Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1998
08/27/1998DE19707280A1 Klima- und korrosionsstabiler Schichtaufbau Climate and corrosion-stable layer structure
08/27/1998DE19704861A1 Temp. measurement arrangement, e.g. for contactless switch
08/26/1998EP0860882A2 Anti-tamper bond wire shield for an integrated circuit
08/26/1998EP0860881A2 Anti-tamper integrated circuit
08/26/1998EP0860880A2 Semiconductor device having improved interconnection pattern and method of manufacturing same
08/26/1998EP0860879A2 Multilevel interconnection in a semiconductor device and method for forming the same
08/26/1998EP0860878A2 An integrated circuit with programmable elements
08/26/1998EP0860877A2 Semiconductor device and method for producing thereof
08/26/1998EP0860875A2 Heat sink and information processor using heat sink
08/26/1998EP0860874A2 Heat sink and information processor using it
08/26/1998EP0860872A1 Wafer with opto-electronic circuits and test circuits, and method of testing said wafer
08/26/1998EP0860871A2 Method of manufacturing semiconductor device
08/26/1998EP0860863A2 A laminated structure of polysilicon and tungsten silicide and a method of forming the same
08/26/1998EP0860100A1 Electric component which can be mounted on the surface of a printed circuit board as well as a method of manufacturing such components
08/26/1998EP0860025A1 Antifuse structure and process for manufacturing the same
08/26/1998EP0860024A2 Circuit structure having a flip-mounted matrix of devices
08/26/1998EP0860023A1 A flip-chip assembly
08/26/1998EP0859993A2 Chip module
08/26/1998EP0859686A1 Fabricating interconnects and tips using sacrificial substrates
08/26/1998CN1191628A Carrier, semiconductor device, and method of their mounting
08/26/1998CN1191500A Ribbon-like core interconnection elements
08/26/1998CN1191462A Hand-off method in personal communication service system
08/26/1998CN1191393A Tape carrier and tape carrier device using the same
08/26/1998CN1191392A Multi-layer plated lead frame
08/26/1998CN1191391A Semiconductor device mount structure and semiconductor device mount method
08/26/1998CN1191390A Epoxy seal semiconductor device and its mfg. method
08/26/1998CN1191389A Semiconductor device, semiconductor device mounted appliance, and method of producing semiconductor device
08/26/1998CN1191388A Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof
08/26/1998CN1191384A Method for manufacturing low dielectric constant inter-level integrated circuit structure
08/25/1998US5798937 Method and apparatus for forming redundant vias between conductive layers of an integrated circuit
08/25/1998US5798909 Single-tiered organic chip carriers for wire bond-type chips
08/25/1998US5798652 Method of batch testing surface mount devices using a substrate edge connector
08/25/1998US5798571 Inductance reduced wire-bonding type semiconductor device
08/25/1998US5798570 Plastic molded semiconductor package with thermal dissipation means
08/25/1998US5798569 Tungsten film wiring conductor fills inside the contact hole with no void therfore has high reliability and low film stress
08/25/1998US5798568 Semiconductor component with multi-level interconnect system and method of manufacture
08/25/1998US5798567 Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors
08/25/1998US5798566 Ceramic IC package base and ceramic cover
08/25/1998US5798565 For integrating diced integrated circuits
08/25/1998US5798563 Polytetrafluoroethylene thin film chip carrier
08/25/1998US5798562 Semiconductor device having an isolation layer and two passivation layers with edges that are not aligned with each other
08/25/1998US5798559 Integrated circuit structure having an air dielectric and dielectric support pillars
08/25/1998US5798557 Packaged integrated circuit
08/25/1998US5798554 MOS-technology power device integrated structure and manufacturing process thereof
08/25/1998US5798553 Trench isolated FET devices, and method for their manufacture
08/25/1998US5798469 Firing first material, cooling first and second material, removing second material which will not fuse to first
08/25/1998US5798400 Epoxy resin compound
08/25/1998US5798301 Method of manufacturing metal interconnect structure for an integrated circuit with improved electromigration reliability
08/25/1998US5798299 Stacking, etching, opening via hole, forming via interconnect
08/25/1998US5798298 Method of automatically generating dummy metals for multilevel interconnection
