Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1998
08/11/1998US5792286 High-strength thin plate of iron-nickel-cobalt alloy excellent in corrosion resisitance, repeated bending behavior and etchability, and production thereof
08/11/1998US5792271 System for supplying high-pressure medium gas
08/11/1998US5791485 For protecting an electronic unit
08/11/1998US5791406 Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
08/11/1998US5791403 Clamping device adapted for securing a heat sink to a CPU mount to hold down a CPU
08/11/1998US5791045 Process for the production of a diamond heat sink
08/11/1998CA2061522C Structure of semiconductor ic chip
08/10/1998WO1998044067A1 Circuit connecting material, and structure and method of connecting circuit terminal
08/06/1998WO1998034451A1 Methods and compositions for ionizing radiation shielding
08/06/1998WO1998034443A1 Printed wiring board and manufacturing method therefor
08/06/1998WO1998034285A1 Light emitting element, semiconductor light emitting device, and method for manufacturing them
08/06/1998WO1998034278A1 Lead frame material
08/06/1998WO1998034277A1 Improved leadframe structure with preplated leads and process for manufacturing the same
08/06/1998WO1998034276A1 Method and device for sealing ic chip
08/06/1998WO1998034272A1 Thin titanium film as self-regulating filter for silicon migration into aluminum metal lines
08/06/1998WO1998033645A1 Die adhesive or encapsulant of epoxy siloxane and polyepoxy resin
08/06/1998DE19704351A1 Lead frame, for subsequent chip mounting and bonding to chip housing
08/06/1998DE19703329A1 Power semiconductor module
08/06/1998CA2278838A1 Methods and compositions for ionizing radiation shielding
08/06/1998CA2251190A1 Method and device for sealing ic chip
08/05/1998EP0856889A2 Semiconductor device mount structure and semiconductor device mounting method
08/05/1998EP0856888A2 Cooling structure for multi-chip module
08/05/1998EP0856887A1 Process for forming a morphological edge structure to seal integrated electronic devices, and corresponding device
08/05/1998EP0856886A1 Process for forming an edge structure to seal integrated electronic devices, and corresponding device
08/05/1998EP0856884A2 Low temperature via and trench fill process by means of CVD of Cu followed by PVD of Cu
08/05/1998EP0856883A2 Method for forming a metal contact
08/05/1998EP0856556A2 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method
08/05/1998EP0856529A1 Electronic article having fluoropolymer thin film
08/05/1998EP0856199A1 Polymer stud grid array
08/05/1998EP0856198A1 Polymer stud-matrix housing for microwave circuit arrangements
08/05/1998EP0698288B1 Process for producing vertically connected semiconductor components
08/05/1998EP0539597B1 Liquid crystal module
08/05/1998CN2287341Y Wire lead for integrated circuit
08/05/1998CN1189920A Insulating film for use in semiconductor device
08/05/1998CN1189847A Use of silicone-modified epoxy resins as sealing compound for electrical working or electronic assemly
08/05/1998CN1189841A Epoxy resin compsn. for printed wiring board and laminated board produced with the use of the same
08/05/1998CN1189760A Printed circuit board and electronic components
08/05/1998CN1189702A Light emitting display element, method for connecting same to electric wiring substrate and method of manufacturing same
08/05/1998CN1189695A Integrated circuit and process for its manufacture
08/05/1998CN1189692A Interconnection system in semiconductor device
08/05/1998CN1189691A Semiconductor device and manufacturing method and testing method of same
08/05/1998CN1189690A Resin sealing type semiconductor device
08/05/1998CN1189689A Improved polytetrafluoroethyelen thin film chip carrier
08/05/1998CN1189686A Method for forming multilevel interconnects in semiconductor device
08/04/1998US5790417 For an integrated circuit semiconductor device
08/04/1998US5790386 High I/O density MLC flat pack electronic component
08/04/1998US5790384 Bare die multiple dies for direct attach
08/04/1998US5790380 Method for fabricating a multiple chip module using orthogonal reorientation of connection planes
08/04/1998US5790379 Surface complemental heat dissipation device
08/04/1998US5790378 High density integrated circuit package including interposer
