Plastic packaging for a surface mounted integrated circuit |
| 07/07/1998 | US5777381 Semiconductor devices method of connecting semiconductor devices and semiconductor device connectors |
| 07/07/1998 | US5777380 Nonpeeling connector & dielectric support |
| 07/07/1998 | US5777379 Semiconductor assemblies with reinforced peripheral regions |
| 07/07/1998 | US5777377 Bus bar having reduced parasitic inductances and equal current path lengths |
| 07/07/1998 | US5777374 Integrated circuit interconnect structure with back reflection suppressing electronic "speed bumps" |
| 07/07/1998 | US5777360 Hexagonal field programmable gate array architecture |
| 07/07/1998 | US5777351 Compression bonded type semiconductor element and semiconductor device |
| 07/07/1998 | US5777345 Multi-chip integrated circuit package |
| 07/07/1998 | US5777265 Electronic package for an integrated circuit |
| 07/07/1998 | US5777259 Oxygen-rich copper base layer joined to beryllium oxide layer |
| 07/07/1998 | US5776837 Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures |
| 07/07/1998 | US5776834 Bias plasma deposition for selective low dielectric insulation |
| 07/07/1998 | US5776831 Method of forming a high electromigration resistant metallization system |
| 07/07/1998 | US5776830 Process for fabricating connection structures |
| 07/07/1998 | US5776829 Method for forming multilevel interconnections in a semiconductor device |
| 07/07/1998 | US5776828 Reduced RC delay between adjacent substrate wiring lines |
| 07/07/1998 | US5776826 Crack stop formation for high-productivity processes |
| 07/07/1998 | US5776825 Method for forming a semiconductor device having reduced stepped portions |
| 07/07/1998 | US5776802 Semiconductor device and manufacturing method of the same |
| 07/07/1998 | US5776801 Leadframe having contact pads defined by a polymer insulating film |
| 07/07/1998 | US5776800 Paddleless molded plastic semiconductor chip package |
| 07/07/1998 | US5776799 Lead-on-chip type semiconductor chip package using an adhesive deposited on chip active surfaces at a wafer level and method for manufacturing same |
| 07/07/1998 | US5776798 Semiconductor package and method thereof |
| 07/07/1998 | US5776797 Three-dimensional flexible assembly of integrated circuits |
| 07/07/1998 | US5776796 Method of encapsulating a semiconductor package |
| 07/07/1998 | US5776791 Process for collective manufacture of chips with electrodes selectively covered by a deposit |
| 07/07/1998 | US5776786 Method for wire-bonding a covered wire |
| 07/07/1998 | US5776662 Multilayer electroconductive material, lamination and chips |
| 07/07/1998 | US5776599 Electronic coating materials using mixed polymers |
| 07/07/1998 | US5776406 Moldings of polyurethane hotmelt adhesives |
| 07/07/1998 | US5776255 Chemical vapor deposition apparatus |
| 07/07/1998 | US5776235 Thick opaque ceramic coatings |
| 07/07/1998 | US5775569 Method for building interconnect structures by injection molded solder and structures built |
| 07/07/1998 | US5775418 T-shaped locking member for engaging a passageway in a heat sink for securement to a mounting board |
| 07/07/1998 | US5775403 Incorporating partially sintered preforms in metal matrix composites |
| 07/07/1998 | US5774964 Apparatus for forming a profiled element |
| 07/03/1998 | WO1998033133A1 Method and apparatus for channel-routing of an electronic device |