| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/08/1998 | US5804288 A fired metal oxide layer comprising manganese for reducing porosity |
| 09/08/1998 | US5804086 Structure having cavities and process for producing such a structure |
| 09/08/1998 | US5803343 Solder process for enhancing reliability of multilayer hybrid circuits |
| 09/08/1998 | US5803340 Formulation has chip mount reflow temperature that is higher than the corresponding bumping reflow temperature; suitable for high temperature applications yet can be deposited using dry film photoresist masking methods |
| 09/08/1998 | US5803246 Surface package type semiconductor package and method of producing semiconductor memory |
| 09/08/1998 | US5802707 Controlled bondline thickness attachment mechanism |
| 09/08/1998 | US5802699 Methods of assembling microelectronic assembly with socket for engaging bump leads |
| 09/05/1998 | CA2199239A1 Electronic unit |
| 09/03/1998 | WO1998038683A1 Weather and corrosion-resistant layer structure |
| 09/03/1998 | WO1998038679A1 An integrated circuit having a planar inductor |
| 09/03/1998 | WO1998038678A1 Semiconductor module |
| 09/03/1998 | WO1998038676A1 Method and arrangement for attaching a component |
| 09/03/1998 | WO1998038466A1 Spring clip for attaching an electronic component to a heat sink and an assembly utilizing the same |
| 09/03/1998 | WO1998038248A1 Process for coating mouldings with polyester resin compounds or solutions |
| 09/03/1998 | WO1998028955A3 Microelectric assembly fabrication with terminal formation |
| 09/03/1998 | WO1998028786A3 Method of manufacturing a glass-covered semiconductor device and a glass-covered semiconductor device |
| 09/03/1998 | CA2282644A1 Spring clip for attaching an electronic component to a heat sink and an assembly utilizing the same |
| 09/03/1998 | CA2282412A1 Process for coating mouldings with polyester resin compounds or solutions |
| 09/02/1998 | EP0862218A1 An improved-q inductor with multiple metalization levels |
| 09/02/1998 | EP0862217A2 Semiconductor device and semiconductor multi-chip module |
| 09/02/1998 | EP0862216A2 Planar dielectric integrated circuit |
| 09/02/1998 | EP0862215A2 Planar dielectric integrated circuit |
| 09/02/1998 | EP0862214A1 An integrated circuit having a planar inductor |
| 09/02/1998 | EP0862213A2 Semiconductor apparatus, circuit board and combination thereof |
| 09/02/1998 | EP0862212A2 A tape carrier package |
| 09/02/1998 | EP0862211A2 Semiconductor apparatus and method for fabricating the same |
| 09/02/1998 | EP0862210A2 Heat dissipating assembly |
| 09/02/1998 | EP0862209A2 Process for manufacturing a metal-ceramic substrate and metal-ceramic substrate |
| 09/02/1998 | EP0862205A1 Heat-resistant adhesive |
| 09/02/1998 | EP0862134A2 Chip card and fabrication method |
| 09/02/1998 | EP0861503A1 Semiconductor interlayer staggered contact structure |
| 09/02/1998 | EP0861479A1 Method for determining an encryption key associated with an integrated circuit |
| 09/02/1998 | EP0771423B1 Three axis packaging |
| 09/02/1998 | EP0670103B1 Local hardening method of an adhesive for a semiconductor integrated circuit |
| 09/02/1998 | CN2290114Y Heat pipe radiator for three-inch thyristor |
| 09/02/1998 | CN1192050A Semiconductor devices |
| 09/02/1998 | CN1192049A Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD |
| 09/02/1998 | CN1192048A Semiconductor chip package having combined structure of lead-on-chip leads and standard normal leads |
| 09/02/1998 | CN1192047A Semiconductor device and method for production thereof |
| 09/02/1998 | CN1192046A Lead frame, semiconductor device, and process for manufacturing semiconductor device |
| 09/02/1998 | CN1192041A Method of manufacturing semiconductor device |
| 09/02/1998 | CN1192040A Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD |
| 09/01/1998 | US5801936 Semiconductor module for a power conversion device |
| 09/01/1998 | US5801927 Ceramic package used for semiconductor chips different in layout of bonding pads |
| 09/01/1998 | US5801538 Test pattern group and a method of measuring an insulation film thickness utilizing the same |
| 09/01/1998 | US5801452 Multi chip module including semiconductor wafer or dice, interconnect substrate, and alignment member |
| 09/01/1998 | US5801451 Semiconductor device including a plurality of input buffer circuits receiving the same control signal |
| 09/01/1998 | US5801450 Variable pitch stagger die for optimal density |
| 09/01/1998 | US5801449 Process and substrate for connecting an integrated circuit to another substrate by means of balls |
