| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/21/1998 | US5784258 Wiring board for supporting an array of imaging chips |
| 07/21/1998 | US5784257 Heatsink assembly with adjustable retaining clip |
| 07/21/1998 | US5784256 Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board |
| 07/21/1998 | US5784255 Device and method for convective cooling of an electronic component |
| 07/21/1998 | US5784254 Slide mount spring clamp arrangement for attaching an electrical component to a convector |
| 07/21/1998 | US5783868 Extended bond pads with a plurality of perforations |
| 07/21/1998 | US5783867 Repairable flip-chip undercoating assembly and method and material for same |
| 07/21/1998 | US5783866 Low cost ball grid array device and method of manufacture thereof |
| 07/21/1998 | US5783865 Wiring substrate and semiconductor device |
| 07/21/1998 | US5783864 Multilevel interconnect structure of an integrated circuit having air gaps and pillars separating levels of interconnect |
| 07/21/1998 | US5783862 Electrically conductive thermal interface |
| 07/21/1998 | US5783861 Semiconductor package and lead frame |
| 07/21/1998 | US5783860 Plastic molded package of an integrated circuit |
| 07/21/1998 | US5783857 Integrated circuit package |
| 07/21/1998 | US5783856 Method for fabricating self-assembling microstructures |
| 07/21/1998 | US5783847 Dual-mode micrometer/millimeter wave integrated circuit package |
| 07/21/1998 | US5783846 Digital circuit with transistor geometry and channel stops providing camouflage against reverse engineering |
| 07/21/1998 | US5783713 Flexibility, low chlorine content |
| 07/21/1998 | US5783499 Method for the fabrication of a semiconductor device |
| 07/21/1998 | US5783490 Photolithography alignment mark and manufacturing method |
| 07/21/1998 | US5783488 Optimized underlayer structures for maintaining chemical mechanical polishing removal rates |
| 07/21/1998 | US5783487 Method of coupling titanium to a semiconductor substrate and semiconductor device thereof |
| 07/21/1998 | US5783485 Process for fabricating a metallized interconnect |
| 07/21/1998 | US5783484 Forming base insulating layer having step coverage, forming first insulating layer, selectively etching, forming second insulating layer |
| 07/21/1998 | US5783483 Method of fabricating a barrier against metal diffusion |
| 07/21/1998 | US5783481 Semiconductor interlevel dielectric having a polymide for producing air gaps |
| 07/21/1998 | US5783466 Semiconductor device and method of manufacturing the same |
| 07/21/1998 | US5783465 Forming bonding pad on first element, depositing a layer of photodefinable polymer on the surface of second element, masking the polymer, exposing, developing the photodefinable layer to produce bumps, encasing with copper metal layer |
| 07/21/1998 | US5783464 Method of forming a hermetically sealed circuit lead-on package |
| 07/21/1998 | US5783463 Semiconductor device and method of producing said semiconductor device |
| 07/21/1998 | US5783461 Useful for testing semiconductor dice |
| 07/21/1998 | US5783426 Semiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the same |
| 07/21/1998 | US5783252 Technique for forming resin-impregnated fiberglass sheets |
| 07/21/1998 | US5783113 Conductive paste for large greensheet screening including high thixotropic agent content |
| 07/21/1998 | US5783036 Method for dry etching metal films having high melting points |
| 07/21/1998 | US5782292 Heat sink for an electronic component cooling apparatus |
| 07/21/1998 | US5781992 Heat sink for plastic casings |
| 07/16/1998 | WO1998031204A1 Printed wiring board and method of manufacturing the same |
| 07/16/1998 | WO1998031202A2 Integral lid/clamp for high power transistor |
| 07/16/1998 | WO1998031104A1 Pll oscillator and method for manufacturing the same |
| 07/16/1998 | WO1998031051A1 Semiconductor device and method for manufacturing the same |
| 07/16/1998 | WO1998031049A1 Laser based method and system for integrated circuit repair or reconfiguration |
| 07/16/1998 | WO1998031048A1 Semiconductor manufacturing without undercutting conductive lines |
| 07/16/1998 | WO1998031047A1 Semiconductor integrated circuit and system |
| 07/16/1998 | WO1998030913A2 A fiducial for aligning an integrated circuit die |
| 07/16/1998 | WO1998030878A1 Housing for semiconductor sensor arrangement and process for producing the same |
| 07/16/1998 | DE19742840A1 Overcurrent protection system e.g. for light-emitting diode (LED) for optical communications |
| 07/16/1998 | DE19701163A1 Electrical circuit with contact track layer especially for chip card |
| 07/16/1998 | DE19700432A1 Heat sink for electric and-or electronic component |