08/25/1998US5798297 Method for producing a semiconductor component with electrical connection terminals for high integration density
08/25/1998US5798292 Method of forming wafer alignment patterns
08/25/1998US5798287 Method for forming a power MOS device chip
08/25/1998US5798285 Method of making electronic module with multiple solder dams in soldermask window
08/25/1998US5798282 Semiconductor stack structures and fabrication sparing methods utilizing programmable spare circuit
08/25/1998US5798171 Insulating laminate comprising thermally conducting adhesive layer, unfilled polymeric film layer, second thermally conducting adhesive layer
08/25/1998US5798050 Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate
08/25/1998US5798014 Methods of making multi-tier laminate substrates for electronic device packaging
08/25/1998CA2121712C Multi-layer wiring board and a manufacturing method thereof
08/20/1998WO1998036454A1 Integrated circuit having a parasitic resonance filter
08/20/1998WO1998036453A1 Antifuse based on silicided polysilicon bipolar transistor
08/20/1998WO1998036450A1 Semiconductor device and method for manufacturing and mounting thereof, and circuit board mounted with the semiconductor device
08/20/1998WO1998036448A1 Method for making a structured metallization for a semiconductor wafer
08/20/1998WO1998036447A1 Method for forming a structured metallization on a semiconductor wafer
08/20/1998WO1998036305A1 Electronic or optoelectronic housing with ceramic insert
08/20/1998DE19806334A1 Semiconductor device production
08/20/1998DE19805930A1 Cooling arrangement for electrical component with heat convection line
08/20/1998DE19801488A1 Semiconductor component with heat transfer material
08/20/1998DE19745040A1 Temp. measurement arrangement, e.g. for contactless switch
08/20/1998DE19732028A1 Apparatus for production of three-dimensional stacked electronic components
08/20/1998DE19716674A1 Semiconductor component with two or more chips for multiple switch
08/20/1998DE19707325A1 Testing component(s) on wafer using capacitive probe
08/20/1998DE19705745A1 Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer A method of forming a structured metallization on a semiconductor wafer
08/20/1998DE19704343A1 Assembly method for semiconductor components
08/20/1998CA2214192A1 Articles for semiconductor industry
08/19/1998EP0859444A2 Circuit for electrostatic discharge (ESD) protection
08/19/1998EP0859414A1 Semiconductor power device
08/19/1998EP0859411A2 Semiconducor device of surface-mount type, circuit board having such a semiconductor device mounted thereon, and a method of producing such a semiconductor device
08/19/1998EP0859410A2 Composite material for heat sinks for semiconductor devices and method for producing the same
08/19/1998EP0859409A2 Method of manufacturing diamond heat sink
08/19/1998EP0859408A2 Heat sink material for use with a semiconductor component and fabrication method thereof
08/19/1998EP0859407A2 Method of fabrication of a copper containing structure in a semiconductor device
08/19/1998EP0859406A2 Permanently mounted reference sample for a substrate measurement tool
08/19/1998EP0859378A1 Emi preventive part and active device with the same
08/19/1998EP0858675A1 Antifuse structure and process for manufacturing the same
08/19/1998EP0858578A1 Liquid cooled heat sink for cooling electronic components
08/19/1998EP0858433A1 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board
08/19/1998EP0792497B1 Active security device with electronic memory
08/19/1998EP0719453A4 Flip chip in metal electronic packages
08/19/1998EP0578410B1 Programmable die identification circuits
08/19/1998CN1191062A Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board
08/19/1998CN1191040A Wrie bond tape ball grid array package
08/19/1998CN1191019A Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
08/19/1998CN1190810A Photoelectric element module with Peltier device
08/19/1998CN1190799A Manufacturing of electronic module
08/19/1998CN1190798A Semiconductor and making method thereof
08/19/1998CN1190797A Radiation sheet for doing over again and replacing of lead-wire bonding chip and package structure thereof
08/19/1998CN1190796A Inorganic package layer for sealing organic layer and making method thereof
08/19/1998CN1190795A Semiconductor assembly adopting single layer ceramic substrate chip
08/19/1998CN1190793A Method and device for checking IC device shell pin
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