| 09/01/1998 | US5801447 Flip chip mounting type semiconductor device |
| 09/01/1998 | US5801446 Microelectronic connections with solid core joining units |
| 09/01/1998 | US5801444 Multilevel electronic structures containing copper layer and copper-semiconductor layers |
| 09/01/1998 | US5801443 Semiconductor device with short circuit prevention and method of manufacturing thereof |
| 09/01/1998 | US5801442 Microchannel cooling of high power semiconductor devices |
| 09/01/1998 | US5801441 Microelectronic mounting with multiple lead deformation and bonding |
| 09/01/1998 | US5801440 Substrate for an integrated circuit package |
| 09/01/1998 | US5801439 Semiconductor device and semiconductor device unit for a stack arrangement |
| 09/01/1998 | US5801438 Semiconductor device mounting and multi-chip module |
| 09/01/1998 | US5801437 Three-dimensional warp-resistant integrated circuit module method and apparatus |
| 09/01/1998 | US5801436 Lead frame for semiconductor device and process for producing the same |
| 09/01/1998 | US5801435 Resin sealing type semiconductor device and method of making the same |
| 09/01/1998 | US5801434 TAB tape and semiconductor device including TAB tape |
| 09/01/1998 | US5801433 Semiconductor device with smaller package |
| 09/01/1998 | US5801432 Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes |
| 09/01/1998 | US5801431 Enclosed in a plastic housing |
| 09/01/1998 | US5801429 Semiconductor device |
| 09/01/1998 | US5801425 Semiconductor device having a wiring layer including a TISI2, film of the C49 or C54 structure |
| 09/01/1998 | US5801422 Hexagonal SRAM architecture |
| 09/01/1998 | US5801421 Electrostatic discharge protection circuit |
| 09/01/1998 | US5801419 High frequency MOS device |
| 09/01/1998 | US5801394 Structure for wiring reliability evaluation test and semiconductor device having the same |
| 09/01/1998 | US5801101 Method of forming metal wirings on a semiconductor substrate by dry etching |
| 09/01/1998 | US5801099 Method for forming interconnection of semiconductor device |
| 09/01/1998 | US5801095 Production worthy interconnect process for deep sub-half micrometer back-end-of-line technology |
| 09/01/1998 | US5801091 Method for current ballasting and busing over active device area using a multi-level conductor process |
| 09/01/1998 | US5801090 Chemical mechanical polishing |
| 09/01/1998 | US5801086 Process for formation of contact conductive layer in a semiconductor device |
| 09/01/1998 | US5801080 Method of manufacturing semiconductor substrate having total and partial dielectric isolation |
| 09/01/1998 | US5801076 Method of making non-volatile memory device having a floating gate with enhanced charge retention |
| 09/01/1998 | US5801074 Method of making an air tight cavity in an assembly package |
| 09/01/1998 | US5801073 Net-shape ceramic processing for electronic devices and packages |
| 09/01/1998 | US5801072 Method of packaging integrated circuits |
| 09/01/1998 | US5801068 Hermetically sealed microelectronic device and method of forming same |
| 09/01/1998 | US5800958 For integrated circuits; enhanced thermal characteristics |
| 09/01/1998 | US5800906 Label for semiconductor wafer |
| 09/01/1998 | US5800874 Technique for forming resin-impregnated fiberglass sheets |
| 09/01/1998 | US5800761 Method of making an interface layer for stacked lamination sizing and sintering |
| 09/01/1998 | US5800205 Contact mechanism for IC testing |
| 09/01/1998 | US5800194 IC socket |
| 09/01/1998 | US5800193 Electronic component connector |
| 09/01/1998 | US5800185 Adapter for use with an electrical component |
| 08/27/1998 | WO1998037166A1 Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 08/27/1998 | WO1998037165A1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 08/27/1998 | WO1998037134A1 Low-cost high-performance no-flow underfills for flip-chip applications |
| 08/27/1998 | WO1998037133A1 Low temperature method and compositions for producing electrical conductors |
| 08/27/1998 | WO1998036888A1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 08/27/1998 | WO1998036887A1 Aerosol method and apparatus for making particulate products |
| 08/27/1998 | WO1998030075A3 Method and arrangement for heating a component |
| 08/27/1998 | DE19707514A1 Halbleitermodul Semiconductor module |
| 08/27/1998 | DE19707492A1 Verfahren zum Beschichten von Formkörpern mit Polyesterharzmassen oder -lösungen Process for coating moldings with polyester resin compositions or solutions |