Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1998
08/04/1998CA2136581C Gallium oxide thin films
08/03/1998CA2228798A1 Heat exchanger for electronic components and electrotechnical apparatus
07/1998
07/30/1998WO1998033217A1 Semiconductor device and method for manufacturing thereof
07/30/1998WO1998033216A1 Method for producing vertical chip connections
07/30/1998WO1998033215A1 Semiconductor wafer fabrication of die-bottom contacts for electronic devices
07/30/1998WO1998033214A1 Semiconductor wafer fabrication of inside-wrapped contacts for electronic devices
07/30/1998WO1998033212A1 Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment
07/30/1998WO1998033210A1 Vibrating template method of placing solder balls on the i/o pads of an integrated circuit package
07/30/1998WO1998032893A2 Wafer support system
07/29/1998EP0855675A2 Radio frequency circuit and memory in thin flexible package
07/29/1998EP0855451A1 Wiring film, sputter target for forming the wiring film and electronic component using the same
07/29/1998EP0855090A1 Multichip module
07/29/1998EP0855089A1 Solderable transistor clip and heat sink
07/29/1998EP0854968A1 Microminiature stirling cycle cryocoolers and engines
07/29/1998EP0698293B1 Method of manufacturing a semiconductor component with supply terminals for high integration density
07/29/1998EP0563264B1 Leadless pad array chip carrier
07/29/1998CN1188987A Integrated circuit device and process for its manufacture
07/29/1998CN1188986A Integrated circuit device and process for its manufactur
07/29/1998CN1188985A Lead bending machine for electronic components
07/29/1998CN1188984A Metal substrate having IC chip and carrier mounting
07/29/1998CN1188983A Semiconductor package
07/28/1998US5787498 Integrated circuit memory with verification unit which resets an address translation register upon failure to define one-to-one correspondences between addresses and memory cells
07/28/1998US5787462 Configuration management system
07/28/1998US5787012 Integrated circuit with identification signal writing circuitry distributed on multiple metal layers
07/28/1998US5786988 Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture
07/28/1998US5786986 Multi-level circuit card structure
07/28/1998US5786985 Semiconductor device and semiconductor device unit
07/28/1998US5786979 High density inter-chip connections by electromagnetic coupling
07/28/1998US5786639 Wiring member and lead frame having the same
07/28/1998US5786638 Semiconductor device with moisture impervious film
07/28/1998US5786637 Interconnection with metal plug and reduced step
07/28/1998US5786636 Semiconductor device and method of fabricating same
07/28/1998US5786635 Electronic package with compressible heatsink structure
07/28/1998US5786634 Semiconductor device
07/28/1998US5786633 Semiconductor module having high insulating power and high thermal conductivity
07/28/1998US5786632 Semiconductor package
07/28/1998US5786631 For mounting an integrated circuit to a circuit board
07/28/1998US5786630 Multi-layer C4 flip-chip substrate
07/28/1998US5786629 3-D packaging using massive fillo-leaf technology
07/28/1998US5786628 Method and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packaging
07/28/1998US5786627 Integrated circuit device and fabricating thereof
07/28/1998US5786626 Thin radio frequency transponder with leadframe antenna structure
07/28/1998US5786625 Moisture resistant semiconductor device
07/28/1998US5786624 Semiconductor device
07/28/1998US5786613 Integrated overvoltage protection device having electrodes separated by a gas-filled cavity
07/28/1998US5786548 Hermetic package for an electrical device
07/28/1998US5786271 Production of semiconductor package having semiconductor chip mounted with its face down on substrate with protruded electrodes therebetween and semiconductor package
07/28/1998US5786268 Antifuses; gate arrays
07/28/1998US5786267 Method of making a semiconductor wafer with alignment marks
07/28/1998US5786260 Method of fabricating a readable alignment mark structure using enhanced chemical mechanical polishing
07/28/1998US5786240 Method for over-etching to improve voltage distribution
07/28/1998US5786239 Method of manufacturing a semiconductor package
07/28/1998US5786230 Method of fabricating multi-chip packages
07/28/1998US5786097 Assembly substrate and method of making
07/28/1998US5786075 Heat sinks and process for producing the same
07/28/1998US5785879 Concurrently firing ceramic and melting internal conductive powder
07/28/1998US5785871 Process for minute processing of diamonds
07/28/1998US5785800 Apparatus for forming cavity structures using thermally decomposable surface layer
07/28/1998US5785799 Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy
07/28/1998US5785791 Chemically grafting unsaturated monomers having pendant functional groups to metal substrates or connector frames yields protective coatings
07/28/1998US5785754 Excellent heat dissipating properties and high energy density
07/28/1998US5785535 Computer system with surface mount socket
07/28/1998US5785236 Advanced copper interconnect system that is compatible with existing IC wire bonding technology
07/28/1998US5785116 Method of removing heat from a heat source
07/28/1998US5784782 Method for fabricating printed circuit boards with cavities
07/28/1998US5784781 Manufacturing process for organic chip carrier
07/28/1998US5784780 Method of mounting a flip-chip
07/28/1998US5784774 IC socket jig
07/23/1998WO1998032175A1 Semiconductor device provided with a metallization with a barrier layer comprising at least titanium, tungsten, or nitrogen, and method of manufacturing same
07/23/1998WO1998032172A1 Electronic component
07/23/1998WO1998032171A1 Diamond body
07/23/1998WO1998032170A1 Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
07/23/1998WO1998032169A1 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
07/23/1998WO1998032167A1 Method for forming salient electrode, and method for wire bonding of semiconductor element
07/23/1998WO1998032159A2 Mounting structure and mounting process from semiconductor devices
07/23/1998WO1998032098A1 Chip card module
07/23/1998WO1998031738A1 Thermosetting resin compositions
07/23/1998WO1998020535A3 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
07/23/1998DE19757417A1 Integrated semiconductor circuitry on substrate for static RAM
07/23/1998DE19756569A1 Forming laminated ceramic substrate with conductive contacts on one main surface
07/23/1998DE19740534A1 Semiconductor device, especially DRAM, with multilevel connection structure
07/23/1998DE19701680A1 Diamantkörper Diamond body
07/23/1998DE19701164A1 Chip card with insulating layer in recess in vicinity of contact area
07/23/1998CA2278006A1 Mounting structure and mounting process from semiconductor devices
07/22/1998EP0854577A2 Semiconductor integrated circuit
07/22/1998EP0854513A2 Improvements in or relating to semiconductor device packaging
07/22/1998EP0854512A2 Integrated device for the microwave band
07/22/1998EP0854511A2 Resin sealing type semiconductor device
07/22/1998EP0854506A2 Electrically connecting member and electric circuit member
07/22/1998EP0854200A1 Copper-beryllium alloy
07/22/1998EP0854179A1 Circuit board adhesives for soldering environments
07/22/1998EP0853817A1 Electronic package with enhanced pad design
07/22/1998EP0739539B1 Process for filling contact holes
07/22/1998EP0726925B1 Electrically conductive adhesives
07/22/1998CN1188451A Semiconductor device
07/22/1998CN1188439A Solder and soldered electronic component and electronic circuit board
07/22/1998CN1188330A 电子元件 Electronic component
07/21/1998US5784264 MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form
07/21/1998US5784262 Arrangement of pads and through-holes for semiconductor packages
07/21/1998US5784260 Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate
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