| 07/16/1998 | DE19700393A1 Gehäuse für Halbleiter-Sensoranordnung und Verfahren zu dessen Herstellung Enclosure for semiconductor sensor arrangement and method of producing the |
| 07/16/1998 | CA2222053A1 Circuit board adhesives for soldering environments |
| 07/15/1998 | EP0853358A2 Semiconductor laser module having improved metal substrate on Peltier element |
| 07/15/1998 | EP0853341A2 Semiconductor device and method of manufacturing the same |
| 07/15/1998 | EP0853340A2 Semiconductor package |
| 07/15/1998 | EP0853339A2 Improvements in or relating to integrated circuits |
| 07/15/1998 | EP0853337A1 Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device |
| 07/15/1998 | EP0853322A1 Low resistance electrical interface for current limiting polymers by plasma processing |
| 07/15/1998 | EP0853321A1 Conductor paste and multilayer ceramic part using the same |
| 07/15/1998 | EP0852897A1 Method for surface mounting a heatsink to a printed circuit board |
| 07/15/1998 | EP0852812A1 Semiconductor memory circuitry |
| 07/15/1998 | EP0852811A1 An integrated circuit package with permanent identification of device characteristics and method for adding the same |
| 07/15/1998 | EP0852810A1 Semiconductor component with insulating housing |
| 07/15/1998 | EP0852809A1 Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions |
| 07/15/1998 | EP0852774A1 Chip module |
| 07/15/1998 | EP0771473A4 Molded plastic semiconductor package including heat spreader |
| 07/15/1998 | EP0743929B1 Substrate of a ceramic material |
| 07/15/1998 | EP0662019A4 Method for making a ceramic metal composite. |
| 07/15/1998 | CN1187905A Smart electronic card chip coated with layer of insulating material and smart card comprising same |
| 07/15/1998 | CN1187876A Water evaporation type cooling apparatus by means of electrolytic reaction |
| 07/15/1998 | CN1187692A Wiring part and lead frame with same |
| 07/15/1998 | CN1187691A Semiconductor integrated circuit and its making method |
| 07/14/1998 | USRE35845 RF transistor package and mounting pad |
| 07/14/1998 | US5781445 Plasma damage monitor |
| 07/14/1998 | US5781412 Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size |
| 07/14/1998 | US5781411 For cooling an electronic component which generates heat |
| 07/14/1998 | US5781409 Heat dissipating lid hinge structure with laterally offset heat pipe end portions |
| 07/14/1998 | US5781388 Non-breakdown triggered electrostatic discharge protection circuit for an integrated circuit and method therefor |
| 07/14/1998 | US5781124 Electrically configurable connection matrix between lines of at least one input/output port for electrical signals |
| 07/14/1998 | US5781022 Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die |
| 07/14/1998 | US5780933 Substrate for semiconductor device and semiconductor device using the same |
| 07/14/1998 | US5780931 Surface mounting semiconductor device and semiconductor mounting component |
| 07/14/1998 | US5780930 Method for direct attachment of an on-chip bypass capacitor in an integrated circuit |
| 07/14/1998 | US5780928 Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices |
| 07/14/1998 | US5780927 Semiconductor device with long lifetime |
| 07/14/1998 | US5780926 Multichip package device having a lead frame with stacked patterned metallization layers and insulation layers |
| 07/14/1998 | US5780925 Lead frame package for electronic devices |
| 07/14/1998 | US5780924 Integrated circuit underfill reservoir |
| 07/14/1998 | US5780923 Semiconductor assembly |
| 07/14/1998 | US5780919 Electrically programmable interconnect structure having a PECVD amorphous silicon element |
| 07/14/1998 | US5780918 Semiconductor integrated circuit device having a programmable adjusting element in the form of a fuse mounted on a margin of the device and a method of manufacturing the same |
| 07/14/1998 | US5780910 Semiconductor integrated circuit device |
| 07/14/1998 | US5780908 An intermetallic layer sandwiched between the refractory metal film and nitrides barrier layer; nondiffusing, no leakage |
| 07/14/1998 | US5780882 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same |
| 07/14/1998 | US5780874 Process for forming fluorinated resin or amorphous carbon layer and devices containing same |
| 07/14/1998 | US5780872 Liquid crystal device, projection type color display device and driving circuit |
| 07/14/1998 | US5780870 Semiconductor device and a process of manufacturing the same |
| 07/14/1998 | US5780869 Semiconductor integrated circuit means comprising conductive protein on insulating film of calcium phosphate |
| 07/14/1998 | US5780840 Close contact type image sensor having integrally moded reflective surfaces |
| 07/14/1998 | US5780772 Integrated circuit package |
| 07/14/1998 | US5780366 Technique for forming resin-impregnated fiberglass sheets using multiple resins |