08/04/1998US5790377 Electronic device
08/04/1998US5790376 Heat dissipating pad structure for an electronic component
08/04/1998US5790220 Liquid crystal display and method of fabricating same with a black resin film covered an exposed portion of the wiring region on the outside of the sealing layer
08/04/1998US5789853 Method of patterned eroding of a coating provided on a substrate
08/04/1998US5789820 Method for manufacturing heat radiating resin-molded semiconductor device
08/04/1998US5789819 Low dielectric constant material for electronics applications
08/04/1998US5789818 Structure with selective gap fill of submicron interconnects
08/04/1998US5789817 Electrical apparatus with a metallic layer coupled to a lower region of a substrate and a metallic layer coupled to a lower region of a semiconductor device
08/04/1998US5789816 Multiple-chip integrated circuit package including a dummy chip
08/04/1998US5789815 Three dimensional semiconductor package having flexible appendages
08/04/1998US5789813 Ball grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom
08/04/1998US5789812 Semiconductor package
08/04/1998US5789811 Surface mount peripheral leaded and ball grid array package
08/04/1998US5789810 Semiconductor cap
08/04/1998US5789809 Thermally enhanced micro-ball grid array package
08/04/1998US5789808 Semiconductor device structured to be less susceptible to power supply noise
08/04/1998US5789807 On-chip power distribution for improved decoupling
08/04/1998US5789806 Leadframe including bendable support arms for downsetting a die attach pad
08/04/1998US5789805 Semiconductor multi-chip module
08/04/1998US5789804 Contact agency interposed between IC and IC receptacle
08/04/1998US5789803 Semiconductor package
08/04/1998US5789796 Programmable anti-fuse device and method for manufacturing the same
08/04/1998US5789795 Methods and apparatus for fabricationg anti-fuse devices
08/04/1998US5789794 Fuse structure for an integrated circuit element
08/04/1998US5789791 Multi-finger MOS transistor with reduced gate resistance
08/04/1998US5789783 Multilevel metallization structure for integrated circuit I/O lines for increased current capacity and ESD protection
08/04/1998US5789770 Hexagonal architecture with triangular shaped cells
08/04/1998US5789764 Antifuse with improved antifuse material
08/04/1998US5789325 Coating electronic substrates with silica derived from polycarbosilane
08/04/1998US5789319 Method of dual masking for selective gap fill of submicron interconnects
08/04/1998US5789317 Low temperature reflow method for filling high aspect ratio contacts
08/04/1998US5789315 Eliminating metal extrusions by controlling the liner deposition temperature
08/04/1998US5789307 Method of separating electronic devices contained in a carrier
08/04/1998US5789280 Leadframe having secured outer leads, semiconductor device using the leadframe and method of making them
08/04/1998US5789279 Method and apparatus for electrically insulating heat sinks in electronic power devices
08/04/1998US5789278 Using electroconductive adhesive to join semiconductor die to substrate
08/04/1998US5789271 Method for fabricating microbump interconnect for bare semiconductor dice
08/04/1998US5789270 Integrated circuits
08/04/1998US5788855 Method of producing circuit board
08/04/1998US5788854 Methods for fabrication of thin film inductors, inductor networks, inductor/capactor filters, and integration with other passive and active devices, and the resultant devices
08/04/1998US5788767 Method for forming single sin layer as passivation film
08/04/1998US5788766 High thermal conductivity diamond layer
08/04/1998US5788526 Integrated circuit test socket having compliant lid and mechanical advantage latch
08/04/1998US5787976 For thermally coupling a heat source to a heat sink
08/04/1998US5787971 Multiple fan cooling device
08/04/1998US5787581 Methods of making semiconductor connection components with releasable load support
08/04/1998US5787580 Method for making radio-frequency module by ball grid array package
08/04/1998US5787578 Annealing, ultrasonic removal
08/04/1998US5787576 Method for dissipating heat from an integrated circuit
08/04/1998US5787575 Method for plating a bond finger of an intergrated circuit package
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