Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1998
08/19/1998CN1190792A Method for forming IC substrate package
08/19/1998CN1190790A Semiconductor substrate and method for making semiconductor device
08/19/1998CN1190643A Method for bonding diamond sustrate to at least one metal sbstrate
08/19/1998CN1039562C Semiconductor device and mfg. method thereof
08/18/1998US5796746 Device and method for testing integrated circuit dice in an integrated circuit module
08/18/1998US5796591 Direct chip attach circuit card
08/18/1998US5796589 Electronic package
08/18/1998US5796586 For use in a packaged semiconductor device
08/18/1998US5796584 Circuit module
08/18/1998US5796570 Electrostatic discharge protection package
08/18/1998US5796468 Apparatus used to align and mark wafers
08/18/1998US5796264 Apparatus for manufacturing known good semiconductor dice
08/18/1998US5796171 Integrated circuit
08/18/1998US5796170 Ball grid array (BGA) integrated circuit packages
08/18/1998US5796169 Structurally reinforced ball grid array semiconductor package and systems
08/18/1998US5796167 Semiconductor device with buried wiring layer and fabrication process thereof
08/18/1998US5796165 High-frequency integrated circuit device having a multilayer structure
08/18/1998US5796164 Packaging and interconnect system for integrated circuits
08/18/1998US5796163 In an integrated circuit package
08/18/1998US5796162 Frames locking method for packaging semiconductor chip
08/18/1998US5796160 Resin-sealed semiconductor device
08/18/1998US5796159 Thermally efficient integrated circuit package
08/18/1998US5796158 Lead frame coining for semiconductor devices
08/18/1998US5796147 Semiconductor device having a plurality of circuits driven by different power sources and formed on the same substrate
08/18/1998US5796127 High electron mobility transistor
08/18/1998US5796123 Semiconductor component mounted by brazing
08/18/1998US5796049 Electronics mounting plate with heat exchanger and method for manufacturing same
08/18/1998US5796038 Technique to produce cavity-up HBGA packages
08/18/1998US5795833 Method for fabricating passivation layers over metal lines
08/18/1998US5795825 Connection layer forming method
08/18/1998US5795823 Self aligned via dual damascene
08/18/1998US5795821 Process for improving the interface union among dielectric materials in an integrated circuit manufacture
08/18/1998US5795819 Integrated pad and fuse structure for planar copper metallurgy
08/18/1998US5795799 Method for manufacturing electronic apparatus sealed by concave molded resin enveloper
08/18/1998US5795796 Semiconductors
08/18/1998US5795422 Method for forming molded ceramic devices having embedded spiral coils
08/18/1998US5794839 Bonding material and bonding method for electric element
08/18/1998US5794687 Forced air cooling apparatus for semiconductor chips
08/18/1998US5794685 For dissipating heat from an electronic device
08/18/1998US5794684 Stacked fin heat sink construction and method of manufacturing the same
08/18/1998US5794607 Process for producing heat sink having good heat dissipating characteristics
08/18/1998US5794454 Cooling device for hard to access non-coplanar circuit chips
08/18/1998US5794330 Microelectronics unit mounting with multiple lead bonding
08/18/1998CA2120280C Method and apparatus for retention of a fragile conductive trace with a protective clamp
08/18/1998CA2059020C Polyimide multilayer wiring board and method of producing same
08/13/1998WO1998035540A1 A spring clip for mounting a heat sink to an electronic component
08/13/1998WO1998035441A1 Controllable switching device, system and method for operating a switching device, in particular for semiconductor power switches
08/13/1998WO1998035440A1 Arrangement and method for measuring a temperature
08/13/1998WO1998035382A1 Resin sealed semiconductor device and method for manufacturing the same
08/13/1998WO1998034749A1 Solder ball placement apparatus
08/13/1998DE19738152A1 Releasable mounting device for integrated circuit
08/13/1998DE19731424C1 Embedding metallic conductors into plastic composition
08/13/1998DE19704934A1 Electric component cooling rail with two coolant channels
08/13/1998CA2280505A1 Solder ball placement apparatus
08/13/1998CA2278514A1 A spring clip for mounting a heat sink to an electronic component
08/12/1998EP0858107A1 Heat exchanger for electronic components and electrotechnical apparatusses
08/12/1998EP0858106A1 Optoelectronic element module with peltier device
08/12/1998EP0858104A2 Method for forming multilevel interconnects in semiconductor device
08/12/1998EP0858100A1 Constant-temperature liquid-circulating apparatus
08/12/1998EP0857702A1 Method for producing ceramic substrate
08/12/1998EP0857357A1 A silicide agglomeration fuse device
08/12/1998EP0857355A1 A glass/metal package and method for producing the same
08/12/1998EP0834243A4 Photolithographically patterned spring contact
08/12/1998EP0765522B1 Memory test system
08/12/1998EP0750792B1 Cooling and screening device for an integrated circuit
08/12/1998CN1190260A Flip chip attachment
08/12/1998CN1190258A Bead array type integrated circuit package method and package part
08/12/1998CN1190256A Assembling and disassembling device and head for integrated circuit
08/11/1998US5793613 Heat-dissipating and supporting structure for a plastic package with a fully insulated heat sink for an electronic device
08/11/1998US5793608 Cooling system for enclosed electronic components
08/11/1998US5793588 Electrostatic discharge protection circuit
08/11/1998US5793272 Integrated circuit toroidal inductor
08/11/1998US5793118 Semiconductor device capable of accomplishing a high moisture proof
08/11/1998US5793116 Microelectronic packaging using arched solder columns
08/11/1998US5793115 Three dimensional processor using transferred thin film circuits
08/11/1998US5793113 Multilevel interconnection structure for semiconductor devices
08/11/1998US5793112 Multilevel embedded wiring system
08/11/1998US5793111 Barrier and landing pad structure in an integrated circuit
08/11/1998US5793110 Semiconductor device
08/11/1998US5793108 Semiconductor integrated circuit having a plurality of semiconductor chips
08/11/1998US5793107 Polysilicon pillar heat sinks for semiconductor on insulator circuits
08/11/1998US5793106 Semiconductor device
08/11/1998US5793105 Inverted chip bonded with high packaging efficiency
08/11/1998US5793104 Apparatus for forming electrical connections between a semiconductor die and a semiconductor package
08/11/1998US5793103 Insulated cube with exposed wire lead
08/11/1998US5793101 Package housing multiple semiconductor dies
08/11/1998US5793100 Lead frame for semiconductor device
08/11/1998US5793099 Semiconductor device
08/11/1998US5793098 Package including conductive layers having notches formed
08/11/1998US5793095 Custom laser conductor linkage for integrated circuits
08/11/1998US5793094 Methods for fabricating anti-fuse structures
08/11/1998US5793067 Semiconductor device
08/11/1998US5792984 Molded aluminum nitride packages
08/11/1998US5792706 Interlevel dielectric with air gaps to reduce permitivity
08/11/1998US5792695 Connecting two-layer electrode wiring film containing silicide and polysilicon(thick) films with impurity diffusing area while keeping contact resistance uniformly low, for electrically programmable read only memory computers
08/11/1998US5792677 Embedded metal planes for thermal management
08/11/1998US5792676 Method of fabricating power semiconductor device and lead frame
08/11/1998US5792673 For semiconductor surface coating films
08/11/1998US5792671 Method of manufacturing semiconductor device
08/11/1998US5792594 Metallization and termination process for an integrated circuit chip
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